氧化钽基RRAM的循环耐受特性优化研究

阻变存储器(RRAM)因其性能优异、可高密度集成以及与CMOS工艺兼容成本较低等众多优点而被广泛研究.用于制备阻变型存储器的关键材料有很多种,其中氧化钽材料由于与标准CMOS工艺兼容而被各大研究机构广泛关注,但TaOx基RRAM存储阵列的可靠性仍存在很大问题,尤其是循环耐受特性.本文制备了4种具有优秀阻变性能的双层Ta2O5/TaOxRRAM器件,Ta2O5层厚度分别为5nm和3nm,TaOx层的x值分别为1.0和0.7.比较了这4种拥有不同器件参数的氧化钽基RRAM器件的循环耐受性能,给出了TaOx基RRAM的循环耐受性能优化方法,发现双层TaOxRRAM的富氧Ta2O5层的厚度越薄且缺氧TaOx层的缺氧程度越大,其循环耐受性能越好.     

阻变存储器研究进展

阻变存储器(Resistive Random Access Memory,RRAM)是最具应用前景的下一代非易失性存储器之一,与传统浮栅闪存相比在器件结构、速度、可微缩性、三维集成潜力等方面都具有明显的优势,本文对RRAM技术进行了综述.首先简单介绍了阻变存储器的工作原理、技术优势、发展历程和面临的基础科学问题.然后深入总结了RRAM的材料体系,包括固态电解质、多元金属氧化物、二元金属氧化物3类传统的阻变介质材料,总结了纳米线、二维材料等低维纳米材料在RRAM运用方面的近期研究进展,分析了绝缘/导电的低维材料分别用作阻变介质、平面电极层/纳米电极/侧边电极、界面插层所带来的微缩性、阻变性能和稳定性等的改善效果.总结和分析了细丝型电阻转变的3类物理机制:热化学机制(Thermochemical Mechanism,TCM)、电化学金属化(Electrochemical Metallization,ECM)机制、化合价变化机制(Valence Change Mechanism,VCM),详细分析了3种机制的SET/RESET转变原理和基本电学特性、透射电镜观测关键实验验证、对阻变机制的认识发展过程等.在阻变机制分析的基础上,接着阐述了RRAM电阻转变过程中由于纳米尺度下材料微观结构和能带结构的变化导致的一些新奇的物理现象,包括量子效应、磁电效应、光电效应等.最后针对RRAM实现应用的关键——集成技术,总结分析了存储阵列架构、二维/三维集成等关键问题及其研究进展.     

基于Cu_xSi_yO阻变材料的RRAM抗总剂量辐照性能

研究了基于CuxSiyO结构的阻变式随机存储器(RRAM)的抗总剂量辐照能力.存储器芯片置于钴源辐照室内,通过60 Co释放出的γ射线模拟空间辐照环境.在辐照总剂量达到3 000Gy的条件下,单元仍然可以保持原有的存储信息,高低阻态的阻值、写电压、良率等性能几乎没有任何衰减.良好的辐照特性使得RRAM有望在抗辐射领域中得到广泛应用.     

过渡性金属氧化物薄膜阻变存储材料进展概况

随着半导体技术和集成电路的进步,器件的集成度也不断提高,器件的特征尺寸不断减小,基于电荷存储的传统非易失性随机存储器面临着物理和技术上极限的挑战。阻变式存储器（RRAM）作为新一代的存储器件,因其器件具有结构简单、制备简便、存储密度高、擦写速度快、写入电流小等优势引起了人们广泛的研究。本文就目前基于过度氧化物薄膜的RRAM研究概况,从RRAM的基本工作原理、材料体系、存储机理和器件应用所面临的各种困难等方面对RRAM进行了简要评述。     

An overview of the switching parameter variation of RRAM

Resistive random access memory（RRAM） has been considered as one of the most promising candidates for next-generation nonvolatile memory, due to its advantages of simple device structure, excellent scalability, fast operation speed and low power consumption. Deeply understanding the physical mechanism and effectively controlling the statistical variation of switching parameters are the basis of fostering RRAM into commercial application. In this paper, based on the deep understanding on the mechanism of the formation and rupture of conductive filament, we summarize the methods of analyzing and modeling the statistics of switching parameters such as SET/RESET voltage, current, speed or time. Then, we analyze the distributions of switching parameters and the influencing factors. Additionally, we also sum up the analytical model of resistive switching statistics composed of the cell-based percolation model and SET/RESET switching dynamics. The results of the model can successfully explain the experimental distributions of switching parameters of the Ni O- and Hf O2-based RRAM devices. The model also provides theoretical guide on how to improve the uniformity and reliability such as disturb immunity. Finally, some experimental approaches to improve the uniformity of switching parameters are discussed.     

具有低功耗和多值存储性能的双层WO_X/AlON阻变存储器的研究

针对当前阻变存储器(RRAM)面临的功耗和高密度存储的问题,介绍了一种降低功耗和形成多值存储能力的器件结构.相比单层结构的AlON RRAM,双层结构的WOX/AlON RRAM具有低至10μA的复位(reset)电流,1 000次以上的转换特性(endurance),较低的操作电压,以及多值存储等性能.针对WOX/AlONRRAM,提出了WOX介质层的等效电路模型为固定电阻与二极管串联模型.在直流置位(DC set)过程中,电路中存在一个较大的过冲电流,使得无法通过控制限流来获得不同大小的低阻态.在增加WOX介质层后,在WOX层和AlON层间形成了界面肖特基势垒,因此有效地抵抗了过冲电流,提高了低阻态的可控性.     

基于非易失性存储器的存储系统技术研究进展

 非易失性存储器（NVM）主要包括两类,即适用于外存的、块寻址的闪存和适用于内存的、字节寻址的持久性内存。相比于传统磁盘,闪存具有性能高、能耗低和体积小等优势;相比于DRAM（动态随机存储器）,持久性内存如PCM（相变存储器）、RRAM（阻变存储器）等,具有非易失、存储密度高以及同等面积/内存插槽下能给多核环境的CPU 提供更多的数据等优点,这些都为存储系统的高效构建带来了巨大的机遇。然而,传统存储系统的构建方式不适用于非易失性存储器,阻碍了其优势的发挥。为此,分析了基于非易失性存储器构建存储系统的挑战,从闪存、持久性内存两个层次分别综述了它们在存储体系结构、系统软件以及分布式协议方面的变革,总结了基于非易失性存储器构建存储系统的主要研究方向。     

VoIP终端存储系统设计

介绍了VoIP终端SoC的架构,采用片内存储器、存储器控制器、SSRAM、SDRAM及FLASH组成VoIP终端硬件平台的存储系统.分析了两种存储器控制器方案的优缺点.提出一种采用集成方式的存储器控制器结构.利用Verilog HDL设计了该存储器控制器IP,并给出访问SDRAM的仿真结果.存储系统已成功应用于VoIP SoC项目中.     

铁电薄膜及铁电存储器研究

综述了铁电薄膜以及铁电存储器的发展,讨论了铁电薄膜制备方法、结构和物理性能表征,并结合作者的前期工作,详细讨论了用于铁电薄膜与硅衬底集成的导电阻挡层问题,指出了铁电薄膜研究中需重点解决的一些问题.     

基于ZigBee的无线通信模块与串行存储器接口方法的研究

设计了采用ZigBee无线通信网络构建货运列车检修数据采集系统,分析了该模块集成SPI接口的工作原理,介绍了JN5121模块和串行存储芯片AT45DB081B的接口方法与软硬件实现,并在此基础上讨论了存储芯片的读写原理以及实现方法。     

Approaches for improving the performance of filament-type resistive switching memory

Resistive random access memory (RRAM) has received significant research interest because of its promising potential in terms of down-scaling,high density,high speed and low power. However,its endurance,retention and uniformity are still imperfect. In this article,the physical mechanisms of filament-type RRAM and the approaches for improving the switching performance,including doping,process optimization and interface engineering,are introduced.     

Improving the electrical performance of resistive switching memory using doping technology

In this paper, improvements of resistive random access memory (RRAM) using doping technology are summarized and analyzed. Based on a Cu/ZrO2/Pt device, three doping technologies with Ti ions, Cu, and Cu nanocrystal, respectively, are adopted in the experiments. Compared to an undoped device, improvements focus on four points: eliminating the electroforming process, reducing operation voltage, improving electrical uniformity, and increasing device yield. In addition, thermal stability of the high resistance state and better retention are also achieved by the doping technology. We demonstrate that doping technology is an effective way of improving the electrical performance of RRAM.     

Enhanced resistive switching properties of HfAlOx/ZrO2- based RRAM devices

Resistive Random-Access Memory (RRAM) devices are recognized as potential candidates for next-generation memory devices, due to their smallest cell size, high write/erase speed, and endurance. Particularly, the resistive switching (RS) characteristics in oxide materials have offered new opportunities for developing CMOS-compatible high-density RRAM devices. In this study, the RS behavior of HfAlO_x/ZrO₂ thin films sandwiched structure between TiN bottom electrode and Au top electrodes were investigated. It was found that Au/HfAlO_x/ZrO₂/TiN stacks were superior in terms of RS performance when compare to Au/HfAlO_x/TiN memory stacks. The devices demonstrated a good resistance ratio of high resistance state and low resistance state ～10³ for Au/HfAlO_x/TiN and ～10⁵ for Au/HfAlO_x/ZrO₂/TiN stacks, respectively. Both stacks showed good retention characteristics (>10⁴ ?s) and endurance (>10³ cycles). The experimental current-voltage characteristics fitted with different conducting mechanisms, the linear lower bias region is dominated by ohmic conductivity, whereas the non-linear higher bias region was dominated by space-charge limited current conduction mechanism.     

An overview of resistive random access memory devices

With recent progress in material science, resistive random access memory (RRAM) devices have attracted interest for nonvolatile, low-power, nondestructive readout, and high-density memories. Relevant performance parameters of RRAM devices include operating voltage, operation speed, resistance ratio, endurance, retention time, device yield, and multilevel storage. Numerous resistive-switching mechanisms, such as conductive filament, space-charge-limited conduction, trap charging and discharging, Schottky Emission, and Pool-Frenkel emission, have been proposed to explain the resistive switching of RRAM devices. In addition to a discussion of these mechanisms, the effects of electrode materials, doped oxide materials, and different configuration devices on the resistive-switching characteristics in nonvolatile memory applications, are reviewed. Finally, suggestions for future research, as well as the challenges awaiting RRAM devices, are given.     

NiO_x阻变存储器性能增强方法及相关机理研究

通过精确控制在Pt衬底上制备NiOx薄膜的工艺过程,制备出阻值窗口增大5倍以上,高低阻态稳定的TiN/NiOx/Pt结构阻变存储器.研究发现,NiOx薄膜的多晶态结晶结构和化学组分,尤其是Ni元素的化学态,是影响NiOx阻变存储器阻值窗口和稳定性的主要因素.X射线光电子能谱和X射线多晶体衍射测试结果表明,当NiOx薄膜中间隙氧或Ni2+空位增多时,Ni2+会被氧化成为Ni3+以保持电中性,Ni3+离子在材料中引入空穴导致P型氧化物NiO的漏电流增大.基于此机理,提出通过提高淀积温度、降低氧气分压的方法抑制NiOx薄膜中间隙氧或Ni2+空位的产生,降低TiN/NiOx/Pt结构阻变存储器关态漏电流,增大阻值窗口.这种基于工艺的性能增强方法,在NiOx阻变存储器实际应用中有良好前景.     

一种阻变存储单元Hspice模型设计

提出一种满足新型双通道阻变存储器读写操作要求的Hspice模型.这种模型基于新的机理,即通过改变一块1 Mb阻变存储阵列的一个单元中2种可重配置的稳定电阻存储模式实现＂RESET态＂和＂SET态＂之间的转换,它可以通过一个模拟电流-电压特性的分立器件模型来验证.与传统阻变存储器模型相比,利用这种模型,可以用较少的器件准...     

Approaches for improving the performance of filament-type resistive switching memory

Resistive random access memory (RRAM) has received significant research interest because of its promising potential in terms of down-scaling, high density, high speed and low power. However, its endurance, retention and uniformity are still imperfect. In this article, the physical mechanisms of filament-type RRAM and the approaches for improving the switching performance, including doping, process optimization and interface engineering, are introduced.