SiGe合金氧化层中的纳米结构

我们在硅锗合金衬底上采用氧化等制膜方式生成零维和三维的纳米结构样品，用高精度椭偏仪(HPE)、卢瑟福背散射谱仪(RBS)和高分辨率扫描透射电子显微镜(HR-STEM)测量样品的纳米结构。并采用美国威思康新州立大学开发的Rump模拟软件对卢瑟福背散射谱(RBS)中的CHANNEL谱和RANDOM谱分别进行精细结构模拟。计算且测量出纳米氧化层与锗的纳米薄膜结构分布，并且反馈控制加工过程。优化硅锗半导体材料纳米结构样品的加工条件。我们在硅锗合金的氧化层表面中首次发现纳米锗量子点和量子层结构，我们首次提出的生成硅锗纳米结构的优化加工条件的氧化时间和氧化温度的匹配公式和理论模型与实验结果拟合得很好。     

硅锗合金氧化层中纳米结构的量子受限分析

在硅锗合金氧化层中发现锗纳米表层结构，并分析了其时应的PL谱结构。提出相对应的量子受限模型计算公式和算法，理论分析结果与实验结果拟合较好。     

硅锗合金氧化纳米结构的光致发光谱

首次发现硅锗合金氧化纳米结构中的锗纳米层的PL谱(5410A波长处的谱峰),采用量子受限模型分析PL谱结构得到的计算方法和结果与实验拟合较好.     

氧化生成的锗纳米结构的量子受限分析

研究了硅锗合金的氧化行为，首次发现快氧化生成的锗纳米膜复盖在氧化层上。在PL谱中，我们发现与锗纳米结构相关的一些新的谱峰。量子受限模型和新的算法被给出，较好地解释了PL谱的分布和形成机理。     

Growth of Ge Layer on Relaxed Ge-Rich SiGe by Ultrahigh Vacuum Chemical Vapor Deposition

The paper describes the growth of a germanium (Ge) film on a thin relaxed Ge-rich SiGe buffer. The thin Ge-rich SiGe buffer layer was achieved through a combination of ultrahigh vacuum chemical vapor deposition (UHVCVD) SiGe epitaxial growth and SiGe oxidation. A lower Ge content strained SiGe layer was first grown on the Si (001) substrate and then the Ge mole fraction was increased by oxidation. After removal of the surface oxide, a higher Ge content SiGe layer was grown and oxidized again. The Ge mole fraction was increased to 0.8 in the 50 nm thick SiGe layer. Finally a 150 nm thick pure Ge film was grown on the SiGe buffer layer using the UHVCVD system. This technique produces a much thinner buffer than the conventional compositionally graded relaxed SiGe method with the same order of magnitude threading dis- location density.     

非晶/微晶相变区硅基薄膜太阳能电池研究进展

综述了非晶/微晶相变区硅基薄膜的微观结构、光电特性及其在太阳能电池中的应用进展.稳定优质的宽带隙初始晶硅薄膜处于非晶/微晶相变区的非晶硅一侧,其相比于非晶硅具有更高的中程有序性和更低的光致衰退特性.低缺陷密度的窄带隙纳米晶硅薄膜处于非晶/微晶相变区的微晶硅一侧,有效钝化的纳米硅晶粒具有较高的载流子迁移率和较好的长波响应特性.基于上述相变区硅薄膜材料的叠层电池已经达到13.6%的稳定转换效率.掺锗制备的硅锗薄膜可进一步降低薄膜的带隙宽度,引入相变区硅锗合金薄膜后,三结叠层电池初始效率已经达到16.3%,四结叠层太阳能电池理论效率可以超过20%.     

Characterization of ultrathin SiO 2/Si interface grown by low temperature plasma oxidation

Ultrathin SiO 2 layers on Si (100) wafers were prepared by plasma oxidation at a low temperature (250℃). The analyses of X-ray photoelectron spectroscopy (XPS) and TEM reveal that the chemical composition of the oxide layer is stoichiometric SiO 2 and the SiO 2/Si interface is abrupt. The thickness of the ultrathin oxide layer obtained from XPS, capacitance-voltage (C-V) and ellipsometry measurements indicate a nonlinear time dependence. The high frequency C-V characterization of MOS structure shows that the fixed charge density in SiO 2 film is about 10 11 cm -2 . It is also shown that the strength of breakdown electrical field of SiO 2 film with 6 nm thickness is of the order of 10 6 Vcm -1 . These properties of the ultrathin SiO 2 layer ensure its application in silicon quantum devices.     

Si_（83）Ge_（17）/Si压应变衬底上HfAlO_x栅介质薄膜微结构、界面反应和介电性能研究

本文研究了射频磁控溅射沉积在p-Si83Ge17/Si（100）压应变衬底上HfAlOx栅介质薄膜的微结构及其界面反应,表征了其各项电学性能,并与相同制备条件下沉积在p-Si（100）衬底上薄膜的电学性能进行了对比研究.高分辨透射电子显微镜观测与X射线光电子能谱深度剖析表明600°C高温退火处理后,HfAlOx薄膜仍保持非晶态,但HfOx纳米微粒从薄膜中分离析出,并与扩散进入膜内的Ge,Si原子发生界面反应生成了富含Ge原子的HfSiOx和HfSix的混合界面层.相比在相同制备条件下沉积在Si（100）衬底上的薄膜样品,Si83Ge17/Si（100）衬底上薄膜的电学性能大幅提高：薄膜累积态电容增加,有效介电常数增大（～17.1）,平带电压减小,？1V栅电压下漏电流密度J减小至1.96×10？5A/cm2,但电容-电压滞后回线有所增大.Si83Ge17应变层抑制了低介电常数SiO2界面层的形成,从而改善了薄膜大部分电学性能;但混合界面层中的缺陷导致薄膜界面捕获电荷有所增加.     

嵌入SiO2薄膜中的GeO和Ge纳米晶光致发光的研究

作者通过离子注入法得到了镶嵌于SiO2薄膜中的Ge纳米晶,并通过系统的氧化性或还原性退火处理,以改变样品中Ge的氧化物成分组成．分析了不同样品在室温下的光致发光(PL)特性,并结合XRD分析表明：300与400nm附近的荧光峰的发光机制是GeO(nc-GeO)纳米晶发光,而不是GeO的缺陷发光;570nm附近的荧光峰的发光机制为Ge纳米晶(nc-Ge)发光,而不是Ge及Si界面的缺陷发光．     

HV/CVD Grown Relaxed SiGe Buffer Layers for SiGe HMOSFETs

High-vacuum/chemical-vapor deposition (HV/CVD) system was used to grow relaxed SiGe buffer layers on Si substrates. Several methods were then used to analyze the quality of the SiGe films. X-ray diffraction and Raman spectroscopy showed that the upper layer was almost fully relaxed. Second ion mass spectroscopy showed that the Ge compositions were step-graded. Transmission electron microscopy showed that the misfit dislocations were restrained to the graded SiGe layers. Tests of the electrical properties of tensile-strained Si on relaxed SiGe buffer layers showed that their transconductances were higher than that of Si devices. These results verify the high quality of the relaxed SiGe buffer layer. The calculated critical layer thicknesses of the graded Si1-xGex layer on Si substrate and a Si layer on the relaxed SiGe buffer layer agree well with experimental results.     

对向靶磁控溅射纳米氧化钒薄膜的热氧化处理

采用直流对向靶磁控溅射方法制备低价态纳米氧化钒薄膜,研究热氧化处理温度和时间对氧化钒薄膜的组分、结构和电阻温度特性的影响采用X射线光电子能谱（XPS）、X射线衍射（XRD）和原子力显微镜（AFM）对氧化钒薄膜的组分、结晶结构和微观形貌进行分析,利用热敏感系统对薄膜的电阻温度特性进行测量．结果表明,经300～360℃热处理后,氧化钒薄膜的组分逐渐由V2O3和VO向VO2转变,薄膜由非晶态变为单斜金红石结构,具有金属半导体相变性能;增加热处理温度后,颗粒尺寸由20nm增大为100nm,薄膜表面变得致密,阻碍氧与低价态氧化钒的进一步反应,薄膜内VO2组分舍量的改变量不大;增加热处理时间后,薄膜内VO2组分的含量明显增加,相变幅度超过2个数量级.     

不同退火条件对纳米Ge/Al2O3相嵌薄膜中纳米Ge颗粒的氧化态影响

采用脉冲激光沉积法制备了纳米Ge/Al2O3相嵌薄膜.用X射线光电子谱(XPS)研究了薄膜的热稳定性.结果表明纳米Ge颗粒的氧化态与已经发表的结果不同,而与Si的氧化态的结果相似.用纯高斯函数拟合可以得到Ge的四种不同的氧化态,分别为:Ge 1,Ge 2,Ge 3,Ge 4.这种大的差别来自纳米Ge颗粒的不同环境的影响.在真空退火条件下,由于缺少外部氧的供给和供给速度慢,很奇妙地,在薄膜表层的Ge 2,Ge 4氧化态不如其他氧化态和未氧化态(Ge0)稳定.而在清洁的大气环境退火条件下,外部氧的供给充分和供给速度快,在薄膜表层最稳定的氧化态是Ge 4.     

Fabrication of high quality strained SiGe on Si substrate by RPCVD

In this study,the growth kinetics of SiGe in a reduced pressure chemical vapor deposition system using dichlorosilane(SiH2Cl2) and germane(GeH4) as the Si and Ge precursors were investigated.The SiGe growth rate and Ge content were found to depend on the deposition temperature,GeH4 flow and reactor chamber pressure.The SiGe growth rate escalates with increasing deposition temperature,while the Ge content is reduced.The SiGe growth rate accelerates with increasing GeH4 flow,while the Ge content increases more slowly.According to the experimental data,a new relationship between Ge content(x) and F(GeH4)/F(SiH2Cl2) mass flow ratio is deduced:x2.5/(1x) = nF(GeH4)/F(SiH2Cl2).The SiGe growth rate and Ge content improve with increasing reactor chamber pressure.By selecting proper precursor flows and reactor pressure,SiGe films with the same Ge content can be fabricated at various temperatures.However,the quality of the SiGe crystals is clearly dependent on the deposition temperature.At lower deposition temperature,higher crystalline quality is achieved.Because the growth rate dramatically drops with lower temperatures,the optimum growth temperature must be a compromise between the crystalline quality and the growth rate.X-ray diffraction,Raman scattering spectroscopy and atomic force microscopy results indicate that 650°C is the optimum temperature for fabrication of Si0.75Ge0.25 film.     

纳米硅的拉曼散射和可见光致发光

我们用射频共溅射技术和后退火处理,获得在石英、Si和Ge衬底上的纳米晶Si(nc-Si) Raman测量清楚地显示出nc-Si的类Lo模(～518cm-1)和类To模(～814cm-1),Raman峰的半高宽(FWHM)和积分强度也显示随退火温度Ta增加的变化,这一结果同nc-Ge/SiO2的情况类同,退火温度Ta=650℃时,nc-Si的平均尺寸为4.9nm 我们用514.5nm的Ar+激光激发,得到了室温可见PL,结果表明:PL谱在2.2eV处有一强的发光峰,与nc-Ge/SiO2相比,SiO2中nc-Si的PL峰更强,峰值能量较大,相应的Ta也较高,当Ta>800℃和Ta<600℃时,PL峰很弱 通过地研究膜中nc-Si的含量与PL峰之间的关系,表明nc-Si的含量对PL峰的积分强度有重要影响,对峰位影响不大,当Si/SiO2靶面积比为1∶1时,PL峰最强     

铜镀层对IC引线框架表面抗氧化失效的作用

研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响.研究发现,电镀纯铜层后,纯铜层氧化速率较高,氧化膜较厚,然而,由于纯铜层的阻挡作用,可以使氧化只发生在纯铜层上,减少CuO的生成.当铜合金表面的电镀纯铜层厚度超过一个临界值,表面电镀纯铜处理可以明显改善材料的耐氧化剥离性.表面电镀前的铜合金氧化膜结构为CuO/Cu2O/Cu.电镀纯铜层后,氧化膜结构变为Cu2O/Cu,当氧化膜主要由Cu2O构成时,氧化膜结合强度较高.     

硅基钠米材料发光特性的研究进展

近年，硅基低维材料物理与工艺的研究预示，硅基光电子学将是今后半导体光电子学的一个主要发展方向，而硅基低维发光材料又将成为半导体光电子集成技术的主要基础材料。随着硅基超晶格、量子阱和多孔硅研究的不断深化以及纳米科学技术的日益发展，硅基发光材料正向纳米方向开拓。本文将主要介绍硅基纳米材料，如采用各种成膜技术在不同衬底表面上制备的高质量纳米硅（ｎｃ－Ｓｉ：Ｈ）膜，镶嵌在各种介质，如　－Ｓｉ：Ｈ、ＳｉＯ２或ＳｉＮｘ中的纳米晶硅，以及利用自组织生长的Ｇｅ、Ｓｉ以及ＧｅＳｉ纳米量子点的光致发光特性及其最近研究进展。     

Evolution of insoluble eutectic Si particles in anodic oxidation films during adipic-sulfuric acid anodizing processes of ZL114A aluminum alloys

The effects of insoluble eutectic Si particles on the growth of anodic oxide films on ZL114A aluminum alloy substrates were investigated by optical microscopy (OM) and scanning electron microscopy (SEM). The anodic oxidation was performed at 25℃ and a constant voltage of 15 V in a solution containing 50 g/L sulfuric acid and 10 g/L adipic acid. The thickness of the formed anodic oxidation film was approximately 7.13 μm. The interpore distance and the diameters of the major pores in the porous layer of the film were within the approximate ranges of 10-20 nm and 5-10 nm, respectively. Insoluble eutectic Si particles strongly influenced the morphology of the anodic oxidation films. The anodic oxidation films exhibited minimal defects and a uniform thickness on the ZL114A substrates; in contrast, when the front of the oxide oxidation films encountered eutectic Si particles, defects such as pits and non-uniform thickness were observed, and pits were observed in the films.     

高浓度弛豫SiGe/SOI材料的制备研究

对SOl（绝缘体上的硅）衬底上外延生长的SiGe层进行了研究，并利用透射电镜、AES、Raman光谱、X-ray多晶衍射等技术对SiGe／SOI材料做了表征。结果表明：制备的材料中Ge／Si元素分布均匀，SiGe层是高度弛豫的，SiGe层中应变通过产生失配位错被释放出来。     

锗/氧化硅纳米多层膜的电致黄光发射研究

通过射频磁控溅射法制备了锗/氧化硅纳米多层薄膜.测量到了来自Au/锗/氧化硅纳米多层膜/p-Si结构的电致黄光发射,并发现该纳米结构具有整流特性.     

一种制备SiO2膜的方法——氧等离子体处理聚硅烷涂层

作者利用低温氧等离子体处理聚硅烷涂层，成功地制备了SiO2膜．由IR谱给出的Si-O键的吸收峰波数，随氧等离子体处理时间的不同在1065～1088cm-1范围变化；XPS谱给出Si2p的结合能为103．3～103．5eV，硅氧原子比为1：1．99；激光椭园偏振仪测得折射率在1．30～1．55范围；MOS电容的高频C-V特性曲线表明，平带电压为正，计算得氧化物电荷的电性为负，密度为6．6×1010～8．8×1011cm-2，其大小可以通过改变处理条件进行控制；BT实验表明，可动电荷密度为(3～6)×1010cm-2，这种新型的SiO2膜可望在微电子器工艺中得到应用．