退火方式对纳米FeCoPd/SiO_2复合薄膜结构和磁性的影响

采用溶胶—凝胶旋涂法,通过氢气还原及快速退火两种方式在Si(100)基片上获得纳米Fe Co Pd/Si O2复合薄膜,并对其进行了X射线衍射仪(XRD)和振动样品磁强计(VSM)表征分析,进一步研究不同退火方式对纳米Fe Co Pd/Si O2复合薄膜样品结构和磁性能的影响.结果表明,经过氢气还原处理后,薄膜中的Fe Co具有较强的(200)择优取向,且薄膜的矫顽力较小,表现出较好的软磁特性.     

多铁性La0.7Sr0.3MnO3/PMN-PT复合薄膜的制备及表征

采用溶胶-凝胶法在Pt/Ti/SiO2/Si基片上制备了La0.7Sr0.3MnO3/PMN-PT(LSMO/PMN-PT)复合薄膜,利用X射线衍射(XRD)、原子力显微镜(AFM)、铁电性能综合测试仪、振动样品磁强计(VSM)对样品的结构、表面形貌以及铁电性能、磁性进行了分析.结果表明,LSMO/PMN–PT复合薄膜750℃退火处理后,所有X射线衍射峰均为样品特征峰,无扩散现象,没有新相生成;薄膜表面平整、致密、颗粒分布均匀;复合薄膜表现出了明显的铁电和铁磁性能.     

不同Co底层厚度对FeCo(001)取向的影响

用磁控溅射法在Si(100)基片上沉积不同厚度的Co底层,在Co层上先用溶胶-凝胶(sol-gel)法旋涂原始溶液,再经H2还原获得FeCo/SiO_2薄膜,并用X射线衍射仪测试样品的晶体结构,由振动样品磁强计(VSM)表征薄膜的磁性质.结果表明:随着Co底层厚度的增大,FeCo的晶面取向由(110)逐渐转变为(200);当Co底层厚度为10nm时,I(200)/I(110)值最大,即FeCo(200)择优取向最强,同时薄膜平行膜面的饱和磁化强度最大,矫顽力最小,即Co厚度增加有利于改善薄膜的软磁特性.     

Co_(1-x)Mg_xFe_2O_4薄膜的制备及其磁性研究

采用溶胶—凝胶旋涂法在Pt/Ti/SiO2/Si基片上制备了Co1-xMgxFe2O4(x=0,0.05,0.10,0.15)薄膜材料.利用X射线衍射仪、扫描电子显微镜和振动样品磁强计对样品的结构、形貌、膜厚和磁性进行了研究.讨论了Mg含量对复合薄膜的结构、晶粒尺寸和磁性的影响.结果表明,薄膜为立方尖晶石结构,CMFO薄膜表面光滑平整,晶粒排列紧密.薄膜表现出良好的铁磁性,适量的掺杂Mg2+离子可明显改善钴铁氧体的磁性,随着Mg含量的增加,饱和磁化强度先增加后减小,矫顽力呈现逐渐减小趋势.     

La_(1-x)Ca_xMnO_3薄膜的制备及结构和磁性研究

采用溶胶-凝胶旋涂法在表面氧化的Si(100)基片上制备了La1-xCaxMnO3(x=0,0.1,0.15)薄膜.利用X射线衍射(XRD)、原子力显微镜(AFM)、扫描电镜(SEM)及振动样品磁强计(VSM)对样品的结构、形貌和磁性进行了研究.结果表明:薄膜为正交钙钛矿结构,具有平整的表面,La0.85Ca0.15MnO3样品的薄膜厚度为334nm.样品在居里温度附近发生铁磁-顺磁转变,随着Ca2+掺杂浓度的增加,样品的居里温度变大,x=0.15时,样品的居里温度为299K.     

NixCu1-x复合团簇镶嵌薄膜的微结构和磁特性

用直流磁控溅射的方法在室温Si基片上制备体积百分比分别为5%,10%,20%,40%的系列Ni Cu磁性复合团簇镶嵌薄膜样品,并利用X射线衍射技术、振动样品磁强计等方法对团簇的微结构和磁性能进行了测试研究。微结构分析表明:薄膜呈多晶状态,晶体结构仍为面心立方,随着Ni组份的增加,复合团簇膜的晶粒尺寸与平均晶格常数均减小。磁性分析表明:所有样品均表现出铁磁性,随着Ni百分比含量的增加,矫顽力Hc减小,饱和磁化强度MS增加,磁性逐渐增强,且尺寸效应明显。     

退火温度对Ti0.975Co0.025O2薄膜样品的结构和磁性的影响

采用溶胶—凝胶法在Si表面通过浸渍提拉制备了Ti0.975Co0.025O2薄膜样品,并在空气氛围下以不同温度对样品进行退火处理.利用差热/热重综合热分析仪(TG-DTA)、X射线衍射仪(XRD)、扫描射电镜(SEM)和振动样品磁场计(VSM)对薄膜样品的结构和磁性进行研究.实验结果表明,薄膜的二维结构提高了TiO2向金红石结构转变的温度,延缓了晶粒的生长.薄膜样品的磁性受超顺磁效应影响较弱,主要受氧空位的影响.随着空气氛围下退火温度的升高,样品的结构就会越完善,从而使得样品中氧空位的浓度减少,饱和磁化强度减弱.     

γ′-Fe_4N薄膜的制备及其磁性

采用直流磁控溅射方法,以Ar/N2为放电气体(N2/(Ar N2)=10%),在玻璃和NaCl(100)单晶片上分别沉积获得Fe-N薄膜样品.利用X射线衍射(XRD)、原子力显微镜(AFM)和超导量子干涉仪(SQUID)对样品的结构、形貌和磁性能进行分析,研究基片和基片温度等条件对薄膜的影响.结果表明,以NaCl单晶为基片获得单相γ′-Fe4N薄膜,与玻璃基片相比可降低其生成的基片温度并可扩大形成温度的范围,且比饱和磁化强度略有增大.     

Ag/FePt/C薄膜的结构和磁性

采用直流和射频磁控溅射在Si(001)基片上制备Ag/FePt/C薄膜,并将其在不同温度下进行真空热处理,得到了具有高矫顽力的L10-FePt薄膜.利用X射线荧光(XRF)、X射线衍射(XRD)和振动样品磁强计(VSM)研究样品的成分、结构和磁性.结果表明,样品经400℃热处理后发生了无序—有序相转变,以Ag元素为底层可降低有序化温度,添加Ag和C可抑制晶粒生长.随着热处理温度的升高,FePt的晶粒尺寸和矫顽力逐渐增大,经600℃热处理后,样品中FePt的平均晶粒尺寸为14nm,垂直膜面和平行膜面的矫顽力分别为798.16kA/m和762.35kA/m.     

沉积厚度对L10-FePt薄膜(001)织构和磁性的影响

采用直流磁控溅射方法在表面氧化的Si(001)基片上制备不同厚度的FePt薄膜, 并利用原子力显微镜(AFM)、 X射线衍射(XRD)和振动样品磁强计(VSM)表征样品的形貌、结构和磁性. 结果表明: 将薄膜样品在H₂气氛中经600 ℃退火1 h, 得到了L1₀-FePt薄膜; 薄膜具有(001)织构或明显的(001)取向生长, 随着沉积厚度
的增加, FePt的晶粒尺寸变大, 样品的有序化程度增大, (001)取向生长呈减弱的趋势; 样品均具有明显的垂直磁各向异性, 随着薄膜厚度的增加, 平行膜面矫顽力增大, 垂直膜面矫顽力先增大后减小, 当沉积厚度为10 nm时, 样品的垂直磁各向异性最佳.     

缓冲层对NiCo薄膜各向异性磁致电阻的影响

用磁控溅射法制备了以NiFeCr和Ta分别为缓冲层的两种NiCo薄膜样品,在不同温度下对两种样品退火.结果表明:在NiCo厚度相同的情况下,以NiFeCr作为缓冲层的样品的各向异性磁致电阻(AMR)值明显高于Ta作为缓冲层的样品.X射线衍射(XRD)的结果表明,NiFeCr/NiCo薄膜的晶粒平均尺寸大于Ta/NiCo薄膜,且两种样品的磁膜/缓冲层界面存在较大差异,这可能是造成两者AMR差异的原因.此外,对样品进行温度适当的热处理可以明显改善薄膜的物理性质.     

Effects of SrTiO3 buffer layer on structural and electrical properties of Bi3.15Nd0.85Ti3O12 thin films prepared by a chemical method

Ferroelectric Bi3.15Nd0.85Ti3O12 (BNT) thin films have been grown on Pt/Ti/SiO2/Si substrates at 750 ℃ by a chemical solution deposition method using SrTiO3 (STO) as a buffer layer.The influence of STO...     

HV/CVD Grown Relaxed SiGe Buffer Layers for SiGe HMOSFETs

High-vacuum/chemical-vapor deposition (HV/CVD) system was used to grow relaxed SiGe buffer layers on Si substrates. Several methods were then used to analyze the quality of the SiGe films. X-ray diffraction and Raman spectroscopy showed that the upper layer was almost fully relaxed. Second ion mass spectroscopy showed that the Ge compositions were step-graded. Transmission electron microscopy showed that the misfit dislocations were restrained to the graded SiGe layers. Tests of the electrical properties of tensile-strained Si on relaxed SiGe buffer layers showed that their transconductances were higher than that of Si devices. These results verify the high quality of the relaxed SiGe buffer layer. The calculated critical layer thicknesses of the graded Si1-xGex layer on Si substrate and a Si layer on the relaxed SiGe buffer layer agree well with experimental results.     

不同基片生长γ'-Fe4N薄膜的结构及其磁学性能

采用直流磁控溅射方法, 保持氩气流量不变, 控制氮气的体积分数为10%,125%,15%, 分别用Si（100）单晶和SrTiO₃（100）单晶基片制备Fe N薄膜. 用X射线衍射(XRD)和振动样品磁强计(VSM)等方法对两种不同基片生长Fe N薄膜的结构及磁学性能进行表征. 结果表明: 在SrTiO₃（100）单晶基片上得到了单相γ′-Fe₄N薄膜, 与Si（100）基片上的样品相比, SrTiO₃（100）更有利于诱导γ′-Fe₄N薄膜的取向性生长; 当氮气的体积分数约为12.5%时, 制备单相γ′-Fe₄N薄膜的晶粒结晶度较好, 且饱和磁化强度较高, 矫顽力比Si（100）为基片获得的Fe N薄膜样品低, 软磁性能较好.     

强磁场下蒸镀法制备Co_3O_4薄膜

为了研究强磁场对蒸镀法制备Co3O4薄膜结构影响,以提高该材料的取向性,改善Co3O4薄膜的磁学性能,该文以99.99%的Co为原料,分别在无磁场和强磁场条件下低真空热蒸镀Co3O4薄膜,采用扫描电子显微镜、X射线衍射和振动样品磁强计研究了以Si(111)为基底的Co3O4薄膜晶粒尺寸、取向和磁性能。结果表明:随着磁场强度增加至4T,晶粒尺寸由200 nm减至20 nm,晶体由杂乱取向排列转为平行于磁场方向取向生长,薄膜的矫顽力减小,矩磁比增大至0.81。结果表明:强磁场对蒸镀法制备Co3O4薄膜晶粒的大小和取向有显著影响,能显著提高材料的矩磁比。     

Study on NiO/Fe interface with X-ray photoelectron spectroscopy

Different monolayers (ML) of Fe atoms were deposited on NiO (001) substrates or NiO underlayers using molecular beam epitaxy (MBE), pulse laser deposition (PLD), and magnetron sputtering (MS). The magnetic properties and microstructure of the films were studied. The apparent magnetic dead layer (MDL) is found to exist at the NiO/Fe interfaces of the MBE sample (about 2 ML MDL), the PLD sample (about 3 ML MDL), and the MS sample (about 4 ML MDL). X-ray photoelectron spectroscopy indicates the presence of ionic Fe (Fe2+ or Fe3+) and metallic Ni at the NiO/Fe interfaces, which may be due to the chemical reactions between Fe and NiO layers. This also leads to the formation of MDL. The thickness of the MDL and the reaction products are related with the deposition energy of the atoms on the substrates. The interfacial reactions are effectively suppressed by inserting a thin Pt layer at the NiO/Fe interface.     

Si_（83）Ge_（17）/Si压应变衬底上HfAlO_x栅介质薄膜微结构、界面反应和介电性能研究

本文研究了射频磁控溅射沉积在p-Si83Ge17/Si（100）压应变衬底上HfAlOx栅介质薄膜的微结构及其界面反应,表征了其各项电学性能,并与相同制备条件下沉积在p-Si（100）衬底上薄膜的电学性能进行了对比研究.高分辨透射电子显微镜观测与X射线光电子能谱深度剖析表明600°C高温退火处理后,HfAlOx薄膜仍保持非晶态,但HfOx纳米微粒从薄膜中分离析出,并与扩散进入膜内的Ge,Si原子发生界面反应生成了富含Ge原子的HfSiOx和HfSix的混合界面层.相比在相同制备条件下沉积在Si（100）衬底上的薄膜样品,Si83Ge17/Si（100）衬底上薄膜的电学性能大幅提高：薄膜累积态电容增加,有效介电常数增大（～17.1）,平带电压减小,？1V栅电压下漏电流密度J减小至1.96×10？5A/cm2,但电容-电压滞后回线有所增大.Si83Ge17应变层抑制了低介电常数SiO2界面层的形成,从而改善了薄膜大部分电学性能;但混合界面层中的缺陷导致薄膜界面捕获电荷有所增加.     

Evolution of insoluble eutectic Si particles in anodic oxidation films during adipic-sulfuric acid anodizing processes of ZL114A aluminum alloys

The effects of insoluble eutectic Si particles on the growth of anodic oxide films on ZL114A aluminum alloy substrates were investigated by optical microscopy (OM) and scanning electron microscopy (SEM). The anodic oxidation was performed at 25℃ and a constant voltage of 15 V in a solution containing 50 g/L sulfuric acid and 10 g/L adipic acid. The thickness of the formed anodic oxidation film was approximately 7.13 μm. The interpore distance and the diameters of the major pores in the porous layer of the film were within the approximate ranges of 10-20 nm and 5-10 nm, respectively. Insoluble eutectic Si particles strongly influenced the morphology of the anodic oxidation films. The anodic oxidation films exhibited minimal defects and a uniform thickness on the ZL114A substrates; in contrast, when the front of the oxide oxidation films encountered eutectic Si particles, defects such as pits and non-uniform thickness were observed, and pits were observed in the films.