MOCVD GaN/InN/GaN量子阱的应变表征

采用MOCVD外延生长11周期InN/GaN量子阱结构样品,原子力显微镜表面形貌结果显示实现了台阶流动生长模式.通过高分辨率X射线衍射与掠入射X射线反射谱技术获得了阱层与垒层的实际厚度.从(102)非对称衍射面与(002)对称衍射面的倒异空间图,确认了InN阱层处于与GaN共格生长的完全应变状态,获得了GaN缓冲层的晶体质量信息及其c轴与a轴晶格常数,确认外延层因受衬底热失配的影响处于压应变状态.     

Ultrathin compound semiconductor on insulator layers for high-performance nanoscale transistors

Over the past several years, the inherent scaling limitations of silicon (Si) electron devices have fuelled the exploration of alternative semiconductors, with high carrier mobility, to further enhance device performance. In particular, compound semiconductors heterogeneously integrated on Si substrates have been actively studied: such devices combine the high mobility of III-V semiconductors and the well established, low-cost processing of Si technology. This integration, however, presents significant challenges. Conventionally, heteroepitaxial growth of complex multilayers on Si has been explored-but besides complexity, high defect densities and junction leakage currents present limitations in this approach. Motivated by this challenge, here we use an epitaxial transfer method for the integration of ultrathin layers of single-crystal InAs on Si/SiO(2) substrates. As a parallel with silicon-on-insulator (SOI) technology, we use 'XOI' to represent our compound semiconductor-on-insulator platform. Through experiments and simulation, the electrical properties of InAs XOI transistors are explored, elucidating the critical role of quantum confinement in the transport properties of ultrathin XOI layers. Importantly, a high-quality InAs/dielectric interface is obtained by the use of a novel thermally grown interfacial InAsO(x) layer (~1?nm thick). The fabricated field-effect transistors exhibit a peak transconductance of ~1.6?mS?μm(-1) at a drain-source voltage of 0.5?V, with an on/off current ratio of greater than 10,000.     

负偏压对六方氮化硼薄膜沉积特性的影响

利用射频磁控溅射法在n型Si(100)衬底上沉积六方氮化硼薄膜(h-BN),采用AFM、Raman、XPS、FTIR等技术研究负偏压对所沉积薄膜生长模式、结构、表面粗糙度、薄膜取向、相变等特性的影响。结果表明,当负偏压为0V时,沉积所得h-BN薄膜表面粗糙度较低、结晶性良好、c轴垂直于衬底且以层状模式生长;随着负偏压的增加,薄膜由层状模式生长转变为岛状模式生长,表面粗糙度增加,且h-BN经亚稳相E-BN和wBN向c-BN转变,使得BN薄膜相系统更加混乱,不利于高质量层状h-BN薄膜的获取。     

Improved performance of GaN-based light-emitting diodes by using short-period superlattice structures

An InGaN/GaN multiple-quantum-well (MQW) light-emitting diode (LED) with a ten-period i (undoped) -InGaN/p (Mg doped) -GaN (2.5 nm/5.0 nm) superlattice (SL) structure, was fabricated. This SL structure that can be regarded as a confinemen t layer of holes to enhance the hole injection efficiency is inse rted between MQW and p-GaN layers. The studied LED device exhibits better current spreading performance and an improved quality, compared with a conventional one without SL structure. Due to the reduced contact resistance as well as more uniformity of carrier s injection, the operation voltage at 20 mA is decreased from 3.32 to 3.14 V. A remarkably reduced reverse-biased leakage current (10^-7?10^-9 A) and higher endurance of the reverse current pulse are found. The measured output power and external quantum efficiency (EQE) of the studied LED are 13.6 mW and 24.8%, respectively. In addition, significant enhancement of 25.4% in output power as well as increment of 5% in EQE for the studied devices is observed, as the studied devices show s uperior current spreading ability and reduction in dislocations offered by the SL structure.     

第三代宽禁带功率半导体及应用发展现状

 近年来，以碳化硅和氮化镓为代表的第三代宽禁带功率半导体迅猛发展，已成为中国功率电子行业的研发和产业化应用的重点。抓住第三代宽禁带功率半导体的战略机遇期，实现半导体材料、器件、封装模块和系统开发的自主可控，对保障工业创新体系的可持续发展至关重要。在分析第三代宽禁带功率半导体重要战略意义的基础上，综述了其材料、器件研发和产业的发展现状，阐述了碳化硅及氮化镓器件在当前环境下的应用成果，剖析了第三代半导体行业存在的关键问题。建议在国家政策的进一步领导之下，发挥行业协会和产业联盟的桥梁和纽带作用，对衬底材料、外延材料、芯片与器件设计和制造工艺等产业链各环节进行整体支撑，引导各环节间实现资源共享、强强联合，上下游互相拉动和促进，形成一个布局合理、结构完整的产业链。     

圆锥形图形化蓝宝石衬底对MOCVD生长GaN外延膜的位错密度和应力应变影响

通过金属氧化物化学气相沉积（MOCVD）方法在2．5μm×1．6μm×0．5μm圆锥形图形化蓝宝石衬底（CPSS）和没有图形化平面蓝宝石衬底（uss）上生长GaN外延膜．高分辨率X射线衍射仪（HRXRD）测试结果表明,生长在CPSS上GaN的刃位错的密度比生长在USS上GaN的刃位错密度低得多;从透射电子显微镜（TEM）观察,CPSS可有效地减小GaN外延膜中的线位错密度;拉曼散射谱显示通过CPSS可有效地减小GaN外延膜中的残余应力;比较两种外延膜中的光致发光谱（PL）,能从生长在CPSS上GaN外延膜中观察到强而尖的带边发射．以上结果表明：生长在CPSS上GaN外延膜的质量高于生长在USS上GaN外延膜的质量．     

功率型发光二极管芯片的温度场与应力场

发光二极管(LED)的结点温度和应力分布对它的发光效率、可靠性和寿命有着至关重要的影响。为了优化器件的性能,该文利用有限元方法对功率型LED芯片在不同输入功率、基板材料、换热条件下的温度和热应力进行了模拟与分析。结果表明,目前广泛应用的Sapphire基板效果不是很好,如果能减小晶格不匹配的影响,采用硅基板是较好的选择。当基板导热系数、换热系数大于一定值后,单纯的改进基板的导热系数或强化基板换热,对提高器件的性能已经没有明显的效果。     

基于MOVPE和MBE法生成的GaN薄膜的反射、透射光谱测量

使用紫外-可见光分光光度计,研究用金属有机物气相外延(MOVPE)方法生成在蓝宝石衬底上的GaN薄膜的反射光谱、透射光谱以及用分子束外延(MBE)方法生成在碳化硅衬底上GaN薄膜的反射光谱,结果表明,所测的GaN薄膜和体材料的光学吸收边出现在364 nm附近,对应的禁带宽度为3.41 eV.在两种不同衬底上,薄膜的反射谱由于材料晶格常数和热膨胀系数的不同有所差别.     

功率型发光二极管芯片的温度场与应力场

发光二极管(LED)的结点温度和应力分布对它的发光效率、可靠性和寿命有着至关重要的影响。为了优化器件的性能,该文利用有限元方法对功率型LED芯片在不同输入功率、基板材料、换热条件下的温度和热应力进行了模拟与分析。结果表明,目前广泛应用的Sapphire基板效果不是很好,如果能减小晶格不匹配的影响,采用硅基板是较好的选择。当基板导热系数、换热系数大于一定值后,单纯的改进基板的导热系数或强化基板换热,对提高器件的性能已经没有明显的效果。     

Ⅲ—Ⅴ氮化物与蓝光LEDs(Ⅰ)

回顾了Ⅲ—Ⅴ氮化物材料和GaN-based蓝光LED的研究状况及近期的重大进展,分成两部分先后在本刊发表,首先简要地概述了GaN及其有关化合物的晶体生长技术,较为详细地讨论了衬底选择和外延层的晶体结构。     

纤锌矿氮化物半导体中电子-声子相互作用对表面电子态的影响

采用变分法研究了半无限纤锌矿氮化物半导体中电子表面态问题. 计及电子与表面光学声子相互作用和结构异性的影响导出了系统的有效哈密顿量, 获得了电子表面态能级、电子与表面光学声子相互作用能量分别随表面势垒的变化关系. 对GaN, AlN和InN进行了数值计算.结果表明,电子与表面声子的相互作用使电子的表面能级下降, 并且纤锌矿结构的GaN和AlN中电子-声子相互作用能量较闪锌矿结构大,而对InN情况正好相反.在计算的所有材料中纤锌矿材料的电子表面能级比闪锌矿的低几百meV.电子与表面光学声子相互作用对表面电子态的影响不应被忽略.     

AP-MOCVDGaN材料生长特性

研究低温生长GaN过渡层（缓冲层）在AP－MOCVD生长GaN材料过程中的作用，探讨了过渡层的生长温度、时间、氮化时间等参数对GaN材料晶体质量的影响，通过对过渡层的特性参数的分析、优化，获得了X射线双晶衍射半峰宽为6’的GaN外延层．     

六方氮化硼及其纳米片在催化领域的研究进展

六方氮化硼(h-BN)具有优异的化学和热稳定性、良好的热传导性和很高的机械强度.除了上述性质,二维结构的六方氮化硼纳米片(BNNS)还表现出其他的优势(比表面积大、带隙宽度可调等),因此在一些关键领域有广泛的应用前景.本文对BNNS的制备及六方氮化硼(块体和纳米片)材料在催化领域的应用进行了评述与展望.     

Persistent sourcing of coherent spins for multifunctional semiconductor spintronics.

Recent studies of n-type semiconductors have demonstrated spin-coherent transport over macroscopic distances, with spin-coherence times exceeding 100 ns; such materials are therefore potentially useful building blocks for spin-polarized electronics ('spintronics'). Spin injection into a semiconductor (a necessary step for spin electronics) has proved difficult; the only successful approach involves classical injection of spins from magnetic semiconductors. Other work has shown that optical excitation can provide a short (<500 ps) non-equilibrium burst of coherent spin transfer across a GaAs/ZnSe interface, but less than 10% of the total spin crosses into the ZnSe layer, leaving long-lived spins trapped in the GaAs layer (ref. 9). Here we report a 'persistent' spin-conduction mode in biased semiconductor heterostructures, in which the sourcing of coherent spin transfer lasts at least 1-2 orders of magnitude longer than in unbiased structures. We use time-resolved Kerr spectroscopy to distinguish several parallel channels of interlayer spin-coherent injection. The relative increase in spin-coherent injection is up to 500% in the biased structures, and up to 4,000% when p-n junctions are used to impose a built-in bias. These experiments reveal promising opportunities for multifunctional spin electronic devices (such as spin transistors that combine memory and logic functions), in which the amplitude and phase of the net spin current are controlled by either electrical or magnetic fields.     

有机发光器件中空穴注入对负电容的影响

对不同结构的有机发光器件(OLED)进行了电容-电压(C-V)特性测量,研究了不同空穴注入结构对OLED负电容的影响。结果表明,负电容的产生与OLED内部电场的分布有着密切的关系,负电容开始出现的频率与电压的平方根呈指数关系。与超薄的单层空穴注入层相比,掺杂的空穴注入层不仅能降低器件的驱动电压,而且其载流子传输特性和出现负电容时的初始电压对频率有着更强的依赖性。     

硼化氮-石墨烯杂化单原子层电学性质的第一原理

利用基于密度泛函理论的第一原理方法研究二维六方硼化氮片（h-BN） 石墨烯杂化单原子层的电学性质. 结果表明: 三角形h-BN嵌入石墨烯中或三角形石墨烯片嵌入二维h-BN中均会在能带结构导带和价带中间引入带间态, 带间态的形态与杂化方式有关; 半导体性与导体性质可相互转变, 即该杂化结构的电子结构可通过不同杂化形式调制.     

An aluminium nitride light-emitting diode with a wavelength of 210 nanometres

Compact high-efficiency ultraviolet solid-state light sources--such as light-emitting diodes (LEDs) and laser diodes--are of considerable technological interest as alternatives to large, toxic, low-efficiency gas lasers and mercury lamps. Microelectronic fabrication technologies and the environmental sciences both require light sources with shorter emission wavelengths: the former for improved resolution in photolithography and the latter for sensors that can detect minute hazardous particles. In addition, ultraviolet solid-state light sources are also attracting attention for potential applications in high-density optical data storage, biomedical research, water and air purification, and sterilization. Wide-bandgap materials, such as diamond and III-V nitride semiconductors (GaN, AlGaN and AlN; refs 3-10), are potential materials for ultraviolet LEDs and laser diodes, but suffer from difficulties in controlling electrical conduction. Here we report the successful control of both n-type and p-type doping in aluminium nitride (AlN), which has a very wide direct bandgap of 6 eV. This doping strategy allows us to develop an AlN PIN (p-type/intrinsic/n-type) homojunction LED with an emission wavelength of 210 nm, which is the shortest reported to date for any kind of LED. The emission is attributed to an exciton transition, and represents an important step towards achieving exciton-related light-emitting devices as well as replacing gas light sources with solid-state light sources.     

Al2O3衬底上低温生长GaN薄膜的一种新方法

研究了 ECR- PAMOCVD在蓝宝石衬底上生长 Ga N外延层时衬底的清洗方法和缓冲层结构对于 Ga N晶体质量的影响 ,提出了新的衬底清洗方法和双缓冲层结构 .实验表明这种方法能够提供一个很好的生长基底 ,可以有效地改善 Ga N外延层的晶体质量     

Flexible metal-oxide devices made by room-temperature photochemical activation of sol-gel films

Amorphous metal-oxide semiconductors have emerged as potential replacements for organic and silicon materials in thin-film electronics. The high carrier mobility in the amorphous state, and excellent large-area uniformity, have extended their applications to active-matrix electronics, including displays, sensor arrays and X-ray detectors. Moreover, their solution processability and optical transparency have opened new horizons for low-cost printable and transparent electronics on plastic substrates. But metal-oxide formation by the sol-gel route requires an annealing step at relatively high temperature, which has prevented the incorporation of these materials with the polymer substrates used in high-performance flexible electronics. Here we report a general method for forming high-performance and operationally stable metal-oxide semiconductors at room temperature, by deep-ultraviolet photochemical activation of sol-gel films. Deep-ultraviolet irradiation induces efficient condensation and densification of oxide semiconducting films by photochemical activation at low temperature. This photochemical activation is applicable to numerous metal-oxide semiconductors, and the performance (in terms of transistor mobility and operational stability) of thin-film transistors fabricated by this route compares favourably with that of thin-film transistors based on thermally annealed materials. The field-effect mobilities of the photo-activated metal-oxide semiconductors are as high as 14 and 7?cm(2)?V(-1)?s(-1) (with an Al(2)O(3) gate insulator) on glass and polymer substrates, respectively; and seven-stage ring oscillators fabricated on polymer substrates operate with an oscillation frequency of more than 340?kHz, corresponding to a propagation delay of less than 210?nanoseconds per stage.     

Tuning charge transport in solution-sheared organic semiconductors using lattice strain

Circuits based on organic semiconductors are being actively explored for flexible, transparent and low-cost electronic applications. But to realize such applications, the charge carrier mobilities of solution-processed organic semiconductors must be improved. For inorganic semiconductors, a general method of increasing charge carrier mobility is to introduce strain within the crystal lattice. Here we describe a solution-processing technique for organic semiconductors in which lattice strain is used to increase charge carrier mobilities by introducing greater electron orbital overlap between the component molecules. For organic semiconductors, the spacing between cofacially stacked, conjugated backbones (the π-π stacking distance) greatly influences electron orbital overlap and therefore mobility. Using our method to incrementally introduce lattice strain, we alter the π-π stacking distance of 6,13-bis(triisopropylsilylethynyl) pentacene (TIPS-pentacene) from 3.33?? to 3.08??. We believe that 3.08?? is the shortest π-π stacking distance that has been achieved in an organic semiconductor crystal lattice (although a π-π distance of 3.04?? has been achieved through intramolecular bonding). The positive charge carrier (hole) mobility in TIPS-pentacene transistors increased from 0.8?cm(2)?V(-1)?s(-1) for unstrained films to a high mobility of 4.6?cm(2)?V(-1)?s(-1) for a strained film. Using solution processing to modify molecular packing through lattice strain should aid the development of high-performance, low-cost organic semiconducting devices.