NdFeB磁性材料化学镀非晶态Ni—W—P合金及其相转变行为

采用化学镀方法在NdFeB磁性材料表面施镀非晶态Ni—W—P合金,利用扫描电子显微镜（SEM）及X射线衍射仪对Ni—WP合金镀层的组织形貌、结构及其相转变行为进行了分析．结果表明,非晶态Ni—W—P合金镀层是由大量不同尺寸的颗粒状或胞状突起组成,随着热处理温度逐渐升高,镀层结构由非晶结构逐渐转变为晶态结构,非晶态Ni—W—P合金镀层的晶化转变温度范围为350～380℃．     

Ni-P化学镀层相变过程研究

针对镍磷化学镀镀层相变过程中存在的问题,通过X射线衍射、差热分析和透射电镜等手段对含磷原子数分数12.15%的镍磷镀层的镀态组织和晶化过程进行了初步研究。结果表明,这种中磷含量的镍磷镀层镀态下组织为非晶态,晶化起始温度321℃;退火过程中,非晶组织中先形成镍纳米晶,然后纳米晶镍伴随晶化过程进行迅速长大,并在镍基体上析出亚稳过渡相Ni12P5和稳定的Ni3P相,400℃退火90min后的组织为晶粒尺寸为微米级的镍基体上分布着弥散的Ni3P相和少量的Ni12P5相。     

Ni-Fe-P合金化学镀的工艺条件及晶化行为研究

采用硼酸为缓冲剂,柠檬酸钠为络合剂在碱性介质中化学沉积Ni Fe P合金.考察了工艺条件如pH、FeSO4·7H2O浓度和温度对沉积速度的影响.获得了沉积速度快,镀液稳定性好的工艺条件.采用差示扫描量热和X射线衍射研究了Ni Fe P合金的晶化行为.结果表明,镀层在镀态呈非晶结构,镀层在200.5℃晶化为亚稳的Ni Fe合金,310℃晶化为立方FeNi3合金,369.2℃晶化为四方的Ni3P,而491.3℃为继续生成FeNi3的吸热峰.     

铝合金表面Ni-Cu-P化学镀层的性能研究

试验分析了铜离子浓度c(Cu2+)对沉积速度、镀液稳定性以及镀层结构与性能的影响.用SEM、XRD、VSM表征镀层的表面形貌、组织结构及磁性能.Ni-Cu-P镀层的结晶性随c(Cu2+)增加而提高,并出现明显的衍射峰位角移现象.反应激活能随pH值增加而减小,随c(Cu2+)增加而增加.500℃保温2 h,Ni-Cu-P合金发生晶化转变,出现Ni3P、Cu3P结晶相.Cu元素的加入,使得Ni-Cu-P镀层具有高的热稳定性以及低的残磁性.     

烧结NdFeB磁体表面化学镀Ni-Cu-P合金及防腐性能

在烧结NdFeB磁体表面化学镀Ni-Cu-P以提高其耐腐蚀性能. 研究了络合剂的质量浓度、镀液的pH值、施镀温度及金属离子配比[Cu2 ]/[Ni2 ]对沉积速度和镀层成分的影响. 用扫描电镜(SEM)和能谱仪(EDAX)观察镀层形貌并分析镀层成分. 测定Ni-Cu-P合金镀层在质量分数3.5% NaCl溶液中的极化曲线,并结合中性盐雾实验表征镀层的耐腐蚀性能. 研究表明:烧结NdFeB永磁体经碱性超声波除油、酸洗活化后进行化学镀Ni-Cu-P,可得到结合力良好的合金镀层;随着镀液中金属离子配比[Cu2 ]/[Ni2 ]的增大,所得镀层从非晶向晶态转变,镀层中的磷含量先升高后降低,镀层表面变得平整、致密;化学镀Ni-Cu-P三元合金的耐腐蚀性能优于相同条件下所得到的Ni-P镀层,且从金属离子配比([Cu2 ]/[Ni2 ])为0.02的镀液中得到的镀层的耐腐蚀性能最强.     

非晶态Ni—Fe—P合金电沉积的研究

介绍了一种新的电沉积非晶态Ni—Fe—P合金的方法．用这种方法在室温下电沉积出的非晶态Ni－Fe—P合金镀层外观接近镜面,镀层厚度可达42μm．经X－ray衍射、扫描电子显微镜（SEM）及等离子光谱分析（ICP—AES）证实,所获得的Ni—Fe—P合金镀层为非晶态结构,镀层中主要成分Ni、Fe、P的含量分别为74％～83％、9％～24％和6％～10％,此外,还含有0．01％～0．14％B和C元素,这些元素的存在是导致非晶态Ni—Fe—P合金镀层产生的主要原因．文中对电沉积非晶态NI—Fe—P合金的工艺条件、添加剂HAT和光亮剂HAB1、HAB2的作用和影响进行了分析和探讨．图8,表1,参14     

化学沉积Ni-Fe-P及Ni-Fe-P-B合金膜的结构和显微硬度

利用X射线衍射方法研究了不同Na2H2PO2的质量浓度以及热处理温度条件下化学镀三元Ni-Fe-P和四元Ni-P-B镀层的结构,在温度为200-700℃范围内加热镀层产生结构变化,当热处理温度等于或低于400℃时,镀层的显微硬度随温度增加,这与从Ni-P-B镀层非晶基底中析出（Fe,Ni)固溶体,Ni3P相以及从Ni-P-B镀层（Fe,Ni）固溶体基底中析出Fe2B等相有关,热处理温度大于或等于500℃时,NiP,Fe3P,Fe2B等相析出,同时随温度增加颗粒逐渐粗化,引起镀层软化,在Ni-Fe-P镀层中加入KBH4,经300℃热处理引起镀层显微硬度增加,低于300℃热处理对镀层硬度影响不明显,该现象可由B与Ni-Fe固溶体基底形成了晶化相加以证实。     

脉冲放电制备链枝状非晶态Ni-P合金粉体的晶化行为

在镍盐溶液中利用脉冲放电技术制备出Ni-P合金粉体,并用场发射扫描电镜(FESEM)、透射电镜(TEM)、X射线衍射(XRD)及差热分析(DTA)等手段研究非晶粉体的晶化行为和组织结构特征.结果表明:Ni-P合金粉体形貌为链枝状,径向可达500nm左右,长度可达数微米.制备的合金粉体为非晶态结构,在280℃以下热处理时没有改变非晶态结构:在300℃开始晶化,析出亚稳相Ni5P2和Ni12P5;在320℃开始析出稳定相Ni和Ni3P;温度升高到400℃时,亚稳相消失.采用Kissinger公式计算出该合金粉体的晶化激活能为291.76kJ.mol-1.     

热处理温度对Ni—P合金刷镀层组织形貌及显微硬度的影响

分析了加热温度对P质量分数为4.4%的Ni-P合金刷镀层组织形貌的影响,测定了不同加热温度下镀层的显微硬度值。结果表明,弥散分布的Ni3P相是400℃温度下镀层显微镜硬度出现峰值的主要原因。     

pH值对Ni-Fe-P化学镀层结构与磁性质的影响

以硼酸为缓冲剂,柠檬酸钠为络合剂,在弱碱性体系中化学沉积Ni-Fe-P合金.采用电子能谱仪、X射线衍射仪、透射电镜和振动样品磁强计,研究镀液pH值和NiSO4/FeSO4物质量的比等对镀层组成、结构和磁性能的影响.结果表明,在化学沉积Ni-Fe-P合金中,Fe随着Ni被还原而共沉积,但镀层中Fe原子数分数不高,属诱导共沉积机理.镀液pH值的提高有利于Fe的还原沉积,但会使镀层中P原子数分数稍微降低,约为17.81%~22.0%,属于中高磷镀层.沉积条件对Ni-Fe-P镀层的结构影响不大,合金镀态均为非晶态或微晶结构.Ni-Fe-P合金的磁性能与沉积条件密切相关,随着镀层中铁原子数分数的增加,镍原子数分数降低,镀层的饱和磁化强度和剩余磁化强度均增加.     

四元Cu-20Ni-20Cr-2Si合金在900℃,0.1MPa纯氧中氧化行为研究

研究了Cu-20Ni-20Cr-2Si合金在900℃,0.1 MPa纯氧中的氧化行为。结果表明：合金由三相组成,氧化动力学偏离抛物线规律,其瞬时抛物线速率常数随时间而降低。与前面研究的三相Cu-20Ni-20Cr合金形成含有所有组元氧化物及它们复合氧化物的复杂氧化膜结构不同,目前研究的Cu-20Ni-20Cr-2Si合金内部形成了连续的Cr2O3层,这是由于向Cu-20Ni-20Cr合金中加入了第四组元Si后,降低了合金表面活泼组元形成氧化物所需的临界浓度,使合金表面易于形成活泼组元氧化物膜。     

Phase-selection and metastable phase formation in highly undercooled eutectic Ni_(78.6)Si_(21.4)alloys

A large undercooling (250 K) was achieved in eutectic Ni78.6 Si21.4 melt by the combination of molten-glass denucleation and cyclic superheating. The metastable phase formation process in the bulk undercooled eutectic Ni78.6 Si21.4 melts was investigated. With the increase of undercooling, different metastable phases form in eutectic Ni78.6 Si21.4 melts and part of these metastable phases can be kept at room temperature through slow post-solidification. Under large undercooling, the metastable phases β2-Ni3Si, Ni31Si12 and Ni3Si2 were identified. Especially, the Ni3Si2 phase was obtained in eutectic Ni78.6 Si21.4 alloy for the first time. Based on the principle of free energy minimum and transient nucleation theory, the solidification behavior of melts was analyzed with regard to the metastable phase formation when the melts were in highly undercooled state.     

Atomic-scale computer simulation for ternary alloy Ni-Cr-Al during early precipitation process

The aging behaviors of Ni-Cr-Al ternary alloy are studied at temperature 873 K based on the mean-field theory, and the early precipitation process is simulated at atomic-scale with microscopic phase-field model. The precipitation mechanism of the low supersaturated alloy Ni-12.2at.%Cr-7.8at.%Al is non-classical nucleation and growth, the L12 structure (Ni3Al) and D022 structure (Ni3Cr) phases precipitate simultaneously, a part of D022 phase transmits to L12 structure phase, and other part retains its previous structure. For high supersaturated alloy, congruent ordering appears first, then followed by spinodal decomposition, the nonstoicheometric ordered phases are produced in this process, which occurs before clustering. The precipitation mechanism of Ni-8at.%Cr-18at.%Al alloy is similar to Ni-10at.%Cr-12at.%Al alloy, but the ordering process of the former is ahead of the latter.     

Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath

Electroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath. The effects of pH value and the metal source composition, Ni and Cu, in the plating bath on the kinetics of the Ni-Cu-P deposition were studied. The electroless Ni-Cu-P deposits were characterized by a scanning electron microscope, a transmission electron microscope, an energy dispersive X-ray spectroscope, and an X-ray diffractometer. The results showed that the pH value of the plating bath had no obvious effect on the morphology and composition of electroless Ni-Cu-P deposits. However, the composition of the metal source, Ni and Cu, in the plating bath had great effect on the kinetics of electroless Ni-Cu-P deposition.     

Microstructure of Ni–Al powder and Ni–Al composite coatings prepared by twin-wire arc spraying

Ni–Al powder and Ni–Al composite coatings were fabricated by twin-wire arc spraying (TWAS). The microstructures of Ni-5wt%Al powder and Ni-20wt%Al powder were characterized by scanning electronic microscopy (SEM) and energy dispersive spectroscopy (EDS). The results showed that the obtained particle size ranged from 5 to 50 μm. The morphology of the Ni–Al powder showed that molten particles were composed of Ni solid solution, NiAl, Ni₃Al, Al₂O₃, and NiO. The Ni–Al phase and a small amount of Al₂O₃ particles changed the composition of the coating. The microstructures of the twin-wire-arc-sprayed Ni–Al composite coatings were characterized by SEM, EDS, X-ray diffraction (XRD), and transmission electron microscopy (TEM). The results showed that the main phase of the Ni-5wt%Al coating consisted of Ni solid solution and NiAl in addition to a small amount of Al₂O₃. The main phase of the Ni-20wt%Al coating mainly consisted of Ni solid solution, NiAl, and Ni₃Al in addition to a small amount of Al and Al₂O₃, and NiAl and Ni₃Al intermetallic compounds effectively further improved the final wear property of the coatings. TEM analysis indicated that fine spherical NiAl₃ precipitates and a Ni–Al–O amorphous phase formed in the matrix of the Ni solid solution in the original state.     

Wettability and pressureless infiltration mechanism in SiC-Cu systems

The wetting behavior of copper alloys on SiC substrates was studied by a sessile drop technique. The microstructure of SiC_p/Cu composites and the pressureless infiltration mechanism were analyzed. The results indicate that Ti and Cr are effective elements to improve the wettability, while Ni, Fe, and Al have minor influence on the improvement of wettability. Non-wetting to wetting transition occurs at 1210 and 1190℃ for Cu-3Al-3Ni-9Si and Cu-3Si-2Al-1Ti, respectively. All the copper alloys react with SiC at the interface forming a reaction layer except for Cu-3Al-3Ni-9Si. High Si content favors the suppression of interracial reaction. The infiltration mechanism during pressureless infiltration is attributed to the decomposition of SiC. The beneficial effect of Fe, Ni, and Al is to favor the dissolution of SiC. The real active element during pressureless infiltration is Si.     

稀土-Cu—Ni—Si引线框架铜合金的加工工艺与性能研究

主要对添加了不同量稀土Co的Cu-3．0Ni-0．64Si合金进行加工工艺和性能研究．最佳加工工艺为：Cu-3．0Ni-0．64Si合金热轧时,铸锭热轧开坯温度为930℃,保温时间60min;固溶处理温度为900℃,保温时间60min;然后经过约80％的冷变形再进行时效处理,时效处理温度480℃,保温时间210min．研究结果表明：添加0．06wt％Ce的Cu-3．0Ni-0．64Si合金具有最佳综合性能;电导率最高达到48．9％IACS,抗拉强度达到733．17MPa．     

Microstructure and properties of an Al-Ti-Cu-Si brazing alloy for SiC-metal joining

An Al-Ti-Cu-Si solid-liquid dual-phase alloy that exhibits good wettability and appropriate interfacial reaction with SiC at 500-600℃ was designed for SiC-metal joining. The microstructure, phases, differential thermal curves, and high-temperature wetting behavior of the alloy were analyzed using scanning electron microscopy, X-ray diffraction analysis, differential scanning calorimetry, and the sessile drop method. The experimental results show that the 76.5Al-8.5Ti-5Cu-10Si alloy is mainly composed of Al-Al₂Cu and Al-Si hypoeutectic low-melting-point microstructures (493-586℃) and the high-melting-point intermetallic compound AlTiSi (840℃). The contact angle, determined by high-temperature wetting experiments, is approximately 54°. Furthermore, the wetting interface is smooth and contains no obvious defects. Metallurgical bonding at the interface is attributable to the reaction between Al and Si in the alloy and ceramic, respectively. The formation of the brittle Al₄C₃ phase at the interface is suppressed by the addition of 10wt% Si to the alloy.     

Effects of Ni content on the cast and solid-solution microstructures of Cu-0.4wt%Be alloys

The effects of Ni content (0–2.1wt%) on the cast and solid-solution microstructures of Cu-0.4wt%Be alloys were investigated, and the corresponding mechanisms of influence were analyzed. The results show that the amount of precipitated phase increases in the cast alloys with increasing Ni content. When the Ni content is 0.45wt% or 0.98wt%, needle-like Be₂₁Ni₅ phases form in the grains and are mainly distributed in the interdendritic regions. When the Ni content is 1.5wt% or greater, a large number of needle-like precipitates form in the grains and chain-like Be₂₁Ni₅ and BeNi precipitates form along the grain boundaries. The addition of Ni can substantially refine the cast and solid-solution microstructures of Cu-0.4wt%Be alloys. The hindering effects of both the dissolution of Ni into the matrix and the formation of Be–Ni precipitates on grain-boundary migration are mainly responsible for refining the cast and solid-solution microstructures of Cu-0.4wt%Be alloys. Higher Ni contents result in finer microstructures; however, given the precipitation characteristics of Be–Ni phases and their dissolution into the matrix during the solid-solution treatment, the upper limit of the Ni content is 1.5wt%–2.1wt%.