Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath |
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| Authors: | Wei-Long Liu Wen-Jauh Chen |
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| Affiliation: | a Department of Materials Science and Engineering, Formosa University, Huwei, Yunlin 632, China Taipei
b Graduate School of Materials Science, Yunlin University of Science and Technology, Yunlin 640, China Taipei |
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| Abstract: | Electroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath. The effects of pH value and the metal source composition, Ni and Cu, in the plating bath on the kinetics of the Ni-Cu-P deposition were studied. The electroless Ni-Cu-P deposits were characterized by a scanning electron microscope, a transmission electron microscope, an energy dispersive X-ray spectroscope, and an X-ray diffractometer. The results showed that the pH value of the plating bath had no obvious effect on the morphology and composition of electroless Ni-Cu-P deposits. However, the composition of the metal source, Ni and Cu, in the plating bath had great effect on the kinetics of electroless Ni-Cu-P deposition. |
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| Keywords: | electroless deposition Ni-Cu-P silicon substrate kinetics activation energy |
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