Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints

The growth rule of the interfacial intermetallic compound (IMC) and the degradation of shear strength of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni (SACBN)/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu (SAC305)/Cu solder joints aging at 373, 403, and 438 K. The results show that (Cu_1?x,Ni_x)₆Sn₅ phase forms between the SACBN solder and Cu substrate during soldering. The interfacial IMC thickens constantly with the aging time increasing, and the higher the aging temperature, the faster the IMC layer grows. Compared with the SAC305/Cu couple, the SACBN/Cu couple exhibits a lower layer growth coefficient. The activation energies of IMC growth for SACBN/Cu and SAC305/Cu couples are 111.70 and 82.35 kJ/mol, respectively. In general, the shear strength of aged solder joints declines continuously. However, SACBN/Cu solder joints exhibit a better shear strength than SAC305/Cu solder joints.     

温度与镀层对Sn0.7Cu焊料合金润湿性的影响

主要研究了真空状态下,焊接温度为530,560和590 K时,Sn-0.7Cu焊料合金在镀Cu、镀Ni、镀Ni/Ag和镀Ni/Au基板上的润湿性.结果表明:提高钎焊时的焊接温度,有助于降低液态Sn-0.7Cu焊料合金的表面张力,从而增大Sn-0.7Cu焊料合金在焊接基板上的润湿性.在相同的焊接条件下,Sn-0.7Cu焊料合金在镀Ni/Ag和镀Ni/Au基板上的润湿性比其在Cu和镀Ni基板上的润湿性好.     

Effect of indium addition on the microstructural formation and soldered interfaces of Sn-2.5Bi-1Zn-0.3Ag lead-free solder

The microstructural formation and properties of Sn-2.5Bi-xIn-1Zn-0.3Ag (in wt%) alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point (about 195℃), which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the mechanical properties, and the embedded bulk intermetallic compounds (IMCs) (Cu₆Sn₅ and Cu₅Zn₈) and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the β-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xIn-1Zn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.     

Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys

To improve the properties of Sn10Sb8Cu solder alloy, two new solders (SnSbCuAg and SnSbCuNi) were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu₆Sn₅ and (Cu, Ni)₆Sn₅ with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.     

Electrochemical migration behaviors of lead-free 64Sn-35Bi-1Ag solder on FR-4 PCB board plated with Cu

Electrochemical migration (ECM) characteristic is a new reliability failure. A parallel surfacial electrode system coupling with scanning electron microscope (SEM), energy dispersive X-ray analysis (EDAX), and X-ray Diffraction (XRD) technologies is designed to research ECM behavior of 64Sn-35Bi-1Ag (SBA) solder in 3.5 g/L NaCl solution and compare to that of Sn37Pb and Sn-3.0Ag-0.5Cu (SAC) solders. Results show that SBA solder is more susceptible to ECM failure than Sn37Pb solder, which is more difficult than SAC solder. The affected factors of ECM are given as follows: the solder compositions, the loaded electric field, ECM time, etc. The electrochemical reaction mechanism of ECM process is achieved. EDAX and XRD analyses show that the main contents on dendrites of SBA solder after ECM test are Sn, hardly any Bi, a little Ag, which illustrates that the order of ion migration capacity is shown as follows: Sn Ag Bi.     

Characterization of Cu3P phase in Sn3.0Ag0.5Cu0.5P/Cu solder joints

This article reports the effects of phosphorus addition on the melting behavior, microstructure, and mechanical properties of Sn3.0Ag0.SCu solder. The melting behavior of the solder alloys was determined by differential scanning calorimetry. The interracial micro- structure and phase composition of solder/Cu joints were studied by scanning electron microscopy and energy dispersive spectrometry. Thermodynamics of Cu-P phase formation at the interface between Sn3.0Ag0.5Cu0.5P solder and the Cu substrate was characterized. The results indicate that P addition into Sn3.0Ag0.5Cu solder can change the microstructure and cause the appearance of rod-like CuaP phase which is distributed randomly in the solder bulk. The Sn3.0Ag0.5Cu0.5P joint shows a mixture of ductile and brittle fracture after shear test- ing. Meanwhile, the solidus temperature of Sn3.0Ag0.5Cu solder is slightly enhanced with P addition.     

SnBi/Cu焊接接头的剪切性能及界面微观组织分析

通过对断口形貌和界面微观组织的观察分析,研究了3种Sn-Bi/Cu焊接接头的剪切断裂机理.结果表明:3种Sn-Bi/Cu焊接接头均在弹性变形阶段断裂,并且均沿Sn-Bi焊料/Cu基板界面处断裂.孔洞降低了3种Sn-Bi/Cu焊接接头的有效连接面积,从而降低了其剪切强度.根据3种Sn-Bi/Cu焊接接头断口形貌,Sn59.9Bi40Cu 0.1/Cu和Sn57.9Bi40Zn2Cu 0.1/Cu焊接接头剪切断裂机制属于准解理、沿晶脆性断裂和韧窝的混合型断裂,而Sn42Bi58/Cu焊接接头剪切断裂机制属于准解理断裂.微观组织分析显示,3种焊料合金焊接接头界面处的金属间化合物层均为连续的Cu₆Sn₅相.     

Optimization of mechanical properties of Sn-3.8Ag-0.7Cu alloys by the additions of Bi,In and Ti

Bi, In and Ti were added to Sn-3.8Ag-0.7Cu (SAC387) solder alloy to optimize the mechanical performance. The alloying effects of Bi, In and Ti on the microstructure, thermal and mechanical properties of SAC387 based solder alloys were investigated. The results demonstrate that adding 3.5 ?wt % of Bi could refine the microstructure, optimize the thermal properties, and improve the tensile strength. Meanwhile, the ductility of the solder alloys reduced evidently. Adding 2.8 ?wt % of In into SAC387–3.5 ?wt %Bi alloy could increase both the strength and ductility, which is attributed to the beneficial effect of In addition, as adding In could improve the solubility of Bi in the β-Sn matrix. Meanwhile, the melting point was reduced, and the wettability improved with the addition of In. Introducing amounts of Ti into SAC387–3.5 ?wt % Bi-2.8 ?wt % In alloy could further increase the strength. However, the ductility was significantly reduced when 0.8 ?wt % of Ti was added due to the formation of the coarse Ti₂Sn₃ phase. The undercooling was remarkably reduced with the addition of Ti. The nanoindentation tests demonstrate that the hardness increased mainly due to the hardening effect of the Bi addition. Among all the samples prepared, alloy SAC387–3.5 ?wt % Bi exhibited the highest creep resistance at the ambient temperature. Further adding In and Ti into SAC387–3.5 ?wt % Bi alloys reduced the creep resistance of the solder alloys. The mechanism associated with the different mechanical responses is also discussed in this study.     

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy’s melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample’s cross section. Intermetallic compounds of Cu6Sn5 and β-Sn phase were found at the interface of Sn-Ag-Cu/Cu.     

基于谣言攻击的产品需求波动CISRaRd模型研究

与产品相关的谣言影响个体对于产品的判断及购买欲望,进而波及整个供应链中产品的市场需求.考虑个体的情绪和个体对谣言的判断,将经典谣言传播模型中的免疫者R细分成为蒙蔽者R_a和清醒者R_d,两种状态的个体都知道但不传播谣言,不同的是R_a受谣言蒙蔽相信谣言不购买产品,R_d作为清醒者不相信谣言,且继续购买产品.基于系统动力学构建CISR_aR_d谣言传播模型,对模型进行稳定性证明,探讨谣言攻击对产品需求的遏制情况,并在此基础上进行了数值模拟.研究表明,与产品相关的谣言严重制约产品的市场需求,商家在应对谣言攻击时所作出的正面宣传对于产品需求的恢复有其积极意义.     

Cu doping effect on Mn sites of La2/3Ca1/3 MnO3 system

The temperature dependence of resistance and magnetoresistance at 77 K for Cu-doped La 2/3Ca 1/3Mn 1-xCu xO-3 have been investigated. Besides the transition similar to the Cu-free sample at ～260 K, a new transition at lower temperature appears for Cu-doped samples. The new transition moves toward low temperature with increasing of Cu content. A new conductive proceeding related to Cu ion may exist. Magnetoresistance at liquid nitrogen shows that MR increased three orders when x is changed from 0 to 0 15. Moreover, the main variation of magnetoresistance is below the field of 1 T.     

Microstructural evolutions of Cu(Ni)/AuSn/Ni joints during reflow

Interfacial reactions of the Ni/AuSn/Ni and Cu/AuSn/Ni joints are experimentally studied at 330℃for various reflow times.The microstructures and mechanical properties of the as-solidified solder joints are examined.The as-solidified solder matrix of Ni/AuSn/Ni presents a typical eutecticξ-(Au,Ni)_5Sn+δ-(Au,Ni)Sn lamellar microstructure after reflow at 330℃for 30 s.After reflow for 60 s,a thin and flat(Ni,Au)_3Sn_2 intermetallic compound(IMC) layer is formed,and some needle-like(Ni,Au)_3Sn_2 phases grow f...     

Luminescent Cu doped CdTe nanocrystals via cation exchange of Cu7Te5 nanocubes: From undoped to doped emission

In II-VI group, the doping in CdTe nanocrystals (NCs) is more difficult than other chalcogenides. In this communication, CdTe nanocrystals containing Cu impurities were carefully synthesized based on controlled reverse cation exchange process between as-prepared Cu₇Te₅ nanocubes and Cd²⁺ ions. By well-defined Cu₇Te₅ nanocubes, the obtained CdTe NCs kept the original morphology. The concentration of Cu impurities in CdTe NCs was controlled by the regulation such reverse cation exchange. Additionally, the regulation from band gap (BG) photoluminescence (PL) to the coexistence of the bandgap emission, dopant emission, and surface-state emission was realized. This tailoring from undoped to doped emission in the case of Cu impurities is helpful to study the Cu related doping in telluride NCs.     

Average widths and optimal recovery of multivariate Besov classes inL p (Rd)

Some weak asymptotic results for average σ-K width and average σ_L width of the isotropic Besov classes S r pθB(R d), S r pθb(R d) and the anisotropic Besov classes S r pθB(R d), S r pθb(R d) in L p(R d) (1≤p<∞) are obtained, and the corresponding weak asymptotic optimal subspaces are identified. Furthermore, the weak asymptotic behavior of optimal recovery is established for the isotropic Besov classes S r pθB(R d) in L p(R d) (1≤p≤∞).     

Cu含量对喷射成形7055铝合金微观组织和力学性能的影响

通过拉伸试验、冲击试验以及微观组织观察试验,分析降低Cu含量对喷射成形7055铝合金强度、断裂韧性和微观组织的影响。力学性能试验表明,7055铝合金中Cu的质量分数由2.55%降低到2.17%时,对其强度和伸长率影响不大,但Cu含量降低后合金的断裂韧性显著提高。微观组织分析表明,Cu含量降低前晶界上存在粗大的Al₇Cu₂Fe相,Cu含量降低后晶界上的粗大析出相明显减少;断口分析表明,Cu含量降低前拉伸断口中存在较多的Al₇Cu₂Fe第二相,Cu含量降低后Al₇Cu₂Fe第二相明显减少。     

Solid FeS lubricant:a possible alternative to MoS2 for Cu-Fe-based friction materials

Molybdenum disulfide (MoS₂) is one of the most commonly used solid lubricants for Cu-Fe-based friction materials. Nevertheless, MoS₂ reacts with metal matrices to produce metal sulfides (e.g., FeS) and Mo during sintering, and the lubricity of the composite may be related to the generation of FeS. Herein, the use of FeS as an alternative to MoS₂ for producing Cu-Fe-based friction materials was investigated. According to the reaction principle of thermodynamics, two composites-one with MoS₂ (Fe-Cu-MoS₂ sample) and the other with FeS (FeS-Cu₂S-Cu-Fe-Mo sample), were prepared and their friction behaviors and mechanical properties were compared. The results showed that MoS₂ reacted with the Cu-Fe matrix to produce FeS, metallic ternary sulfides, and Mo when sintered at 1050℃. The MoS₂-Cu-Fe and FeS-Cu₂S-Cu-Fe-Mo samples thereby exhibited similar characteristics with respect to phase composition, density, hardness, and tribological behaviors. Micrographs of the worn surfaces revealed that the stable friction regime for both composites stemmed from the iron sulfides friction layers rather than from the molybdenum sulfides layers.     

Absolute continuity of interacting measure-valued branching processes and its occupation-time processes

Let X t be the interaction measured_valued branching α_ symmetric stable process over R d(1<α≤2) constructed by Meleard_Roelly . Frist, it is shown that X t is absolutely continuous with respect to the Lebesgue measure (on R ) with a continuous density function which satisfies some SPDE. Second, it is proved that if the underlying process is a Brownian motion on R d (d≤3), the corresponding occupation_time process Y t is also absolutely continuous with respect to the Lebesgue measure.     

Synthesis and structure of Cu5(BTA)6(TTA)4 · 5DMF, a copper-nitrogen cluster containing η Π3-benzotriazolate

The title cluster compound—Cu₅(BTA)₆(TTA)₄·5DMF was prepared using thenyltrifluoroacetone and benzotriazolate ligands. The crystal structure indicates that a tetrahedral array of Cu(1), Cu(2), Cu(3) and Cu(4) ions surrounding a central Cu(5) ion are held together by bridging tridentate BTA^- and terminated by TTA^- bond cap. The three nitrogen atoms of a BTA^- bond three different copper ions to form a η³-benzotriazolate. The central Cu ion has a distorted octahedral structure and the surrounding Cu ions are 5 coordinated forming distorted tetragonal structures. The distances between the surrounding Cu(Ⅱ) ions and the central Cu(Ⅱ) ion are in the range of 0.3561—0.3755 nm and those between the surrounding Cu(Ⅱ) ions are in the range of 0.5785—0.6301 nm.     

High critical current density in powder-in-tube processed MgB2/Ta/Cu wire

The magnetization of dense MgB₂/Ta/Cu wires prepared by the powder-in-tube method is measured by a SQUID magnetometer. The results indicate that the critical temperature of MgB₂/Ta/Cu is around 38.4 K with a sharp transition width of 0.6 K. The MgB₂/Ta/Cu wire shows a strong flux pinning and the critical current density is higher than 10⁵ A/cm² (5 K, self-field) and 10⁴ A/cm² (20 K, 1 T). Also, the irreversibility field of the sample reaches 6.6 T at 5 K.     

Temporal Spreading Effect of Oceanic Lidar System

In this paper, multipath temporal spreading distributions of laser pulses are calculated when they travel through the seawater. Individual photon is followed in Monte Carlo calculation A modified Henyey-Greenstein （HG） function is applied to represent the scattering phase function of seawater. This paper proposes a new scaling method, which uses the effective scattering thickness τd to replace the optical thickness used in the traditional scaling technique. This paper compares the temporal spreading distributions of photons on conditions of different attenuation coefficients and target depths. The experiments reveal that these mutual deviations are changing in the range from 0.5% to 5%, so long as the corresponding effective scattering thicknesses τd remains the same. Therefore, a conclusion can be obtained, that the temporal spreading distribution is only dependent on the effective diffusion thickness τd .