Effect of magnesium and nickel coatings on the wetting behavior of alumina toughened zirconia by molten Al-Mg alloy

The wettability of alumina toughened zirconia (ZTA) by Al-Mg alloy was investigated using the sessile drop technique. The effects of nickel coating, magnesium content, nitrogen atmosphere, and processing temperature on the contact angle between the molten alloy and the substrate were determined. Likewise, the effect of these factors on the wetting properties was studied. The results showed that the nickel coating on the ceramic substrate caused a significant reduction in solid/liquid surface energy and the contact angle decreased obviously. The presence of magnesium in the molten aluminum alloy in nitrogen atmosphere reduced the contact angle effectively. The presence of magnesium in the alloy must be at a minimum amount of 2wt%-3wt%. Moreover, it was suggested that some chemical reactions in the Al-Mg-N system led to the production of Mg₃N₂ and AlN compositions. These compositions improved the wetting properties of the systems by reducing the surface energy of the molten. It was shown that increasing the temperature is also an effective factor for the enhancement of wetting properties.     

Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K.The triple line frontier,characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H 2 flow.We found a good agreement with the De Gennes model for the relationship between ln(dR/dt) and lnR for the spreading processes at 493 and 523 K.However,a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K.Our experimental results show a complicated temperature effect on the spreading kinetics.Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu 6 Sn 5 adjacent to the solder and Cu 3 Sn adjacent to the Cu substrate.The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier.     

Sintering mechanism of Cu-9Al alloy prepared from elemental powders

The sintering behavior of Cu-9Al alloys prepared from die pressing of elemental powders was investigated. The experimental results and kinetic analysis showed the formation of three consecutive layers of Al₂Cu, Al₄Cu₉, and AlCu phases, with Al₂Cu appearing first in the initial solid phase sintering stage. A liquid phase formed in the intermediate stage, resulting from the eutectic reaction between Al and Al₂Cu phases at 500 °C, which is 47 °C lower than the equilibrium reaction temperature. Swelling occurred when the liquid phase infiltrated the gaps between the copper particles, leaving pores at the original sites of Al particles and Al₂Cu. In the final stage of sintering, the Al-rich phases (Al₂Cu and AlCu) transformed to Al-poor phases (Al₄Cu₉ and α-Cu) in the temperature range of 500–565 °C. Al₄Cu₉ and α-Cu then transformed to AlCu₃ (β) above the eutectoid reaction temperature (565 °C), whereas AlCu₃ transformed to α-Cu and eutectoid phases (α-Cu + Al₄Cu₉) during cooling. The pure copper transformed to AlCu₃, and the pore volume decreased at 1000 °C. The microstructure study helps manipulate precisely the sintering process of Cu-Al alloys and optimize the microstructure with a high dimensional accuracy.     

化学复合镀Ni—P—PTFE共沉积机理研究

通过测定钢试片上化学镀Ｎｉ－Ｐ－ＰＴＦＥ（聚四氟乙烯）复合镀层中ＰＴＦＥ粒子沉积量及分布特征，研究各种因素对ＰＴＦＥ粒子沉积的影响规律．试验表明，表面活性剂在化学镀Ｎｉ－Ｐ－ＰＴＦＥ过程中起着重要作用；同时，镀面状态及施镀工艺也有明显影响．提出了化学镀Ｎｉ－Ｐ－ＰＴＦＥ复合镀层的共沉积机理，即ＰＴＦＥ粒子通过机械碰撞及静电吸附的联合作用被试件表面俘获，实现与Ｎｉ－Ｐ共沉积     

Microstructure and mechanical properties of the SiC/Zr4 joints brazed with TiZrNiCu filler for nuclear application

Si C ceramic has been successfully joined to Zr4 alloy using Ti Zr Ni Cu filler within the temperature range1173 K–1263 K and 15 min holding time. The morphology of the Si C/Zr4 joints was investigated by SEM, and the phases in the joints were characterized by XRD and TEM. The results indicated that part of the Zr4 substrate dissolved into the molten filler during the brazing process, contributed to the increasing Zr content and the formation of Zr[Ti] solid solution in the joints. In addition, β-Ti phase was discovered in the brazing seam. This might be attributed to the existence of β-Ti stable elements, Cu and Ni. The interface characterization showed that Si C reacted with filler alloy during the brazing process, formed a(Zr, Ti)C reaction layer on Si C surface and Zr2 Si compound near Si C substrate. Finally, the mechanical properties of the joints, evaluated by a shear strength test, reached a maximum of 95 MPa at the brazing temperature of 1203 K.     

无钎焊料与Zr基块状非晶合金的润湿行为

通过座滴法研究了Sn-In、Sn-Bi和Sn-Ag-Cu三种焊料分别与块状非晶合金Zr44Cu40Al8Ag8的润湿行为.结果显示在三种焊料中,Sn-In对块状非晶合金Zr44Cu40Al8Ag8的润湿性最好,而Sn-Bi焊料对块状非晶合金Zr44Cu40Al8Ag8的润湿性最差.利用扫描电镜研究了Sn-In焊料与块状非晶合金Zr44Cu40Al8Ag8的界面特征,其界面处有化合物出现.     

Fabrication of copper nanorods by low-temperature metal organic chemical vapor deposition

Copper nanorods have been synthe-sized in mesoporous SBA-15 by a low-temperature metal organic chemical vapor deposition (MOCVD) employing copper (II) acetylacetonate, Cu(acac)2, and hydrogen as a precursor and reactant gas, re- spectively. The hydrogen plays an important role in chemical reduction of oganometallic precursor which enhances mass transfer in the interior of the SBA-15 porous substrate. Such copper nanostructures are of great potentials in the semiconductor due to their unusual optical, magnetic and electronic properties. In addition, it has been found that chemically modi- fying the substrate surface by carbon deposition is crucial to such synthesis of copper nanostructures in the interior of the SBA-15, which is able to change the surface properties of SBA-15 from hydrophilic to hydrophobic to promote the adsorption of organic cupric precursor. It has also been found that the copper nanoparticles deposited on the external sur- face are almost eliminated and the copper nanorods are more distinct while the product was treated with ammonia. This approach could be achieved under a mild condition: a low temperature (400℃) and vac-uum (2 kPa) which is extremely milder than the con- ventional method. It actually sounds as a foundation which is the first time to synthesize a copper nanorod at a mild condition of a low reaction temperature and pressure.     

Effect of reinforcement content on the adhesive wear behavior of Cu10Sn5Ni/Si3N4 composites produced by stir casting

The main objective of this paper was to fabricate Cu10Sn5Ni alloy and its composites reinforced with various contents of Si₃N₄ particles (5wt%, 10wt%, and 15wt%) and to investigate their dry sliding wear behavior using a pin-on-disk tribometer. Microstructural examinations of the specimens revealed a uniform dispersion of Si₃N₄ particles in the copper matrix. Wear experiments were performed for all combinations of parameters, such as load (10, 20, and 30 N), sliding distance (500, 1000, and 1500 m), and sliding velocity (1, 2, and 3 m/s), for the alloy and the composites. The results revealed that wear rate increased with increasing load and increasing sliding distance, whereas the wear rate decreased and then increased with increasing sliding velocity. The primary wear mechanism encountered at low loads was mild adhesive wear, whereas that at high loads was severe delamination wear. An oxide layer was formed at low velocities, whereas a combination of shear and plastic deformation occurred at high velocities. The mechanism at short sliding distances was ploughing action of Si₃N₄ particles, which act as protrusions; by contrast, at long sliding distances, direct metal-metal contact occurred. Among the investigated samples, the Cu/10wt% Si₃N₄ composite exhibited the best wear resistance at a load of 10 N, a velocity of 2 m/s, and a sliding distance of 500 m.     

室温下Hg与镀银基板反应型润湿动力学研究

应用对比法分析Hg与镀银基板反应润湿实验,将四种常见动力学模型的理论计算值与实验结果进行比较,找到模型中与实验数据变化规律一致的部分,作为该阶段的控制因素,将两个不同阶段连接起来作为对反应润湿过程的整体描述.结果表明:接触角随时间的变化规律在0~150 s内与反应控制的近线性模型相符,在150~600 s内与扩散控制模型的规律相符,说明Hg与Ag的反应润湿控制机制由开始的化学反应控制逐渐向扩散控制转变.高温润湿体系也可采用对比法,对分析焊接、电子器件封装、冶金反应等领域的反应润湿问题具有重要性.     

化学刻蚀法制备铝合金基超疏水表面

采用简单化学刻蚀法对铝合金基体进行腐蚀,得到了粗糙表面.然后对铝合金粗糙表面进行氟化处理,得到了具有超疏水的表面.研究了不同刻蚀时间以及不同刻蚀液浓度对表面疏水效果的影响.结果发现:在实验的参数条件下,不同刻蚀时间下,接触角随着氢氟酸刻蚀时间的增加,先增加后减少,当氢氟酸刻蚀时间为7 min时,所得试件水的接触角最大.不同刻蚀液浓度下,接触角随着盐酸浓度的增加,先增加后减少.当盐酸浓度为4 mol/L时,所得试件水的接触角最大.     

半导体激光软钎焊Sn-Ag-Cu焊点微观组织

采用90 W半导体激光焊接系统对Sn-Ag-Cu无铅钎料在纯铜基板上进行钎焊试验. 针对在不同激光输出功率下形成的微焊点形貌, 分析Sn-Ag-Cu钎料在纯铜基板上的润湿、铺展规律和微焊点的微观组织特征. 通过分析比较在激光软钎焊和红外再流焊2种再流焊加热方式的Sn-Ag-Cu钎料微焊点的微观组织, 发现： 当采用半导体激光软钎焊时存在最佳输出功率, 在此功率下得到的微焊点组织均匀, 晶粒细小, 没有产生空洞缺陷, 力学性能最佳.     

Burn-resistant behavior and mechanism of Ti14 alloy

The direct-current simulation burning method was used to investigate the burn-resistant behavior of Ti14 titanium alloy. The results show that Ti14 alloy exhibits a better burn resistance than TC4 alloy (Ti–6Al–4V). Cu is observed to preferentially migrate to the surface of Ti14 alloy during the burning reaction, and the burned product contains Cu, Cu₂O, and TiO₂. An oxide layer mainly comprising loose TiO₂ is observed beneath the burned product. Meanwhile, Ti₂Cu precipitates at grain boundaries near the interface of the oxide layer, preventing the contact between O₂ and Ti and forming a rapid diffusion layer near the matrix interface. Consequently, a multiple-layer structure with a Cu-enriched layer (burned product)/Cu-lean layer (oxide layer)/Cu-enriched layer (rapid diffusion layer) configuration is formed in the burn heat-affected zone of Ti14 alloy; this multiple-layer structure is beneficial for preventing O₂ diffusion. Furthermore, although Al can migrate to form Al₂O₃ on the surface of TC4 alloy, the burn-resistant ability of TC4 is unimproved because the Al₂O₃ is discontinuous and not present in sufficient quantity.     

A novel investigation on the influence of Cu–P modifier on the microstructure,mechanical performance,and melting process of Al–50Si alloys treated by overheating

As an efficient modifier, phosphorus (P) can significantly reduce the size of primary silicon (Si) crystals. However, modifier can aggregate when the P content exceeds a certain proportion, which decreases refining efficiency. In this study, the evolution of microstructures and mechanical properties of Al–50Si alloy have been studied by combining superheating and modification treatments. After modification, the mean size of the primary Si phase increased with superheating temperature, while the hardness decreased with increased superheating. Although the alloy was in an over-modified state when the modified content was 7 ?wt%, the overall alloy hardness was the highest. Nanoindentation tests were used to examine the mechanical properties of each alloy phase and the results showed that the nano-hardness of Al₂Cu phase was 5.52 ?GPa, three times that of an Al matrix, and was considered to be the reason for increased alloy hardness after over-modification. This phenomenon indicated that, except for size and distribution of the primary Si phase, intermetallic compounds, such as Al₂Cu, also played important roles in modifying alloy mechanical properties. The alloy melting process was observed in-situ using a laser confocal high-temperature scanning microscope and results indicated that the melting temperature of α-Al decreased with increased matrix Cu content. A model for calculating distortion energy was proposed and its rationality verified. Calculation results showed that, with increased matrix Cu content, the distortion energy gradually increased, which was the main reason for decreased matrix melting temperature. Moreover, the existence of distortion energy was verified using the EBSD method.     

Grain boundary characteristics and tensile properties of Ti14 alloy after semi-solid deformation

The microstructure and room-temperature tensile properties of Ti14, a new α+Ti₂Cu alloy, were investigated after conventional forging at 950℃ and semi-solid forging at 1000 and 1050℃, respectively. Results show that coarse grains and grain boundaries are obtained in the semi-solid alloys. The coarse grain boundaries are attributed to Ti₂Cu phase precipitations occurred on the grain boundaries during the solidification. It is found that more Ti₂Cu phase precipitates on the grain boundaries at a higher semi-solid forging temperature, which forms precipitated zones and coarsens the grain boundaries. Tensile tests exhibit high strength and low ductility for the semi-solid forged alloys, especially after forging at 1000℃. Fracture analysis reveals the evidence of ductile failure mechanisms for the conventional forged alloy and cleavage fracture mechanisms for the alloy after semi-solid forging at 1050℃.     

自蔓延法制备铜铬合金

考察了添加剂CaF2及铸模预热温度等因素对自蔓延反应过程及合金性能的影响,分析了铜铬合金的金相组织及其化学成分,采用XRD技术对铜铬合金和熔炼渣进行了表征.结果表明:自蔓延法合成的铜铬合金存在着富铜区、富铬区;合金由Cu,Cr两相组成,未形成新的共溶相;熔炼渣主要由Al2O3相组成;添加CaF2及提高铸模预热温度能够强化金渣分离效果,强制水冷能有效抑制合金的宏观偏析;当添加10%CaF2,铸模预热温度为500℃时,强制水冷条件下制备铜铬合金成分均匀、结构致密.     

Nd-Fe-B-Sn合金的显微组织及其对磁性能的影响

 用粉末冶金烧结法制备了Nd-Fe-B,Nd-Fe-B-Sn和Nd-Dy-Fe-B-Sn永磁合金,用SEM和TEM分析了合金的显微形貌及相结构,并用永磁参量测量仪和振动样品磁强计(VSM)测量了合金的磁性能.研究表明,添加在合金中的Sn元素主要分布在富钕相中,且改善了富钕相与基体相(Nd2Fe14B)的润湿性.合金的相组成仍然是Nd2Fe14B相(Φ相)、富钕相、富硼相(η相),添加锡没有导致合金中析出新相.但是,添加锡使Nd-Fe-B系合金的室温磁性受到损害,然而却使合金在较高温时的矫顽力温度系数和开路磁通不可逆损失明显减小.锡元素对合金显微组织的改善,可能是合金高温磁性能改善的根本原因.     

Centimeter-sized Ti-based bulk metallic glass with high specific strength

Based on the quaternary Ti₄₁Zr₂₅Be₂₉Al₅ glassy alloy with a critical diameter of 7 mm reported not long ago, an obvious enhancement of glass-forming ability (GFA) has been realized in this alloy by the addition of Cu element. A series of (Ti₄₁Zr₂₅Be₂₉Al₅)_100?xCu_x (x=0, 2, 5, 7, 9, 11 at%) glassy alloys have been developed and some of them can be cast into one-centimeter diameter fully glassy rods by copper mold suction casting. It has been found that Cu addition could stabilize the liquid phase and suppress the crystallization, resulting in improvement of the GFA of the alloy. The addition of Cu also increases the compressive strength of the alloy and the (Ti₄₁Zr₂₅Be₂₉Al₅)₉₁Cu₉ glassy alloy possesses a specific strength (defined as yield strength/density) of 4.13×10⁵ Nm/kg, which is much higher than most other reported centimeter-sized bulk metallic glasses. The present result suggests that the newly developed (Ti₄₁Zr₂₅Be₂₉Al₅)₉₁Cu₉ glassy alloy is a good candidate for structural applications because of its good glass-forming ability and mechanical properties.     

中温SOFC阴极材料La0.7Sr0.3Co1-xCuxO3-δ的制备及性能

采用固相反应法制备了La_0.7Sr_0.3Co_1-xCu_xO_3-δ系列中温固体氧化物燃料电池（SOFC）阴极材料粉体.对其进行晶体结构表征,高温电导率和热膨胀曲线测试,并选取其中性能较好的样品进行了单电池实验.结果表明,Cu的掺杂降低了（La,Sr）CoO La₃体系阴极材料的热膨胀系数,在x=0.05时电导率略高于未掺Cu的样品.以La_0.7Sr_0.3Co_0.95Cu _0.05O _3-δ为阴极、Ce_0.8Sm_0.2O_1.9为电解质组成的SOFC单电池,在850℃最大短路电流密度达511mA/cm²,最大输出功率密度约为0.106W/cm².     

Cu含量对喷射成形7055铝合金微观组织和力学性能的影响

通过拉伸试验、冲击试验以及微观组织观察试验,分析降低Cu含量对喷射成形7055铝合金强度、断裂韧性和微观组织的影响。力学性能试验表明,7055铝合金中Cu的质量分数由2.55%降低到2.17%时,对其强度和伸长率影响不大,但Cu含量降低后合金的断裂韧性显著提高。微观组织分析表明,Cu含量降低前晶界上存在粗大的Al₇Cu₂Fe相,Cu含量降低后晶界上的粗大析出相明显减少;断口分析表明,Cu含量降低前拉伸断口中存在较多的Al₇Cu₂Fe第二相,Cu含量降低后Al₇Cu₂Fe第二相明显减少。     

TiNi形状记忆合金低速冲击响应行为的研究

利用单摆冲击试验设备，对TiNi合金不同冲击能量及温度条件下的冲击响应行为进行了研究。冲击过程中的接触载荷由压力传感器及数字信号处理系统实时测量。根据接触载荷数据，可计算得到接触载荷与样品表面变形的关系。结果表明，同一冲击高度时，随温度升高马氏体TiNi合金的最大接触载荷增加，而接触时问降低；母相TiNi合金的最大接触载荷随冲击高度的增加会出现载荷平台段即伪弹变形段，处于平台段时母相TiNi合金吸收冲击能量，且不产生不可恢复的塑性变形，最大接触载荷降低，从而可减轻材料损伤。