Microstructure and properties of Ag–Ti3SiC2 contact materials prepared by pressureless sintering

Ti₃SiC₂-reinforced Ag-matrix composites are expected to serve as electrical contacts. In this study, the wettability of Ag on a Ti₃SiC₂ substrate was measured by the sessile drop method. The Ag–Ti₃SiC₂ composites were prepared from Ag and Ti₃SiC₂ powder mixtures by pressureless sintering. The effects of compacting pressure (100–800 MPa), sintering temperature (850–950℃), and soaking time (0.5–2 h) on the microstructure and properties of the Ag–Ti₃SiC₂ composites were investigated. The experimental results indicated that Ti₃SiC₂ particulates were uniformly distributed in the Ag matrix, without reactions at the interfaces between the two phases. The prepared Ag–10wt%Ti₃SiC₂ had a relative density of 95% and an electrical resistivity of 2.76×10-3 mΩ·cm when compacted at 800 MPa and sintered at 950℃ for 1 h. The incorporation of Ti₃SiC₂ into Ag was found to improve its hardness without substantially compromising its electrical conductivity; this behavior was attributed to the combination of ceramic and metallic properties of the Ti₃SiC₂ reinforcement, suggesting its potential application in electrical contacts.     

Effect of sintering temperature on the preparation of Cu–Ti3SiC2 metal matrix composite

Ti3SiC2 has the potential to replace graphite as reinforcing particles in Cu matrix composites for applications in brush,electrical contacts and electrode materials.In this paper the fabrication of Cu-Ti3SiC2 metal matrix composites prepared by warm compaction powder metallurgy forming and spark plasma sintering(SPS) was studied.The stability of Ti3SiC2 at different sintering temperatures was also studied.The present experimental results indicate that the reinforcing particles in Cu-Ti3SiC2 composites are not stable at and above 800℃.The decomposition of Ti3SiC2 will lead to the formation of TiC and/or other carbides and TiSi2.If purity is the major concern,the processing and servicing temperatures of the Cu-Ti3SiC2 composite should be limited to 750℃ or lower.The composites prepared by warm compaction forming and SPS sintering at 750℃ have lower density when compared with the composites prepared by SPS sintering at 950℃,but their electrical resistivity values are very close to each other and even lower.     

还原氧化石墨烯增强铜基复合材料的制备及性能研究

借助分子级混合法和均质机剥离共同作用,采用放电等离子体烧结技术(SPS)制备出还原氧化石墨烯/铜基复合材料。利用SEM、XRD、Roman、XPS和压缩测试对其微观组织结构及综合性能进行了研究。结果表明,适量的氧化石墨烯能够均匀分散在铜基中并显著提高复合材料的综合性能。复合材料的压缩屈服强度最高达到481 MPa,比纯铜相应值提升了约2.2倍,维氏硬度较纯铜相应值也提升了约0.7倍。     

Solid FeS lubricant:a possible alternative to MoS2 for Cu-Fe-based friction materials

Molybdenum disulfide (MoS₂) is one of the most commonly used solid lubricants for Cu-Fe-based friction materials. Nevertheless, MoS₂ reacts with metal matrices to produce metal sulfides (e.g., FeS) and Mo during sintering, and the lubricity of the composite may be related to the generation of FeS. Herein, the use of FeS as an alternative to MoS₂ for producing Cu-Fe-based friction materials was investigated. According to the reaction principle of thermodynamics, two composites-one with MoS₂ (Fe-Cu-MoS₂ sample) and the other with FeS (FeS-Cu₂S-Cu-Fe-Mo sample), were prepared and their friction behaviors and mechanical properties were compared. The results showed that MoS₂ reacted with the Cu-Fe matrix to produce FeS, metallic ternary sulfides, and Mo when sintered at 1050℃. The MoS₂-Cu-Fe and FeS-Cu₂S-Cu-Fe-Mo samples thereby exhibited similar characteristics with respect to phase composition, density, hardness, and tribological behaviors. Micrographs of the worn surfaces revealed that the stable friction regime for both composites stemmed from the iron sulfides friction layers rather than from the molybdenum sulfides layers.     

镀钨碳纳米管增强铜基复合材料的制备及性能

采用羰基热分解法对多壁碳纳米管表面进行镀钨处理,并以镀钨碳纳米管和电解铜粉为原料,进行机械球磨混粉和放电等离子体烧结,制备了镀钨碳纳米管/铜基复合材料.采用场发射扫描电镜观察了粉体和复合材料的组织形貌,并对复合材料物相进行了X射线衍射分析.探讨了镀钨碳纳米管含量和放电等离子体烧结温度对复合材料致密度、抗拉强度、延伸率和电导率的影响.结果表明,镀钨碳纳米管质量分数为1%和烧结温度为850℃时,复合材料的致密度、抗拉强度和电导率最高.与烧结纯铜相比,复合材料的抗拉强度提高了103.6%,电导率仅降低15.9%.     

Effect of sintering on the relative density of Cr-coated diamond/Cu composites prepared by spark plasma sintering

Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.     

Wettability and pressureless infiltration mechanism in SiC-Cu systems

The wetting behavior of copper alloys on SiC substrates was studied by a sessile drop technique. The microstructure of SiC_p/Cu composites and the pressureless infiltration mechanism were analyzed. The results indicate that Ti and Cr are effective elements to improve the wettability, while Ni, Fe, and Al have minor influence on the improvement of wettability. Non-wetting to wetting transition occurs at 1210 and 1190℃ for Cu-3Al-3Ni-9Si and Cu-3Si-2Al-1Ti, respectively. All the copper alloys react with SiC at the interface forming a reaction layer except for Cu-3Al-3Ni-9Si. High Si content favors the suppression of interracial reaction. The infiltration mechanism during pressureless infiltration is attributed to the decomposition of SiC. The beneficial effect of Fe, Ni, and Al is to favor the dissolution of SiC. The real active element during pressureless infiltration is Si.     

准脆性SiC_p/Al复合材料SHPB实验中入射波整形技术

针对陶瓷体积分数为50%的准脆性SiCp/Al复合材料恒应变率动态压缩实验,研究了入射波整形原则和理想入射波设计方法.结果表明:采用原始透射波和修正后反射波叠加设计的新入射波,通过控制整形器尺寸和子弹初速获得了理想的入射波,实现对准脆性复合材料的恒应变率加载;以测试材料力学特性为基础设计的整形器,可调整入射波形使之与透射波具有相同形状.针对准脆性SiCp/Al复合材料,SHPB实验中应变率只取决于入射波的幅值,而与整形后的入射波加载率关系不大,入射波中平台段实现试样的恒应变率变形;入射波形设计成梯形波,使之与SiCp/Al复合材料的透射波波形相似,实现了对复合材料的恒应变率加载.     

三维石墨烯/铜基复合材料的制备及耐腐蚀性能研究

在实际应用中,铜基复合材料经常存在腐蚀失效的现象,而石墨烯以其独特的结构显示出卓越的耐腐蚀性能。为了改善铜基复合材料的耐腐蚀性能,设计并烧结制备了三维石墨烯/铜基复合材料。研究表明,在三维石墨烯/铜基复合材料中,石墨烯形成三维互联互通结构,充分发挥了对铜基体的保护作用。与孔隙铜相比,在质量分数为3.5% NaCl溶液中,三维石墨烯/铜基复合材料的腐蚀速率降低了约50%。石墨烯在金属防腐蚀领域将得到更加广阔的应用。通过研究三维石墨烯/铜基复合材料在FeCl₃溶液中的腐蚀行为,进一步揭示了三维石墨烯的耐腐蚀机理。     

Influence of Cu content on the mechanical properties and corrosion resistance of Mg-Zn-Ca bulk metallic glasses

(Mg_66.2Zn_28.8Ca₅)_100?xCu_x (at%, x = 0, 1, 3, and 5) bulk metallic glasses (BMGs) of 2 mm in diameter were prepared by the conventional copper mold injection casting method. Besides, the influence of Cu content on the microstructure, thermal stability, mechanical properties, and corrosion behavior of Mg-Zn-Ca BMGs was investigated. It is found that the addition of Cu decreases the glass-forming ability of Mg-Zn-Ca BMGs. Crystalline phases are precipitated at a higher Cu content, larger than 3at%. The compressive fracture strength of Mg-Zn-Ca BMGs is enhanced by the addition of Cu. With the formation of in-situ composites, the compressive strength of the Mg-Zn-Ca alloy with 3at% Cu reaches 979 MPa, which is the highest strength among the Mg-Zn-Ca alloys. Furthermore, the addition of Cu also results in the increase of corrosion potential and the decrease of corrosion current density in Mg-Zn-Ca BMGs, thereby delaying their biodegradability.     

Preparation of spherical ultrafine copper powder via hydrogen reduction-densification of Mg(OH)2-coated Cu2O powder

A novel process was developed to produce spherical copper powder for multilayer ceramic capacitors (MLCC). Spherical ultrafine cuprous oxide (Cu₂O) powder was prepared by glucose reduction of Cu(OH)₂. The Cu₂O particles were coated by Mg(OH)₂ and reduced to metallic copper particles. At last, the copper particles were densified by high-temperature heat treatment. The products were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), tap density, and thermogravimetry (TG). It is found that the shape and size distribution of the copper powder are determined by the Cu₂O powder and the copper particles do not agglomerate during high-temperature heat treatment because of the existence of Mg(OH)₂ coating. After densification at high temperature, the particle tap density increases from 3.30 to 4.18 g/cm³ and the initial oxidation temperature rises from 125 to 150°C.     

Effects of boron on the microstructure and thermal properties of Cu/diamond composites prepared by pressure infiltration

Diamond reinforced copper (Cu/diamond) composites were prepared by pressure infiltration for their application in thermal management where both high thermal conductivity and low coefficient of thermal expansion (CTE) are important. They were characterized by the microstructure and thermal properties as a function of boron content, which is used for matrix-alloying to increase the interfacial bonding between the diamond and copper. The obtained composites show high thermal conductivity (>660 W/(m·K)) and low CET (<7.4×10-6 K-1) due to the formation of the B₁₃C₂ layer at the diamond-copper interface, which greatly strengthens the interfacial bonding. Thermal property measurements indicate that in the Cu-B/diamond composites, the thermal conductivity and the CTE show a different variation trend as a function of boron content, which is attributed to the thickness and distribution of the interfacial carbide layer. The CTE behavior of the present composites can be well described by Kerner’s model, especially for the composites with 0.5wt% B.     

Microstructures and properties of Al<Subscript>2</Subscript>O<Subscript>3</Subscript> dispersion-strengthened copper alloys prepared through different methods

Al₂O₃ dispersion copper alloy powder was prepared by internal oxidation, and three consolidation methods—high-velocity compaction (HVC), hot pressing (HP), and hot extrusion (HE)—were used to prepare Al₂O₃ dispersion-strengthened copper (Cu–Al₂O₃) alloys. The microstructures and properties of these alloys were investigated and compared. The results show that the alloys prepared by the HP and HE methods exhibited the coarsest and finest grain sizes, respectively. The alloy prepared by the HVC method exhibited the lowest relative density (98.3% vs. 99.5% for HP and 100% for HE), which resulted in the lowest electrical conductivity (81% IACS vs. 86% IACS for HP and 87% IACS for HE). However, this alloy also exhibited the highest hardness (77 HRB vs. 69 HRB for HP and 70 HRB for HE), the highest compressive strength (443 MPa vs. 386 MPa for HP and 378 MPa for HE), and the best hardness retention among the investigated alloys. The results illustrate that the alloy prepared by the HVC method exhibits high softening temperature and good mechanical properties at high temperatures, which imply long service life when used as spot-welding electrodes.     

316L不锈钢/Y-PSZ复合材料的制备与性能

采用粉末冶金方法制备了316L不锈钢/Y-PSZ复合材料,研究了316L不锈钢含量与粉末粒度对复合材料的显微组织、烧结收缩率、密度及硬度的影响.结果表明:随着316L含量的增加,复合材料的密度增高,相对密度和烧结收缩率逐渐降低,试样的HRC硬度值下降;在316L含量一定的情况下,随着316L颗粒尺寸的增大,复合材料的密度略有降低,相对密度和线收缩率逐渐减小,试样的HRC硬度值下降.在本文的研究条件下,所制备复合材料的相对密度值在92.5%～95.5%之间.     

原位合成CNTs/Cu-Al2O3复合材料的性能研究

对Al的质量分数分别为0.20%,0.35%,0.60%的Cu-Al合金粉末进行内氧化,得到Cu-Al₂O₃粉末。采用化学气相沉积法在Cu-Al₂O₃粉末表面原位生长碳纳米管(carbon nano tubes, CNTs),采用放电等离子烧结工艺成功制备了CNTs/Cu-Al₂O₃复合材料。采用扫描电子显微镜和透射电子显微镜观察了CNTs/Cu-Al₂O₃复合粉末、复合材料断口的形貌。采用显微硬度计、微拉伸试验机、摩擦磨损试验机分别对纯Cu及复合材料的维氏硬度、抗拉强度、摩擦因数进行测试。采用电化学工作站测试复合材料在3.5%NaCl (质量分数)水溶液中的耐腐蚀性能。结果表明,随着Al的质量分数的增加,粉末表面合成的CNTs的数量也增多。Al的质量分数为0.35%时,CNTs/Cu-Al₂O₃复合材料的综合性能最佳,与纯Cu相比,复合材料的抗拉强度和腐蚀电势分别提高了86.4%和43.2%,分别为315 MPa和-0.268 V,摩擦因数降低了53.3%,仅为0.28。     

自蔓延预热粉体爆炸固结Mo/Cu FGM

采用新型水介质双向爆炸固结装置,结合自蔓延预热粉体技术制备了Mo/Cu功能梯度材料(FGM).观测了Mo/Cu FGM的显微结构,分析了爆炸固结机制.所制备样品的相对密度从Mo层的94.2%到Cu层的98.4%,呈现良好的梯度变化,样品整体相对密度达95.5%.Mo/Cu FGM电导率为国际退火铜标准(IACS)的27%.第3层、第4层的热导率分别为204.76和249.71 W·m-1·K-1.Mo/Cu FGM第1层与第2层的剪切强度为214.8Mpa.     

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

Nickel-coated graphite flakes/copper (GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes (GFs) being modified by Ni-P electroless plating. The effects of the phase transition of the amorphous Ni-P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity (TC) of the GN/Cu composites were systematically investigated. The introduction of Ni-P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X-Y basal plane of the GF/Cu composites with 20vol%-30vol% graphite flakes. However, when the graphite flake content was greater than 30vol%, the TC of the GF/Cu composites decreased with the introduction of Ni-P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.     

Properties and corrosion behavior of Al based nanocomposite foams produced by the sintering-dissolution process

The properties of Al based nanocomposite metal foams and their corrosion behaviors were investigated in this study. For this, the composite metal foams with different relative densities (porosity) reinforced with alumina nanoparticles were prepared using a powder metallurgy-based sintering-dissolution process (SDP) and NaCl particles were used as space holders. Then, the effect of nanoparticle reinforcement and different amounts of NaCl space holders (corresponding porosity) on the microstructure, morphology, density, hardness, and electrochemical specifications of the samples were investigated. It was found that as the relative density increased from 60% to 70%, the wall thickness increased from about 200 to 300 μm, which led to a decrease in pore size. Also, the addition of nanoparticle reinforcement and the increased relative density result in increasing metal foam hardness. Moreover, electrochemical test results indicated that increasing the Al₂O₃ content reduced the corrosion rate, but increasing the porosity enhanced it.     

Effect of reinforcement content on the adhesive wear behavior of Cu10Sn5Ni/Si3N4 composites produced by stir casting

The main objective of this paper was to fabricate Cu10Sn5Ni alloy and its composites reinforced with various contents of Si₃N₄ particles (5wt%, 10wt%, and 15wt%) and to investigate their dry sliding wear behavior using a pin-on-disk tribometer. Microstructural examinations of the specimens revealed a uniform dispersion of Si₃N₄ particles in the copper matrix. Wear experiments were performed for all combinations of parameters, such as load (10, 20, and 30 N), sliding distance (500, 1000, and 1500 m), and sliding velocity (1, 2, and 3 m/s), for the alloy and the composites. The results revealed that wear rate increased with increasing load and increasing sliding distance, whereas the wear rate decreased and then increased with increasing sliding velocity. The primary wear mechanism encountered at low loads was mild adhesive wear, whereas that at high loads was severe delamination wear. An oxide layer was formed at low velocities, whereas a combination of shear and plastic deformation occurred at high velocities. The mechanism at short sliding distances was ploughing action of Si₃N₄ particles, which act as protrusions; by contrast, at long sliding distances, direct metal-metal contact occurred. Among the investigated samples, the Cu/10wt% Si₃N₄ composite exhibited the best wear resistance at a load of 10 N, a velocity of 2 m/s, and a sliding distance of 500 m.     

SiC_p/2024Al基复合材料的点蚀形貌

用扫描电镜对浸泡在w(NaCl)=3 5%水溶液中的SiCp/2024Al金属基复合材料(AlMMCs)的点蚀形貌进行了观察,作为对比,对其基体合金的点蚀行为也进行了研究·结果表明,SiCp/2024AlMMCs的点蚀形貌与SiC颗粒的体积分数和尺寸有关,SiC含量高或尺寸小的AlMMCs,其蚀孔数量较多,尺寸较小·与基体合金相比,AlMMCs的点蚀孔较大,数量较少,分布也较不均匀,甚至出现局部严重腐蚀的现象·能谱分析表明,SiCp/2024AlMMCs的腐蚀机制为富Cu阴极相与贫Cu阳极相间的电偶腐蚀·另外,SiC与Al间也存在电偶腐蚀倾向·