HV/CVD Grown Relaxed SiGe Buffer Layers for SiGe HMOSFETs

High-vacuum/chemical-vapor deposition (HV/CVD) system was used to grow relaxed SiGe buffer layers on Si substrates. Several methods were then used to analyze the quality of the SiGe films. X-ray diffraction and Raman spectroscopy showed that the upper layer was almost fully relaxed. Second ion mass spectroscopy showed that the Ge compositions were step-graded. Transmission electron microscopy showed that the misfit dislocations were restrained to the graded SiGe layers. Tests of the electrical properties of tensile-strained Si on relaxed SiGe buffer layers showed that their transconductances were higher than that of Si devices. These results verify the high quality of the relaxed SiGe buffer layer. The calculated critical layer thicknesses of the graded Si1-xGex layer on Si substrate and a Si layer on the relaxed SiGe buffer layer agree well with experimental results.     

硅锗合金氧化层中纳米结构的量子受限分析

在硅锗合金氧化层中发现锗纳米表层结构，并分析了其时应的PL谱结构。提出相对应的量子受限模型计算公式和算法，理论分析结果与实验结果拟合较好。     

SiGe合金氧化层中的纳米结构

我们在硅锗合金衬底上采用氧化等制膜方式生成零维和三维的纳米结构样品，用高精度椭偏仪(HPE)、卢瑟福背散射谱仪(RBS)和高分辨率扫描透射电子显微镜(HR-STEM)测量样品的纳米结构。并采用美国威思康新州立大学开发的Rump模拟软件对卢瑟福背散射谱(RBS)中的CHANNEL谱和RANDOM谱分别进行精细结构模拟。计算且测量出纳米氧化层与锗的纳米薄膜结构分布，并且反馈控制加工过程。优化硅锗半导体材料纳米结构样品的加工条件。我们在硅锗合金的氧化层表面中首次发现纳米锗量子点和量子层结构，我们首次提出的生成硅锗纳米结构的优化加工条件的氧化时间和氧化温度的匹配公式和理论模型与实验结果拟合得很好。     

硅锗合金氧化纳米结构的光致发光谱

首次发现硅锗合金氧化纳米结构中的锗纳米层的PL谱(5410A波长处的谱峰),采用量子受限模型分析PL谱结构得到的计算方法和结果与实验拟合较好.     

MECHANISM OF NANOSTRUCTURE IN OXIDATION OF Si1-xGex AL-LOYS

我们在硅锗合金衬底上采用氧化等制膜方式生成零维和三维的纳米结构样品,用高精度椭偏仪(HPE)、卢瑟福背散射谱仪(RBS)和高分辨率扫描透射电子显微镜(HR-STEM)测量样品的纳米结构,并采用美国威思康新州立大学开发的Rump模拟软件对卢瑟福背散射谱(RBS)中的CHANNEL谱和RANDOM谱分别进行精细结构模拟,计算且测量出纳米氧化层与锗的纳米薄膜结构分布,并且反馈控制加工过程,优化硅锗半导体材料纳米结构样品的加工条件.我们在硅锗合金的氧化层表面中首次发现纳米锗量子点和量子层结构,我们首次提出的生成硅锗纳米结构的优化加工条件的氧化时间和氧化温度的匹配公式和理论模型与实验结果拟合得很好.     

高浓度弛豫SiGe/SOI材料的制备研究

对SOl（绝缘体上的硅）衬底上外延生长的SiGe层进行了研究，并利用透射电镜、AES、Raman光谱、X-ray多晶衍射等技术对SiGe／SOI材料做了表征。结果表明：制备的材料中Ge／Si元素分布均匀，SiGe层是高度弛豫的，SiGe层中应变通过产生失配位错被释放出来。     

Fabrication of High Quality SiGe Virtual Substrates by Combining Misfit Strain and Point Defect Techniques

High quality strain-relaxed thin SiGe virtual substrates have been achieved by combining the misfit strain technique and the point defect technique.The point defects were first injected into the coherently strained SiGe layer through the "inserted Si layer" by argon ion implantation.After thermal annealing,an intermediate SiGe layer was grown with a strained Si cap layer.The inserted Si layer in the SiGe film serves as the source of the misfit strain and prevents the threading dislocations from propagating into the next epitaxial layer.A strained-Si/SiGe/inserted-Si/SiGe heterostructure was achieved with a threading dislocation density of 1×104cm-2 and a root mean square surface roughness of 0.87 nm.This combined method can effectively fabricate device-quality SiGe virtual substrates with a low threading dislocation density and a smooth surface.     

光子作用所形成的硅锗合金的多孔结构及其发光特性

将功率为75W、波长为1 064nm的YAG激光的散焦束斑辐照在SiGe合金表面上能够形成多孔硅锗结构,其硅纳晶和锗纳晶的尺寸和形貌有自身的特点.用514nm激光激发,在600nm到900nm波长范围有较强的光致荧光.与化学刻蚀方式生成的多孔硅锗样品相比较,其荧光发光的频谱分布较复杂.当激光辐照到锗纳晶颗粒较多的地方,荧光发光谱分布延伸至红外区域.文中分析了发光的机理,检测出光致荧光的增强与氧化硅表面无关,主要来自硅纳晶和锗纳晶的表面态.指出了激光辐照方式加工样品的优点.     

非晶/微晶相变区硅基薄膜太阳能电池研究进展

综述了非晶/微晶相变区硅基薄膜的微观结构、光电特性及其在太阳能电池中的应用进展.稳定优质的宽带隙初始晶硅薄膜处于非晶/微晶相变区的非晶硅一侧,其相比于非晶硅具有更高的中程有序性和更低的光致衰退特性.低缺陷密度的窄带隙纳米晶硅薄膜处于非晶/微晶相变区的微晶硅一侧,有效钝化的纳米硅晶粒具有较高的载流子迁移率和较好的长波响应特性.基于上述相变区硅薄膜材料的叠层电池已经达到13.6%的稳定转换效率.掺锗制备的硅锗薄膜可进一步降低薄膜的带隙宽度,引入相变区硅锗合金薄膜后,三结叠层电池初始效率已经达到16.3%,四结叠层太阳能电池理论效率可以超过20%.     

Fabrication of high quality strained SiGe on Si substrate by RPCVD

In this study,the growth kinetics of SiGe in a reduced pressure chemical vapor deposition system using dichlorosilane(SiH2Cl2) and germane(GeH4) as the Si and Ge precursors were investigated.The SiGe growth rate and Ge content were found to depend on the deposition temperature,GeH4 flow and reactor chamber pressure.The SiGe growth rate escalates with increasing deposition temperature,while the Ge content is reduced.The SiGe growth rate accelerates with increasing GeH4 flow,while the Ge content increases more slowly.According to the experimental data,a new relationship between Ge content(x) and F(GeH4)/F(SiH2Cl2) mass flow ratio is deduced:x2.5/(1x) = nF(GeH4)/F(SiH2Cl2).The SiGe growth rate and Ge content improve with increasing reactor chamber pressure.By selecting proper precursor flows and reactor pressure,SiGe films with the same Ge content can be fabricated at various temperatures.However,the quality of the SiGe crystals is clearly dependent on the deposition temperature.At lower deposition temperature,higher crystalline quality is achieved.Because the growth rate dramatically drops with lower temperatures,the optimum growth temperature must be a compromise between the crystalline quality and the growth rate.X-ray diffraction,Raman scattering spectroscopy and atomic force microscopy results indicate that 650°C is the optimum temperature for fabrication of Si0.75Ge0.25 film.     

Tuning the magnetic anisotropy in LSMO manganite films through non-magnetic nanoparticles

We report the observation of anomalous magnetic anisotropy driven by nonmagnetic ZrO2 nanoparticles in epitaxial La2/3Sr1/3MnO (LSMO) films grown on LaAlO3 (LAO) substrates. The compressive epitaxial strain imposed by the lattice mismatch of substrate and film is tuned by the density of ZrO2 nanoparticles embedded in the film matrix and affects the magnetic anisotropy as well as the magnetotransport properties. Epitaxial 54 nm thick LSMO thin films with different concentrations of ZrO2 nanoparticles demonstrate anisotropic hysteresis loops concomitant with anisotropic magnetotresistance behavior. The biaxial epitaxial strain, induced by the substrate/film lattice parameter mismatch is partially relaxed by increasing the density of precipitates and they serve as a tuning parameter for the strain state. We interpret our results by a strain-induced interplay of impurity scattering, weak localization and magnetic domain structure.     

Highly <Emphasis Type="Italic">C</Emphasis>-axis oriented LiNbO<Subscript>3</Subscript> thin film on amorphous SiO<Subscript>2</Subscript> buffer layer and its growth mechanism

LiNbO3 waveguiding films with highly C-axis orieatation and superior crystallographic quality have been deposited on the amorphous SiO2 buffer layer of Si wafer by pulsed laser deposition (PLD) technique. X-ray diffraction,high-resolution electron transmission microscopy and atomic force microscopy were applied to characterizing the quality and orientaion of LiNbO3 thin film, and the optimized depositioa coaditioas have been determined for C-axis oriented growth. LiNbO3 thin films on amorphous SiO2 buffer layer were composed of intimate arrangements of quadrangular single crystal domain (150 nm x 150 nm) with C-axis orientatioa, and displayed sharp interface structures. The measurements of prism coupling technique indicate that the laser can be coupled into the LiNbO3 film and TE and TM waveguiding modes were detected. In addition, the possible mechanism of oriented growth on amorphous buffer layer and “film-substrate effects“ were discussed briefly, which suggests that its growth mechanism is likely analogous to the Voimer model with characteristics of three-dimensional islands nucleation on the smooth crystal surface.     

不同退火条件对纳米Ge/Al2O3相嵌薄膜中纳米Ge颗粒的氧化态影响

采用脉冲激光沉积法制备了纳米Ge/Al2O3相嵌薄膜.用X射线光电子谱(XPS)研究了薄膜的热稳定性.结果表明纳米Ge颗粒的氧化态与已经发表的结果不同,而与Si的氧化态的结果相似.用纯高斯函数拟合可以得到Ge的四种不同的氧化态,分别为:Ge 1,Ge 2,Ge 3,Ge 4.这种大的差别来自纳米Ge颗粒的不同环境的影响.在真空退火条件下,由于缺少外部氧的供给和供给速度慢,很奇妙地,在薄膜表层的Ge 2,Ge 4氧化态不如其他氧化态和未氧化态(Ge0)稳定.而在清洁的大气环境退火条件下,外部氧的供给充分和供给速度快,在薄膜表层最稳定的氧化态是Ge 4.     

无机厚膜电致发光显示器件的研究

采用丝网印刷技术,在Al2O3陶瓷基板上印刷、高温烧结内电极及绝缘层,制备出陶瓷厚膜基板,进而制备了新型厚膜电致发光显示器(TDEL).整个器件结构为陶瓷基板/内电极/厚膜绝缘层/发光层/薄膜绝缘层/ITO透明电极.测试了器件的阈值电压、亮度与电压、亮度与频率关系,并对器件衰减特性进行了分析.结果显示厚膜电致发光器件比薄膜电致发光器件有更低的阈值电压和较小的介电损耗,有效地防止了串扰现象.     

SiGe开关功率二极管的计算机模拟及优化设计

介绍了新型SiGe开关功率二极管结构及机理，在对器件正反向特性进行模拟的基础上进一步进行了优化设计，并对其动态特性进行了模拟。与正反向特性模拟果综合比较得出，取20％的Ge含量和20nm的SiGe层厚时，器件性能最优。     

沉积温度对BC2N薄膜的生长和附着性的影响

应用热丝辅助射频等离子体化学气相沉积法在硅、金刚石衬底上合成了BC2N薄膜,X－射线衍射、红外谱分析表明较高的温度有利于BC2N化合物的成核和生长。高温制备的薄膜的化学组分主要为BC2N,B,C和N原子间互相结合成键,但与硅衬底的附着力很差。选择热膨胀系数与硅接近的金刚石作为过渡层沉积BC2N多层膜,逐层提高生长温度,不仅提高生长温度,不仅提高了薄膜中BC2N的含量,而且提高了薄膜与衬底的粘 附力。     

Effects of SrTiO3 buffer layer on structural and electrical properties of Bi3.15Nd0.85Ti3O12 thin films prepared by a chemical method

Ferroelectric Bi3.15Nd0.85Ti3O12 (BNT) thin films have been grown on Pt/Ti/SiO2/Si substrates at 750 ℃ by a chemical solution deposition method using SrTiO3 (STO) as a buffer layer.The influence of STO...     

基于MOVPE和MBE法生成的GaN薄膜的反射、透射光谱测量

使用紫外-可见光分光光度计,研究用金属有机物气相外延(MOVPE)方法生成在蓝宝石衬底上的GaN薄膜的反射光谱、透射光谱以及用分子束外延(MBE)方法生成在碳化硅衬底上GaN薄膜的反射光谱,结果表明,所测的GaN薄膜和体材料的光学吸收边出现在364 nm附近,对应的禁带宽度为3.41 eV.在两种不同衬底上,薄膜的反射谱由于材料晶格常数和热膨胀系数的不同有所差别.     

Polycrystalline ZnSx Se1—x thin films deposited on ITO glass by MBE

MBE growth of ZnSx Se1-x thin films on ITO coated glass substrates were carried out using ZnS and Se Sources with the substrate temperature ranging from 270℃ to 330℃.The XRD θ/2θ spectra resulted from these films indicated that the as-grown polycrystalline ZnSx Se1-x thin films had a preferred orientation along the (111) planes.The evaluated crystal sizes as deduced from the FWHM of the XRD layer peaks showed strong growth temperature dependence,with the optimized temperature being about 290℃.Both AFM and TEM measurements of these thin films also indicated a similar growth temperature dependence.Hing qual-ity ZnSx Se1-x thin film growm at the optimized temperature had the smoothest surface with lowest RMS valus of 1.2 nm and TEM cross-sectional micrograph showing a well defined columnar structure.     

热释电薄膜在红外探测器中的应用与研究进展

探讨了热释电效应及热释电薄膜红外探测器的工作模式,特别是探测器单元对热释电薄膜的材料与低温生长要求.为了克服薄膜生长过程中较高的基片温度对ROIC的破坏性影响,一方面发展了离子束辅助沉积、外延缓冲层等多种低温生长技术;另一方面发展了复合探测器结构设计,已研制出了性能良好的铁电薄膜非制冷红外焦平面阵列,其NEDT可达20 mK.