| 回流次数对Sn3.5Ag0.5Cu焊点特性的影响 |
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| 引用本文： | 吴丰顺,张伟刚,吴懿平,安兵.回流次数对Sn3.5Ag0.5Cu焊点特性的影响[J].华中科技大学学报(自然科学版),2006,34(10):97-99. |
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| 作者姓名： | 吴丰顺 张伟刚 吴懿平 安兵 |
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| 作者单位： | 1. 华中科技大学,塑性成形模拟及模具技术国家重点实验室
2. 华中科技大学,塑性成形模拟及模具技术国家重点实验室;华中科技大学,武汉光电国家实验室(筹),湖北,武汉,430074 |
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| 基金项目： | 国家自然科学基金;湖北省自然科学基金 |
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| 摘 要： | 研究了回流次数对Sn3．5Ag0．5Cu焊点特性的影响，采用扫描电镜SEM和光学显微镜对多次回流后Sn3．5Ag0．5Cu焊点界面金属间化合物（IMC）层的形貌和拉伸断裂断口形貌进行了分析．结果表明：随着回流次数的增加，焊点的宽度和金属间化合物的厚度增加；焊料和凸点下金属化层（UBM）之间界面上的IMC组织从针状逐渐粗化；焊料的拉伸强度有轻微变化；断裂面第一次回流焊后出现在焊料中，而多次回流焊后断裂面部分出现在焊料中，部分出现在UBM和焊料的界面中．
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| 关 键 词： | 回流焊 回流次数 凸点下金属化层 金属间化合物 |
| 文章编号： | 1671-4512（2006）10-0097-03 |
| 收稿时间： | 2005-10-25 |
| 修稿时间： | 2005年10月25 |
Effects of reflow's cycles on the properties of solder joints with Sn3.5Ag0.5Cu |
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| Wu Fengshun,Zhang Weigang,Wu Yiping,An Bing.Effects of reflow''''s cycles on the properties of solder joints with Sn3.5Ag0.5Cu[J].JOURNAL OF HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY.NATURE SCIENCE,2006,34(10):97-99. |
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| Authors: | Wu Fengshun Zhang Weigang Wu Yiping An Bing |
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| Abstract: | The morphology of interfacial intermetallic compounds (IMC) and the fratography of solder joints with Sn3.5Ag0.5Cu were analyzed by scanning electron microscopy(SEM) and microscope,when reflows were carried out many times.The results show that the width of the joint and the mean thickness of interfacial IMC increase as the cycles of reflow increases.The morphology of IMCs at solder/under bump metallurgy(UBM) interface was needle-like after reflow was carried out firstly and was coarsened after following reflows were done.Some of them spalled into the solder joint.The tensile strength changed slightly in the same condition.The tensile fracture surface was found in the solder after reflow was done firstly.The fracture surface was seen in the solder partly and the one was seen in the interface between UBM and solder partly, after reflows were carried out many times. |
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