| 基于TMR的FPGA单粒子加固试验探究 |
| |
| 引用本文： | 黄锦杰,孙鹏,沈鸣杰,俞军.基于TMR的FPGA单粒子加固试验探究[J].复旦学报(自然科学版),2011(4). |
| |
| 作者姓名： | 黄锦杰 孙鹏 沈鸣杰 俞军 |
| |
| 作者单位： | 复旦大学专用集成电路与系统国家重点实验室;上海复旦微电子股份有限公司; |
| |
| 摘 要： | 设计了一个可对基于静态随机存储器的现场可编程门阵列进行单粒子效应测试的系统.采用三模冗余和定时回读重配的方法对待测器件进行单粒子加固.测试电路为移位寄存器链,定时回读的间隔约为80 ms,测试时钟为10 MHz.在非辐照环境下先进行了单粒子翻转的仿真试验,获得系统基本参数后,在兰州中科院近代物理研究所进行了重离子单粒子效应辐照试验.试验芯片为商用FPGA,辐照试验增加单粒子闩锁监控,观察不同注量率下待测器件的加固效果.分析仿真试验与辐照试验结果,系统可正确实现加固与测试功能,也证明三模冗余技术结合回读重配方法能够提高FPGA芯片的单粒子加固能力.
|
| 关 键 词： | 三模冗余 基于静态随机存储器的 现场可编程门阵列 单粒子加固 回读重配 |
Test and Inquiry of FPGA SEU-Hardening by TMR |
| |
| HUANG Jin-jie,SUN Peng,SHEN Ming-jie,YU Jun.Test and Inquiry of FPGA SEU-Hardening by TMR[J].Journal of Fudan University(Natural Science),2011(4). |
| |
| Authors: | HUANG Jin-jie SUN Peng SHEN Ming-jie YU Jun |
| |
| Institution: | HUANG Jin-jie1,2,SUN Peng2,SHEN Ming-jie2,YU Jun1,2(State Key Laboratory of ASIC and System,Fudan University,Shanghai 201203,China,Shanghai Fudan Microelectronics.Co.ltd,Shanghai 200433,China) |
| |
| Abstract: | A testing system for SRAM-based FPGA SEE(single event effect) has been designed.The DUT(device under test) was SEU(single event upset)-hardened by TMR(triple module redundant) and periodic read-back and reconfiguration.The circuit of DUT was shift-register chain.Interval of read-back was about 80 ms,and test clock was of 10MHz.After some basic parameters was reached by a series of simulation test,the heavy ions radiation test was carried out in Institute of Modem Physics,CAS,Lanzhou.Test chip was a commerci... |
| |
| Keywords: | TMR SRAM-based FPGA SEU-hardening read-back and reconfiguration |
| 本文献已被 CNKI 等数据库收录！ |
|
