直流和脉冲电沉积Cu-nanoAl_2O_3复合镀层晶体结构比对研究

用直流和脉冲电镀法,分别制备了Cu-nanoAl2O3复合镀层.通过扫描电镜(SEM)观察了镀层的表面微观形貌.结果显示,与直流镀层形貌相比,脉冲电镀法制备的复合镀层组织进一步得到细化,晶粒尺寸减小,晶粒大小均匀,堆积较为紧密,且具有明显方向性.用X射线衍射仪分析了镀层的微观晶体结构,探讨了不同沉积方式对镀层沉积和生长过程的影响.结果表明,不同的沉积方式使镀层的晶体择优取向发生变化,脉冲电镀使晶粒细化,并且晶格点阵常数变大,晶格畸变增大.

Comparison between crystal structures of Cu-nanoAl_2O_3 composite coatings prepared by direct and pulse electrodeposition

The Cu-nanoAl2O3 composite coatings were prepared by direct and pulse electrodeposition(named DC and PC),respectively.The results from scanning electron microscope(SEM) indicate that compared with DC,the morphology of PC illustrates has the following features.The surface texture is more fine,and the crystallline granules on sueface are more uniform,and dense.Additionally,the orientation of the granules is enhanceed.The results from X-ray diffract ion indicate that the preferential orientation and granules s...