氮化镓晶片的化学机械抛光工艺

研究了抛光工艺参数对氮化镓(GaN)化学机械抛光(CMP)表面形貌和材料去除率的影响。通过精密分析天平和原子力显微镜对其材料去除率和表面形貌进行分析,采用单因素及正交实验法探究压力、抛光盘转速和氧化剂浓度对GaN材料去除率和表面形貌的影响。结果表明:在下压力为14.1×10~4 Pa、抛光盘转速为75 r/min、H_2O_2浓度为0.8%、SiO_2磨粒为30%、抛光液流量为20 mL/min、抛光时间为15 min的条件下,GaN晶片表面材料去除率最大达到103.98 nm/h,表面粗糙度最低为0.334 nm。可见,在优化后的工艺参数下采用化学机械抛光,可同时获得较高的材料去除率和高质量的GaN表面。     

Si图形衬底的制备及半极性GaN生长

利用KOH溶液的各向异性腐蚀,通过研究温度、异丙醇(IPA)及超声波振动对Si衬底腐蚀的影响,在Si(001)平面衬底上刻蚀出侧面为(111)面的槽状图形衬底.在此基础上,实现了GaN在Si图形衬底(111)侧面的生长.X射线双晶衍射测量GaN薄膜的Bragg角为18.45°,表明在Si图形衬底上成功生长出了(1-101)半极性GaN薄膜.其X射线衍射峰半高宽为1 556弧秒.     

Effect of reactor pressure on the growth rate and structural properties of GaN films

The effect of reactor pressure on the growth rate, surface morphology and crystalline quality of GaN films grown on sapphire by metalorganic chemical vapor deposition is studied. The results show that as the reactor pressure increases from 2500 to 20000 Pa, the GaN surface becomes rough and the growth rate of GaN films decreases. The rough surface morphology is associated with the initial high temperature GaN islands, which are large with low density due to low adatom surface diffusion under high reactor pressure. These islands prolong the occurrence of 2D growth mode and decrease the growth rate of GaN film. Meanwhile, the large GaN islands with low density lead to the reduction of threading dislocation density during subsequent island growth and coalescence, and consequently decrease the full width at half maximum of X-ray rocking curve of the GaN film.     

氮化衬底对MOCVD生长GaN的影响

采用MOCVD生长技术以Al2O3为衬底对GaN生长进行了研究．用霍尔测量技术、光致发光技术以及光学显微镜测量了GaN的电学性能、光学性能以及表面形貌．研究表明，GaN低温缓冲层生长之前的氮化衬底工艺对GaN外延层表面形貌、发光性能、电学性能有显著影响．合适的氮化衬底条件可得到表面形貌、发光性能和电学性能均较好的GaN外延膜．研究表明长时间氮化衬底使GaN外延膜表面粗糙的原因可能是由于氮化衬底影响了后续高温GaN的生长模式，促使GaN三维生长所导致的．     

KOH溶液制作类圆形硅膜阵列研究

由于单晶硅在碱性腐蚀液中的腐蚀速率呈各向异性,在圆形掩膜下很难实现圆形单晶硅膜的制作.利用添加剂异丙醇(IPA)来改善KOH的腐蚀特性,在KOH与IPA混合腐蚀液体系中制备出类圆形硅膜阵列.通过扫描电镜观察腐蚀图形形貌,结果表明带有图案的N型衬底在质量分数为40%的KOH和IPA构成的混合溶液中,腐蚀出底面平整侧壁光滑的圆形硅膜阵列,并且初步探讨导电类型对腐蚀形貌影响机制.     

化学镀法制备电磁屏蔽聚酯织物的研究

为开发具有电磁屏蔽作用的织物,采用化学镀法制备了具有电磁屏蔽性能的聚酯类化纤织物,并研究了化学处理方法——碱减量处理对涤纶织物表面化学镀层的性能及化学镀后织物的电磁屏蔽性能的影响。研究表明,在20g/LNaOH溶液中处理既可使纤维表面形成微观凹坑,增大比表面积,又可改非极性的疏水表面为亲水表面,提高表面活性,提高敏化和活化时金属离子和金属在纤维表面的吸附性,在化学镀过程中使基体与金属形成平整的结合。碱减量处理2～3h有利于提高镀层与织物结合牢度,并使镀层光亮均匀,电磁屏蔽性能更加优异。     

Fabrication and photoluminescence of GaN nanowires prepared by ammoniating Ga_2O_3/BN films on Si substrate

GaN has been considered to be the most promising optoelectronic material for such applications as light emitting diodes (LEDs), laser diodes (LDs) as well as high power electronic devices, due to its large direct energy band gap of 3.39 eV at room tempera…     

纳米压印技术制备Si基GaN纳米柱图形化衬底

采用纳米压印和反应离子刻蚀技术,通过实验研究反应离子刻蚀时间与GaN纳米柱高度的相关性,成功地在Si基GaN衬底上制备出了GaN纳米柱图形化衬底。SEM表征分析发现在图形化衬底上所制备的GaN纳米柱形貌均匀、排列整齐;室温光致发光光谱分析发现GaN纳米柱图形化衬底与GaN材料相比带边发光峰出现2．1nm的红移,发光强度增强。研究结果表明GaN纳米柱内应力得到释放且具有光子晶体的作用。     

Effect of TMGa flux on GaN films deposited on Ti coated on glass substrates at low temperature

Highly c-axis-oriented GaN films were deposited on Ti coated glass substrates using low temperature electron cyclotron resonance plasma enhanced metal organic chemical vapor deposition system(ECR-PEMOCVD)with trimethyl gallium(TMGa)as gallium source.The influence of TMGa flux on the properties of GaN films were systematically investigated by reflection high energy electron diffraction(RHEED),X-ray diffraction analysis(XRD),atomic force microscopy(AFM)and Raman scattering.The GaN film with small surface roughness and high c-axis preferred orientation was successfully achieved at the optimized TMGa flux of 1.0 sccm.The ohmic contact characteristic between GaN and Ti layer was clearly demonstrated by the near-linear current-voltage(I-V)curve.The GaN/Ti/glass structure has great potential to dramatically improve the scalability and reduce the cost of solid-state lighting light emitting diodes.     

Fabrication and photoluminescence of GaN nanowires prepared by ammoniating GaeO3/BN films on Si substrate

GaN nanowires were successfully prepared on Si（111） substrate through ammoniating Ga203/BN films deposited by radio frequency magnetron sputtering system. The synthesized nanowires were confirmed as hexagonal wurtzite GaN by X-ray diffraction, selected-area electron diffraction and Fourier transform infrared spectra. Scanning electron microscopy and transmission electron microscopy revealed that the grown GaN nanowires have a smooth and clean surface with diameters ranging from 40 to 160 nm and lengths typically up to several tens of micrometers. The representative photoluminescence spectrum at room temperature exhibited a strong UV light emission band centered at 363 nm and a relative weak purple light emission peak at 422 nm. The growth mechanism is discussed briefly.     

射频等离子体聚合多层复合薄膜的制备及性能

采用等离子体聚合方法,分别以甲基丙烯酸甲酯、正硅酸乙酯和甲基丙烯酸三氟乙酯为原料制备了3种聚合物薄膜,并利用扫描电镜(SEM)、原子力显微镜(AFM)、紫外可见光谱(UV-vis)和接触角(ContactAngle)等方法研究了不同条件下所得的聚合物薄膜的表面形貌、表面粗糙度、光学透明性及疏水性等性能.研究结果表明:聚甲基丙烯酸甲酯薄膜具有最好的可见光透过率和最佳的表面粗糙度(RMS).聚正硅酸乙酯薄膜的表面粗糙度随射频功率变化不大.聚甲基丙烯酸三氟乙酯薄膜在低功率下有较低的表面粗糙度,但随着入射功率的增加,等离子体刻蚀作用使得表面粗糙度增加.SEM照片表明聚甲基丙烯酸甲酯薄膜表面平坦致密无针孔.静态接触角测试结果表明三种聚合物薄膜都有较好的疏水性能,以聚甲基丙烯酸三氟乙酯薄膜的疏水性能最佳.利用等离子连续聚合的方法制备了聚甲基丙烯酸甲酯薄膜/聚正硅酸乙酯/聚甲基丙烯酸三氟乙酯3层复合薄膜,并对复合膜的性能进行了表征.     

Wafer-scale graphene on 2 inch SiC with uniform structural and electrical characteristics

Wafer-scale graphene on SiC with uniform structural and electrical features is needed to realize graphene-based radio frequency devices and integrated circuits.Here,a continuous bi/trilayer of graphene with uniform structural and electrical features was grown on 2 inch 6H-SiC (0001) by etching before and after graphene growth.Optical and atomic force microscopy images indicate the surface morphology of graphene is uniform over the 2 inch wafer.Raman and transmittance spectra confirmed that its layer number was also uniform.Contactless resistance measurements indicated the average graphene sheet resistance was 720 /with a non-uniformity of 7.2%.Large area contactless mobility measurements gave a carrier mobility of about 450 cm2 /(V s) with an electron concentration of about 1.5×10 13 cm2.To our knowledge,such homogeneous morphology and resistance on wafer scale are among the best results reported for wafer-scale graphene on SiC.     

镍钝化多孔硅表面形貌的控制和光致发光性能的改善

利用水热技术制备了系列镍钝化多孔硅样品,并对其表面形貌和光致发光谱进行了研究。实验表明,样品的表面形貌与其光致发光特性之间存在强烈的关联:采用具有较低Ni~(2 )浓度的腐蚀液所制备的样品表面形貌更为均匀,并具有相对较强的发光和较窄的发光峰。初步探索了通过对样品表面形貌的控制来改善样品发光性能的有效途径。     

氢氧化钠刻蚀多孔氧化铝表面形貌与疏水性能相关关系

以多孔阳极氧化铝(AAO)膜为基材,用氢氧化钠溶液进行化学腐蚀,控制适当的条件,得到了不同形貌的AAO基氧化铝表面.采用氟硅烷修饰后,对其进行了接触角测试、X射线光电子能谱(XPS)分析和扫描电子显微镜(SEM)形貌表征.结果表明:刻蚀过程中,AAO膜多孔表面层及多孔本体层中孔壁较薄的部分首先被溶断,样品干燥过程中,在水的表面张力的作用下形成了沟壑状微米级狭长裂缝.当AAO膜本体层大部分孔壁被溶断后,就形成了氧化铝纳米线.在其自身重力及水的表面张力的作用下,氧化铝纳米线聚积成微米级簇状结构,从而形成蜂巢状微米纳米相结合的双尺度阶层结构.这种蜂巢状结构修饰氟硅烷后,其对水的静态接触角(151.7°)远远高于氟硅烷修饰的纳米孔洞结构表面(138.3°)和光滑表面(101°).     

金属辅助化学刻蚀法制备尺寸可控的硅纳米线

为制备粗细均匀、大长度的硅纳米线,通过金属辅助化学刻蚀方法,以银作为辅助金属,利用场发射扫描电镜(FESEM)和FIB/SEM双束系统作为检测手段,结合微加工工艺,研究了不同的反应离子刻蚀时间和化学刻蚀时间对制备的硅纳米线的尺寸和形貌的影响。结果表明,通过该方法制备的硅纳米线粗细均匀、长度较大。控制反应离子刻蚀时间和化学刻蚀反应时间,可以控制硅纳米线的形貌与尺寸。     

电化学脉冲腐蚀制备均匀发光多孔硅

采用脉冲腐蚀和直流电化学腐蚀两种方法制备多孔硅,对这两种方法制备的多孔硅样品进行了扫描电镜和荧光光谱测量,发现脉冲腐蚀制备的多孔硅样品比直流腐蚀制备的多孔硅样品表面均匀、硅丝或者硅柱的尺寸较小、发光强度大,而且发光峰位有明显.的蓝移现象.同时我们还发现多孔硅样品的尺寸越小其能带越宽,由此得出多孔硅样品的发光现象符合量子限域解释的多孔硅的发光机制.     

GaN基二维八重准晶光子晶体制备与应用

针对半导体发光管（LED）器件普遍存在的出光效率低下的问题,首次采用聚焦离子束技术成功地在GaN基发光器件上制备了GaN二维八重准晶光子晶体（2D-8PQCs）结构。并将二维八重准晶光子晶体应用于电注入器件,当刻蚀孔径为600nm,空气填充因子为30％时,得到了表面出光效率高达2.5倍的增强。通过微区电致发光与发光图样的研究,证实二维八重准晶光子晶体结构抑制了导波模式的传播,将LED中导波模式耦合到辐射模式,从而起到改进表面出光的作用。上述结果为二维准晶光子晶体在GaN基发光器件中的应用提供了一种可能的途径。     

MOCVD GaN/InN/GaN量子阱的应变表征

采用MOCVD外延生长11周期InN/GaN量子阱结构样品,原子力显微镜表面形貌结果显示实现了台阶流动生长模式.通过高分辨率X射线衍射与掠入射X射线反射谱技术获得了阱层与垒层的实际厚度.从(102)非对称衍射面与(002)对称衍射面的倒异空间图,确认了InN阱层处于与GaN共格生长的完全应变状态,获得了GaN缓冲层的晶体质量信息及其c轴与a轴晶格常数,确认外延层因受衬底热失配的影响处于压应变状态.     

镁合金表面激光刻蚀精密打标应用

镁合金具有比强度高、减振性和电磁屏蔽性好等优点,在电子产品上有越来越多的应用。镁合金电子产品的徽标及文字特征标识可以采用激光刻蚀打标方法,速度快、精度高、适应性广。针对激光种类及其参数对镁合金刻蚀的影响尚缺乏定量化的研究这一现状,本文利用光纤激光打标机进行打标实验,结合表面形貌的特征分析了激光种类和参数的影响,总结了镁合金激光精密打标技术的特点与应用。     

Characterization and application of Cu based superhydrophobic catalyst

Superhydrophobic (SH) Copper salt was prepared with the help of three different chemical etching agents and characterized by various analytical techniques like Fourier transform infrared (FTIR) spectroscopy, UV–visible spectroscopy, X-ray diffractogram (XRD), X-ray photoelectron spectroscopy (XPS), high resolution transmission electron microscopy (HRTEM) and scanning electron microscopy (SEM). The SH nature of the material was confirmed by water contact angle (WCA) measurement. Cu surface with the etching agent was made to produce SH Cu surface. Among the chemical etching agents the system with Cl, F and Si exhibited the SH character. The SH hierarchically structured heterogeneous materials produced were used as a catalyst for the reduction of Cr(VI) and 4-nitrophenol (NiP). The catalytic activities of the materials were compared on the apparent rate constant (k_app) and induction time (T_i). Among the catalyst systems used, the Cu-Trichoropentaflourooctylsilane (TCPFOSi) system exhibited the highest k_app and T_i values.