Transient photoconductivity in a-(Se80Te20)100 xAgx (0rxr4) thin films

Bulk material of (Se80Te20)100 xAgx (0rxr4) system was prepared by using a conventional melt quenching technique. Thin films of a-(Se80Te20)100 xAgx (0rxr4) were deposited by the vacuum evaporation technique at a base pressure of 10 4 mbar onto well-cleaned glass substrates. Temperature dependence of electrical conductivity in the temperature range of 263–333 K has been studied. There is increase in the value of conductivity with increase in temperature as well as with Ag content. The measurements of intensity dependence of photoconductivity show that the photoconductivity increases with intensity as a power law where the power is found to be between 0.5 and 1.0, representing the continuous distribution of traps. Rise and decay of photocurrent with time at room temperature at different light intensities for (Se80Te20)98Ag2 thin film samples have also been reported. The results have been explained on the basis of the Dember voltage and interaction between photoexcited holes and the trapped electrons on the surface.     

One-pot hydrothermal synthesis and fabrication of kesterite Cu2ZnSn(S,Se)4 thin films

Kesterite Cu_2Zn Sn(S,Se)_4(CZTSSe)powder was synthesized by a hydrothermal process.The thin films were fabricated by physical vapor deposition of CZTSSe powder followed by a thermal annealing process.The kesterite microstructure was identified by the X-ray diffraction and Raman spectroscopy.The morphology and elemental composition of CZTSSe thin films were also investigated.The dependence of resistance on the temperature of CZTSSe film was measured and the thermal activation energy of conductivity was estimated to be 0.33 eV based on Arrhenius plot of resistance versus temperature.A high absorption coefficient(10~4cm~(-1))of CZTSSe was found in the visible and NIR regions of the spectrum.A direct band gap structure with band gap energy of 1.46 eV was also estimated for CZTSSe films.The photoconductivity was measured under both AM 1.5G and NIR illumination and a stable and fully recoverable photoconductivity was observed for both asdeposited and annealed CZTSSe films.The annealed films show a higher photoconductivity than the as-deposited films under both AM 1.5G and NIR lights.     

热处理温度对溶胶-凝胶法制备的Ce_(0.97)Co_(0.03)O_2薄膜结构和光学性能的影响

采用溶胶-凝胶法,在Si(100)衬底上制备了3%Co掺杂CeO2薄膜,研究了不同热处理温度对Ce0.97Co0.03O2薄膜结构和光学性质的影响。X射线衍射(XRD)表明,3%Co掺杂CeO2薄膜为多晶薄膜,且未破坏CeO2原有的结构,随着退火温度的升高,晶粒尺寸逐渐增大。椭偏光谱法研究表明,Ce0.97Co0.03O2薄膜的光学常数(折射率n、消光系数k)随着退火温度增加而增大,光学带隙Eg随退火温度增加而减小,这是薄膜结构随退火温度增加发生变化所致。     

Bi_(1.6)La_(0.4)Ti_2O_7薄膜的制备及性能研究

采用化学溶液沉积法在ITO基片上制备不同退火温度的掺镧钛酸铋Bi1.6La0.4Ti2O7(BLT)薄膜。研究了其结构、介电性能、漏电流密度与外加电压I-V关系曲线和光学带隙。XRD射线衍射测试结果表明,经500、550、600℃1 h退火后的薄膜的主晶相为烧绿石结构,无杂相生成,600℃时BLT薄膜衍射峰比其他两种温度的强。在1 kHz频率下测得的介电常数、损耗因子分别为114,3%;129,3%;194,6%。BLT薄膜的漏电流密度与外加电压关系曲线表明,BLT薄膜600℃的漏电流比550和500℃稍微减小。通过透射谱分析得到BLT薄膜的光学带隙几乎不受温度影响,均为3.7 eV。这些结果表明制备BLT固溶体薄膜较佳为退火温度600℃,具有较好的性能,在光电器件有良好的应用前景。     

Optical parameters induced by phase transformation in RF magnetron sputtered TiO2nanostructured thin films

Pure TiO2 thin films were deposited onto quartz substrates using a ceramic TiO2 target at an elevated substrate temperature of 573 K by RF magnetron sputtering, and an analysis of structural, optical and photoluminescence characteristics of the films upon phase transformation is reported in this paper. Structural investigations using X-ray diffraction revealed that the as-deposited film was amorphous in nature. Thermal annealing for 2 h at 873 K in air resulted in the formation of anatase phase, and a phase transformation to rutile was observed at 1073 K.An increase in grain size and an improvement in crystallinity were also observed on annealing. Rod- like rutile crystallites were observed in the SEM images of the film annealed at 1273 K. As-deposited films and films annealed up to 1073 K were highly transparent in the visible region with a transparency 480%. Optical band gap of the films decreased upon thermal annealing which is attributed to phase transformation from amorphous to anatase and then to rutile. Optical parameters such as refractive index, optical conductivity and optical dielectric constant increased with increase in annealing temperature. Since rutile is the optically active phase, the superior refractive index of the film annealed at 1073 K along with its high transparency in visible region suggests the application of this film in antireflective coatings. Photoluminescence emission of maximum intensity was observed for the film annealed at 873 K, which exhibits anatase phase. Intense blue emission observed in this film makes it suitable for use in optoelectronic display devices.     

退火对非晶态碲镉汞薄膜稳定态光电导的影响

利用射频磁控溅射方法,在宝石衬底上制备了非晶态碲镉汞(a-HgCdTe)薄膜。对原生a-HgCdTe薄膜进行了不同退火时间和不同退火温度的热退火,在80～300K温度范围内,分别测量了原生和退火处理后的a-HgCdTe薄膜样品的稳定态光电导,研究了退火时间和退火温度对非晶态HgCdTe薄膜的稳定态光电导和激活能的影响。结果表明,原生和退火a-HgCdTe薄膜的稳定态光电导具有热激活特性;随着退火时间增加或退火温度升高,a-HgCdTe薄膜的晶化程度提高,导致光电导增大,光电导激活能降低。利用非晶-多晶转变机制讨论了实验结果。     

Tailoring of microstructure and martensitic transformation of nanocrystalline Ti–Ni-Hf shape memory thin film

The amorphous Ti-Ni-Hf thin films with the specific compositions were prepared from single Ti-Ni-Hf alloy target by adjusting processing parameters of direct current magnetron sputtering deposition. Prior to the crystallization,a glass transition occurred in the present Ti-Ni-Hf thin films. The annealed Ti-Ni-Hf thin films were characterized by the nano-crystalline. With the annealing temperature increasing, the grain size firstly increased and then decreased owing to the presence of(Ti,Hf)_2Ni precipitate. Two endothermic and exothermic peaks corresponding to B19'■B2 martensitic transformation in heating and cooling curves were observed for the Ti-Ni-Hf thin films with the lower annealing temperature and shorter annealing time, which was closely related to the inhomogeneous composition. However, the Ti-Ni-Hf thin films annealed at higher annealing temperature and longer annealing time showed the single stage B19'■B2 martensitic transformation. In addition, the martensitic transformation temperatures firstly increased and then decreased with the annealing temperatures rising.     

化学溶液沉积法制备BiFeO_3薄膜的结构及性能研究

采用化学溶液沉积法在ITO玻璃基片上制备铁酸铋Bi Fe O3薄膜。薄膜呈纯钙钛矿结构,无杂相生成。此外,薄膜表面光滑致密、没有微裂痕。薄膜得到的晶粒尺寸较小,约为45 nm。在550℃1 h退火的薄膜有良好的电学特性,在1 k Hz频率下测得的相对介电常数、损耗因子分别约为198、3%;此外,在760 k V/cm电场驱动下,薄膜得到的剩余极化(2Pr)约为25μC/cm2,矫顽电场(2Ec)约为650 k V/cm。BFO薄膜在550℃退后,通过吸收光谱分析得到BFO薄膜的光学带隙为2.7 e V。这些结果表明,退火温度550℃制备的Bi Fe O3固溶体薄膜具有较好的性能,有望成为光电器件的候选材料。     

Electrodeposition and characterization of thermoelectric Bi<Subscript>2</Subscript>Se<Subscript>3</Subscript> thin films

Bi₂Se₃ thin films were electrochemically deposited on Ti and indium tin oxide-coated glass substrates, respectively, at room temperature, using Bi(NO₃)₃·5H₂O and SeO₂ as starting materials in diluted HNO₃ solution. A conventional three-electrode cell was used with a platinum sheet as a counter electrode, and a saturated calomel electrode was used as a reference electrode. The films were annealed in argon atmosphere. The influence of cold isostatic pressing before annealing on the microstructure and thermoelectric properties of the films was investigated. X-ray diffraction analysis indicates that the film grown on the indium tin oxide-coated glass substrate is pure rhombohedral Bi₂Se₃, and the film grown on the Ti substrate consists of both rhombohedral and orthorhombic Bi₂Se₃.     

Preparation of Cu（In,Ga）Se2 thin film by sputtering from Cu（In,Ga）Se2 quaternary target

Cu(In,Ga)Se2 (CIGS) thin films were prepared by directly sputtering Cu(In,Ga)Se2 quaternary target consisting of Cu:In:Ga:Se 25:17.5:7.5:50 at%. The composition and structure of CIGS layers have been investigated after annealing at 550 ℃ under vacuum and a Se-containing atmosphere. The results show that recrystallization of the CIGS thin film occurs and a chalcopyrite structure with a preferred orientation in the (112) direction was obtained. The CIGS thin film annealed under vacuum exhibits a loss of a portion of Se, while the film annealed under Se-containing atmosphere reveals compensation of Se. Several solar cells with three different absorber thicknesses were fabricated using a soda lime glass/Mo/CIGS/CdS/i-ZnO/ZnO:Al/Al grid stack structure. The highest conversion efficiency of 9.65% with an open circuit voltage of 452.42 mV, short circuit current density of 32.16 mA cm2 and fill factor of 66.32% was obtained on a 0.755 cm2 cell area.     

溅射功率对氧化铝薄膜结构和光学性能的影响

采用射频反应磁控溅射法,在K9双面抛光玻璃基底上制备了一系列不同溅射功率的Al2O3薄膜,并对部分薄膜进行退火处理.利用X线衍射法对Al2O3薄膜退火前后的晶体结构进行分析,采用椭圆偏振光谱仪对薄膜的厚度、折射率和消光系数进行测试和拟合.实验结果表明:测射功率在100~300 W时,沉积的Al2O3薄膜退火前后均为非晶态;薄膜在可见光范围内具有良好的透光性能,透射率接近90%,为透明膜;薄膜的沉积速率随溅射功率的增大而增大;薄膜在可见光波段的折射率n随波长的增大而减小,平均值随溅射功率的增大呈现出先增大后减小的变化趋势;薄膜消光系数k的平均值亦随溅射功率的增大呈现先增大后减小的变化趋势.     

对向靶磁控溅射纳米氧化钒薄膜的热氧化处理

采用直流对向靶磁控溅射方法制备低价态纳米氧化钒薄膜,研究热氧化处理温度和时间对氧化钒薄膜的组分、结构和电阻温度特性的影响采用X射线光电子能谱（XPS）、X射线衍射（XRD）和原子力显微镜（AFM）对氧化钒薄膜的组分、结晶结构和微观形貌进行分析,利用热敏感系统对薄膜的电阻温度特性进行测量．结果表明,经300～360℃热处理后,氧化钒薄膜的组分逐渐由V2O3和VO向VO2转变,薄膜由非晶态变为单斜金红石结构,具有金属半导体相变性能;增加热处理温度后,颗粒尺寸由20nm增大为100nm,薄膜表面变得致密,阻碍氧与低价态氧化钒的进一步反应,薄膜内VO2组分舍量的改变量不大;增加热处理时间后,薄膜内VO2组分的含量明显增加,相变幅度超过2个数量级.     

Correlation between the glass-forming ability and activation energy of crystallization for Zr75−x Ni25Al x metallic glasses

The thermal stability and the kinetics of glass transition and crystallization for Zr_75?x Ni₂₅Al _x (x = 8–15) metallic glasses were investigated using differential scanning calorimetry (DSC) under continuous heating conditions. The apparent activation energy of glass transition rises monotonously with the Al content increasing; the activation energy of crystallization increases with Al changing from 8at% to 15at%, and then decreases with Al further up to 24at%, which exhibits a good correlation to the thermal stability and the glass-forming ability (GFA). The Zr₆₀Ni₂₅Al₁₅ metallic glass with the largest supercooled liquid region and GFA possesses the highest activation energy of crystallization. The relation between the thermal stability, GFA and activation energy of crystallization was discussed in terms of the primary precipitated phases.     

退火温度对N掺杂MgZnO薄膜光电性能的影响

采用射频磁控溅射技术, 用氮气作为掺杂源, 在石英基片上生长N掺杂Mg_xZn_1-xO薄膜, 并将薄膜分别在550,600,650,700 ℃真空中进行热退火处理. 结果表明: 晶体质量随退火温度的升高而提高; 薄膜中Mg和Zn的原子比发生了变化; Raman光谱中位于272,642 cm^-1处的振动峰逐渐消失; 室温光致发光光谱中薄膜的紫外激子发射峰变强, 且发生峰移; 随着退火温度的升高, 薄膜的导电类型发生转变, 当退火温度为600 ℃时, 薄膜呈最佳的p型导电性质.     

掺氧多晶硅薄膜退火特性的研究

掺氧多晶硅薄膜作为钝化膜已成功地应用于半导体器件.为了适应器件制造过程中的高温热处理,有必要探讨膜的高温热退火物理效应.本文从薄膜的腐蚀速率、膜的厚度以及膜的折射率随不同退火温度的变化,显示了掺氧多晶硅薄膜经高温退火的致密效应.而从膜的红外吸收谱测量表明膜中含氧量基本不变,但Si-O键吸收峰随着退火温度的升高向高频方向移动,并且愈益接近SiO_2的红外吸收谱.由此说明高温热退火使无定形的生长层薄膜再结构为Si多晶颗粒和SiO_2.使膜中SiO_2成份随着退火温度升高也跟着增加.     

Effect of Mg content on the structural and optical properties of Mg<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Zn<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>O alloys

Mgx Zn1–x O thin films with x = 0, 0.11, 0.28, 0.44, 0.51, and 0.65 were grown by plasma-assisted molecular beam epitaxy on (0001) sapphire substrates. X-ray diffraction measurement reveals that phase separation of the Mgx Zn1–x O films occurred at x =0.44 and 0.51. Optical absorption spectra show that the absorption edges of the films shift to high-energy side with increasing Mg contents. In resonant Raman spectra, multiple-order Raman peaks originating from ZnO-like longitudinal optical phonons were obser...     

多循环快速热退火诱导普通玻璃衬底非晶硅薄膜晶化

介绍一种使用快速热退火设备,经多次循环退火诱导,在普通玻璃衬底上生长非晶硅薄膜晶化的实验方法.利用拉曼（Raman）光谱、原子力显微镜（atomic force microscope,AFM）、紫外可见分光光度计（UV-VISspectrophotometer）和霍尔（Hall）测试系统对薄膜的结构、形貌及电子迁移率进行测试.结果表明,当退火温度达到680℃时,薄膜开始出现晶化现象;随着快速热退火次数的增加,拉曼光谱在500 cm^-1处测得多晶硅特征峰;在循环退火5次后,其最佳晶化率达到71.9%,光学带隙下降,晶粒增大,载流子迁移率提高.     

The formation and stability of Si1-x C x alloys in Si implanted with carbon ions

Si_1-xC_x alloys of carbon (C) concentration between 0.6%—1.0% were grown in Si by ion implantation and high temperature annealing. The formation of Si_1-xC_x alloys under different ion doses and their stability during annealing were studied. If the implanted dose was less than that for amorphizing Si crystals, the implanted C atoms would like to combine with defects produced during implantation and it was difficult to form Si_1-xC_x alloys after being annealed at 850℃. With the increment of implanted C ion doses, the lattice damage increased and it was easier to form Si_1-xC_x alloys. But the lattice strain would become saturate and only part of implanted carbon atoms would occupy the substitutional positions to form Si_1-xC_x alloys as the implanted carbon dose increased to a certain degree. Once Si_1-xC_x alloys were formed, they were stable at 950℃, but part of their strain would release as the annealing temperature increased to 1 000℃. Stability of the alloys became worse with the increment of carbon concentration in the alloys.     

室温下Ba0.67Sr0.33TiO3薄膜的射频磁控溅射法制备及其电学性能研究

采用磁控溅射技术在室温下制备Ba0.67Sr0.33TiO3薄膜,通过引入LaNiO3作为缓冲层以及对退火工艺的研究,采用两步法快速退火工艺与常规退火工艺结合的方式获得了致密并具有良好电学性能的钛酸锶钡薄膜.X线衍射分析表明室温情况下获得的薄膜是非晶态,需要通过后续的退火处理才能获得晶化的薄膜,采用快速退火与常规退火相结合工艺,即以40℃/s的升温速率,先升温到850℃,再降温到450℃保温180s,然后再在500℃常规退火3h,可使室温下溅射的呈非晶态的BST薄膜晶化形成具有完全钙钛矿结构的BST薄膜,薄膜致密,晶粒大小均匀.室温下所制备的BST薄膜在100Hz时的介电常数约为300,介电损耗约为0.03,具有铁电性.     

Preparation and thermoelectric properties of p-type Bi0.52Sb1.48Te3 + 3% Te thin films

Thin films of p-type Bi0.52Sb1.48Te3 + 3% Te were deposited on glass substrates by flash evaporation.X-ray diffraction and field-emission scanning electron microscopy were performed to characterize the thin films,and the effects of preparation and annealing parameters on the thermoelectric properties were investigated.It was shown that the power factors of the films increased with increasing deposition temperature.Annealing the as-deposited films improved the power factors when the annealing time was less than 90 min and the annealing temperature was lower than 250℃.A maximum power factor of 10.66 μW cm-1 K-2 was obtained when the film was deposited at 200℃ and annealed at 250℃ for 60 min.