| 掺杂Sb对Sn-Ag-Cu焊料性能的影响 |
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| 引用本文： | 梁丽超,桂太龙,许晶,殷景华,王玥. 掺杂Sb对Sn-Ag-Cu焊料性能的影响[J]. 应用科技, 2007, 34(8): 62-64 |
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| 作者姓名： | 梁丽超 桂太龙 许晶 殷景华 王玥 |
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| 作者单位： | 哈尔滨理工大学,应用科学学院,黑龙江,哈尔滨,150080 |
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| 基金项目： | 黑龙江省教育厅科学技术研究项目;黑龙江省自然科学基金 |
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| 摘 要： | 在Sn-3．0Ag-0．5Cu系焊料中分别掺杂不同比例的Sb（锑），制备了无铅焊料合金．用DSC差示扫描量热仪测试熔点，用扫描电子显微镜对其显微组织进行分析，并对其导电性，润湿性等进行测试．实验结果表明，一定比例掺杂的Sn-Ag-Cu-Sb焊料，比未掺杂时，熔点下降不明显，但其显微组织结构更细化，导电性、润湿性有明显提高．
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| 关 键 词： | 无铅焊料 导电性 润湿性 |
| 文章编号： | 1009-671X（2007）08-0062-03 |
| 修稿时间： | 2007-04-11 |
Analysis of properties of Sn-Ag-Cu solder doped with Sb |
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| LIANG Li-chao,GUI Tai-long,XU Jing,YIN Jing-hua,WANG Yue. Analysis of properties of Sn-Ag-Cu solder doped with Sb[J]. Applied Science and Technology, 2007, 34(8): 62-64 |
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| Authors: | LIANG Li-chao GUI Tai-long XU Jing YIN Jing-hua WANG Yue |
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| Affiliation: | College of Applied Science , Harbin University of Science and Technology, Harbin 150080, China |
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| Abstract: | The Sn-3.0Ag-0.5Cu solders doped with different proportions of Sb were prepared.The melting points were measured by differential scanning calorimetry(DSC).The microstructures were observed by SEM.Their conductivities and wetting properties were also tested.The results indicate that the melting points of the Sn-Ag-Cu-Sb solder doped with some proportions of Sb do not drop obviously than that not doped,but their microstructures are finer,and the conductivities and wetting properties are much improved. |
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| Keywords: | Sb |
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