| 银合金和锡磷青铜合金复合材料界面结合强度的研究 |
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| 引用本文： | 刘国禄,王志兴,魏海荣. 银合金和锡磷青铜合金复合材料界面结合强度的研究[J]. 东北大学学报(自然科学版), 1985, 0(2) |
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| 作者姓名： | 刘国禄 王志兴 魏海荣 |
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| 作者单位： | 东北工学院物理系(刘国禄，王志兴)，东北工学院物理系(魏海荣) |
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| 摘 要： | 本文报导了银合金和锡磷青铜合金的复合材料界面结合强度的研究结果:界面的断裂强度不低于银合金的断裂强度,并用Seah的准化学方法计算了复合界面断裂强度,结果表明,界面断裂强度为447.1MN/m~2,略高于银合金的断裂强度,与试验结果一致。
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| 关 键 词： | 电接触材料 复合金属 银合金 锡磷青铜合金 界面结合强度 |
On the Bonding Strength of the Clad Metal Composed of Cu-6.5Sn-0.1P and Ag-5Cu Alloys |
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| Liu Guolu,Wang Zltixing and Wei Hairong. On the Bonding Strength of the Clad Metal Composed of Cu-6.5Sn-0.1P and Ag-5Cu Alloys[J]. Journal of Northeastern University(Natural Science), 1985, 0(2) |
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| Authors: | Liu Guolu Wang Zltixing Wei Hairong |
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| Abstract: | As a wind of contact material the hot-pressed clad metal composed of Cu-6.5%Sn-0.1%Cu and Ag-5%Cu alloys is shown to be of high bonding strength of the interface between these components through tensional tests. The fracture strength of interface is at least not less than that of Ag-5%P alloy itself only. Seah's quasi-chemical method is also introduced into the theoretical calculation of the fracture strength of interface and the results is given as 447.1 MN/m2, just over that of Ag-5%Cu alloy and is in conformity with test result. |
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| Keywords: | electrical contact material clad metal Ag alloy Sn-P-Cu alloy bonding strength. |
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