功率型LED封装材料的研究现状及发展方向

综述了近年来国内外功率型LED封装材料的研究现状，通过对现有功率型LED封装材料的应用情况展开讨论，明确指出有机硅封装材料不可替代的作用及其存在的广阔的应用前景和巨大的经济效益。针对当前LED产业发展对封装材料提出的高性能、高可靠性等要求，指出有机硅封装材料下一步发展重点应集中在如何提高材料折射率、热导率、机械强度等综合性能方面。

Status quo and development directions of high-power LED encapsulation materials

This paper surveys the global development status quo of power LED encapsulation materials. Based on the analysis of present applications of power LED encapsulation materials, we present the irreplaceable role, wide application prospect and huge economic benefits of origanic silicon encapsulation materials. We also indicate that the next development emphasis should be the increase of their refractive index, thermal conductivity and mechanical strength in view of the high-performance and high-reliability requirements of current LED industrial development for encapsulation materials.