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TDPA双酮酐型聚酰亚胺合成及性能
引用本文:詹美栋,胡顺成,宋琤,宋才生.TDPA双酮酐型聚酰亚胺合成及性能[J].江西师范大学学报(自然科学版),2015,0(2):154-158.
作者姓名:詹美栋  胡顺成  宋琤  宋才生
作者单位:江西师范大学化学化工学院,江西 南昌 330022
基金项目:国家自然科学基金(51003044);2012年度北京分子科学国家实验室开放课题基金;江西省教育厅科技项目(GJJ12193);江西省自然科学基金(20132BAB206035);江西省教育厅科技落地计划(KJLD13023)资助项目
摘    要:以4,4'-对苯二甲酰二邻苯二甲酸酐(TDPA)和间苯二胺(MPD)为单体,以邻苯二甲酸酐(PA)为封端剂,采用2步法经低温溶液缩聚合成了系列结构新颖的双酮酐型聚酰亚胺(TDPA-PI).采用FT-IR、WAXD、DSC和TGA测试对聚合物的结构与性能进行了表征.考查了封端剂用量及亚胺化方法对酮酐型聚酰亚胺性能的影响.FT-IR表明,2种方法均能使TDPA-PAA亚胺化.DSC和TGA分析表明封端剂可在一定程度上提高PI的热性能,化学亚胺化得到的树脂热性能优于热亚胺化.TDPA-PI属热塑性聚合物,Tg为280.6 ℃(高于Larc-I-TPI的259 ℃),具有较好的耐热性和耐溶剂性能.

关 键 词:酮酐型聚酰亚胺  TDPA  封端剂

Ths Synthesis of TDPA-Polyimide and the Properties of the Adhesive Film
ZHAN Meidong , HU Shuncheng , SONG Cheng , SONG Caisheng.Ths Synthesis of TDPA-Polyimide and the Properties of the Adhesive Film[J].Journal of Jiangxi Normal University (Natural Sciences Edition),2015,0(2):154-158.
Authors:ZHAN Meidong  HU Shuncheng  SONG Cheng  SONG Caisheng
Institution:ZHAN Meidong;HU Shuncheng;SONG Cheng;SONG Caisheng;College of Chemistry and Chemical Engineering,Jiangxi Normal University;
Abstract:A novel diketone anhydride poly(ether ketone ether)imides(TDPA-PI)was synthesized via the conventional two-step by using 4,4'-terephthaloyldiphthalic anhydride(TDPA)and m-Phenylenediamine(MPD).Polyimide acid(TDPA-PAA)was end capped with the excess TDPA or small amount of phthalic anhydride(PA)and took the research of the influence to the thermodynamic property.Research the two polyimide properties which prepared by thermal and chemical imidization.The structure and properties of TDPA-PI was characterized and measured by fourier transform infrared spectroscopy(FT-IR),wide-angle X-ray diffraction(WAXD),differential scanning calorimetric(DSC),thermal gravimetric analysis(TGA)and solubility tests.FT-IR tests show that the two imidization ways both can make TDPA-PAA form an imide ring structure.DSC and TGA show that end-cap can improve Thermal properties of TDPA-PI to some extent,and the chemical imidization is superior to thermal imidization.TDPA-PI,a Thermoplastic polyimide which Tg is 280.6 ℃(above Larc-I-TPI 259 ℃)have good thermal and solvent preperties.LSS tests show that TDPA-PI has excellent adhesion properties.
Keywords:thermal imidization  TDPA  chemical imidization  adhesion properties
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