电子封装件受热载荷作用有限元数值模拟分析

针对典型塑料方形扁平封装体PQFP在工作过程中的受热分析问题,基于热弹性力学理论建立了二维和三维有限元数值模拟分析模型.研究了封装体在功率耗散情况下受均匀和非均匀热载作用时其材料的热膨胀和导热性质.有限元数值模拟取得了与实验一致的结果.数值结果表明,采用较小弹性模量和热膨胀率的材料可以有效地减小热应力,基板和芯片的厚度是影响封装体变形的主要参数.数值分析结果为提高封装件的可靠性和优化设计提供了理论依据.

Finite element numerical simulation analysis of electronic package subjected to thermal loading

Based on the theory of thermo-elasticity mechanics, the 2-D and 3-D finite element numerical simulation models have been established for a plastic quad flat package (PQFP) subjected to thermal loading. The package material properties of thermal expansion and heat transfer under power dissipation using uniform and non-uniform thermal loading are studied. The finite element numerical simulation results are consistent with the experimental results. The numerical results show that the less elasticity module and coefficient of thermal expansion can availably reduce thermal stress and the major parameters affecting the package warpage are the substrate thickness and die thickness. The numerical analyses provide database for improving reliability of package and optimum design.