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金属辅助化学刻蚀法制备尺寸可控的硅纳米线
引用本文:刘浩,刘锦辉.金属辅助化学刻蚀法制备尺寸可控的硅纳米线[J].科学技术与工程,2018,18(31).
作者姓名:刘浩  刘锦辉
作者单位:南京理工大学,南京理工大学
基金项目:国家自然科学基金项目(面上项目,重点项目,重大项目),江苏省自然科学基金项目
摘    要:为制备粗细均匀、大长度的硅纳米线,通过金属辅助化学刻蚀方法,以银作为辅助金属,利用场发射扫描电镜(FESEM)和FIB/SEM双束系统作为检测手段,结合微加工工艺,研究了不同的反应离子刻蚀时间和化学刻蚀时间对制备的硅纳米线的尺寸和形貌的影响。结果表明,通过该方法制备的硅纳米线粗细均匀、长度较大。控制反应离子刻蚀时间和化学刻蚀反应时间,可以控制硅纳米线的形貌与尺寸。

关 键 词:硅纳米线  反应离子刻蚀  化学刻蚀  PS微球
收稿时间:2018/6/30 0:00:00
修稿时间:2018/8/20 0:00:00

Preparation of Silicon Nanowires with Controlled Size by Metal-assisted Chemical Etching
liuhao and.Preparation of Silicon Nanowires with Controlled Size by Metal-assisted Chemical Etching[J].Science Technology and Engineering,2018,18(31).
Authors:liuhao and
Institution:Nanjing University of Science and Technology,
Abstract:To prepare silicon nanowires with uniform, large-length. The paper uses metal-assisted chemical etching method with silver as the auxiliary metal. The field emission scanning electron microscopy (FESEM) and FIB/SEM dual beam systems were used as testing equipment and combined micro-machining process. We studied the effect of different times of reactive ion etching and chemical etching on the size and morphology of the silicon nanowires. The results show that the silicon nanowires prepared by the method have uniform thickness and large-length. In this experiment, the size of silicon nanowires are determined by the times of reactive ion etching and chemical reaction.
Keywords:silicon nanowires    reactive ion etching    chemical etching    polystyrene microsphere
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