基于热失效与灵敏度的故障模式分析方法

针对测试性验证试验中现有故障模式分析方法主观性、盲目性较强以及历史数据缺乏的问题,在传统方法的基础上,提出基于热失效与灵敏度分析的改进故障模式分析方法。首先,依据现有方法的不足,明确了改进故障模式分析方法的流程;其次,建立试验对象温度场分布模型,分析温度对性能退化的影响;然后,通过识别工作中的过热区域分析由热失效造成的故障模式;最后,依据灵敏度分析结果进一步补充对试验对象功能影响较大部分的故障模式。实例应用表明,与传统方法相比,该方法在热失效分析基础上,结合功能特性分析,能够获得更加完备的潜在故障模式,有效提高了测试性验证试验样本的可信度。

Failure Mode Analysis Method Based on Thermal Failure and Sensitivity

Considering the traditional failure mode analysis problem of higher subjectivity, stronger blindness and lacking of electronic equipment historical failure data in traditional failure mode effect and critically analysis (FMECA), based on the traditional method, an improved method of failure mode analysis on the basis of based on thermal failure and sensitivity analysis was proposed. Firstly, the process of the improved method was clarified according to the existing method. Secondly, the electronic equipment temperature distribution model was established to analysis the effect of temperature on the working environment to performance degradation. Then the heated area was identified through temperature distribution,and the failure mode that caused by thermal failure was analyzed. Finally, the failure mode which has great influence on electronic equipment function was supplemented according to the results of component sensitivity. The results of application combination show that, this method combines with thermal failure analysis and functional analysis and can obtain more complete potential failure mode, while being more applicable for testability verification test.