添加剂极性对电镀镍形貌及阻氢性能的影响

在电镀镍过程中，添加电解液添加剂是解决镀层沉积不均匀等问题的有效策略，其中有机添加剂的应用广泛且效果显著。在基础电解液中引入了一系列具有不同烷基链长度的有机添加剂来平滑镍镀层（基于主链中碳原子的数量，分别命名为C1、C4、C8、C12、C16）。结果表明，随着烷基链长度的增加（C1、C4、C8），即极性增强，镍层变得更加光滑，这是由于添加剂吸附在阴极表面，减缓了Ni²⁺的迁移速率，获得了均匀的镀层。值得注意的是，在C8作用下沉积的镍层具有最小的氢渗透电流密度。但随其长度的进一步增加（C12、 C16），极性增强导致吸附性过强，引起了严重的电极极化，最终获得的镍层表面形貌粗糙。

Effect of additive polarity on the morphology and hydrogen inhibition performance of electroplated nickel

In the process of nickel plating, adding electrolyte additives is an effective strategy to solve the problem of uneven deposition of plated layer, and organic additives are widely used and and have significant effects. A series of organic additives (named as C1, C4, C8, C12, and C16, based on the number of carbon atoms in the main chain) with different alkyl chain lengths were added to the base electrolyte to obtain smooth nickel coating. The results show that as the alkyl chain length increases (C1, C4, C8), the polarity increases, and the nickel layer became smoother, which is because that the adsorption of the additive on the cathode surface slows down the migration rate of Ni²⁺, and uniform coating is obtained. It is noticeable that the nickel layer deposited under the action of C8 has the minimum hydrogen permeation current density. However, with the further increase of length (C12, C16), the increase of polarity leads to excessive adsorption, resulting in a severe electrode polarization, and the finally obtained nickel layer surface is rough.