| 含有界面裂纹薄膜的有限元分析 |
| |
| 引用本文： | 王灿,门玉涛,李林安.含有界面裂纹薄膜的有限元分析[J].科学技术与工程,2007,7(16):4000-4004. |
| |
| 作者姓名： | 王灿 门玉涛 李林安 |
| |
| 作者单位： | 天津大学力学系,天津,300072;天津理工大学机械学院,天津,300000 |
| |
| 摘 要： | 薄膜-基体复合材料在许多工程领域得到广泛应用。但在生产与使用过程中膜基界面处容易产生裂纹,裂纹的扩展导致膜层的脱落是使膜层完全失效的主要形式之一。目前主要用划痕法定量地测量膜基的结合力。先参考划痕法的试验过程建立分析薄膜力学响应的模型。然后在FEPG(有限元自动生成系统)平台上,编制相应的计算程序。并计算分析了裂纹在不同基底TiN薄膜中的影响和裂纹位置不同对TiN/Au/HSS双层膜的影响,以及裂纹长短不同对TiN/HSS单层膜的影响,表明薄膜应力与裂纹的存在因素有关。
|
| 关 键 词： | 薄膜 有限元 FEPG 界面裂纹 |
| 文章编号： | 1671-1819(2007)16-4000-05 |
| 修稿时间： | 2007-03-12 |
Finite Element Analysis of Films with Interfacial Crack |
| |
| WANG Can,MEN Yu-tao,LI Lin-an.Finite Element Analysis of Films with Interfacial Crack[J].Science Technology and Engineering,2007,7(16):4000-4004. |
| |
| Authors: | WANG Can MEN Yu-tao LI Lin-an |
| |
| Institution: | Mechanics Department of Tianjin University, Tiangin 300072, P. R. China; Mechanical School2 of Tianjin Science and Technolgy University, Tianjin 300000,P. R. China |
| |
| Abstract: | Film-substrate materials are used widely in many project fields, but in the process of manufacture and use, cracks always easily formed in the interface of film-substrate. Crack propagation leading to decohesion or delamination is one of the major failure. Now the cohesion of between film and substrate material is measured by scratching experiment. According to scratching experiment and research findings, a mechanical model applied to mechanics response is established firstly, which imitates to the beginning process of scratching test. Then the numerical programs are developed on the platform FEPG (Finite Element Program Generating System) software. The influence of crack position on TiN/Au/HSS film and TiN film with different substrate and the length of crack on TiN/HSS single film are analyzed, and the result shows that stresses of film are influenced with cracks. |
| |
| Keywords: | film finite element method FEPG interfacial crack |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
| 点击此处可从《科学技术与工程》浏览原始摘要信息 |
| 点击此处可从《科学技术与工程》下载免费的PDF全文 |
