| 微米级镀银铜粉复合导电涂层的导电性研究 |
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| 引用本文： | 程原,高保娇,梁浩.微米级镀银铜粉复合导电涂层的导电性研究[J].应用基础与工程科学学报,2001,9(2):184-190. |
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| 作者姓名： | 程原 高保娇 梁浩 |
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| 作者单位： | 华北工学院化学工程系,太原,030051 |
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| 基金项目： | 兵科院预研基金项目(编号:91401) |
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| 摘 要： | 以SEM与XRD为表征手段，较详细地研究了微米级镀银铜粉作为导电填料所形成的复合型导电涂膜的亚微观结构与其导电性能的关系，探讨了镀银铜粉的镀层结构、几何尺寸与形貌、含量、基体树脂的类型等因素对涂膜导电性能的影响规律，并用导电通道理论与隧道效应理论分析了这些影响规律．
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| 关 键 词： | 复合导电涂层 填料 亚微观结构 导电性能 射线衍射仪 涂膜 涂料 |
| 文章编号： | 1005-0930(2001)-02-03-0184-07 |
| 修稿时间： | 2001年7月23日 |
Submicroscopic Structure and Conductive Capability of Coating Film Filled by Micro Silver-coated Copper Powders |
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| CHENG Yuan,GAO Baojiao,LIANG Hao.Submicroscopic Structure and Conductive Capability of Coating Film Filled by Micro Silver-coated Copper Powders[J].Journal of Basic Science and Engineering,2001,9(2):184-190. |
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| Authors: | CHENG Yuan GAO Baojiao LIANG Hao |
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| Abstract: | The rela tionship between submicroscopic structure and conductive capability of filled co ating with silver-coated powders as conductive filler was studied by means of S EM and XRD. The influnce of variuos factors including the content of filler, the coating structure of the powder, the shape of the powder and the matrix resin t o conductivity of coating film was investigated in detail. These rules were expl ained by related theories. |
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| Keywords: | silver-coated copper powder composite coating film submicroscopic structure volume resistivity conductive net |
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