| 浅谈化学镀前活化工艺的发展 |
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| 引用本文： | 龚凡,王滨生.浅谈化学镀前活化工艺的发展[J].应用科技,2002,29(3):59-60,63. |
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| 作者姓名： | 龚凡 王滨生 |
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| 作者单位： | 1. 哈尔滨工程大学,化学工程系,黑龙江,哈尔滨,150001
2. 黑龙江省分析测试中心,黑龙江,哈尔滨,150001 |
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| 摘 要： | 论述了近年来国内化学镀前活化工艺的发展状况，介绍了胶体钯活化工艺的改进过程，例举了用非贵金属配制活化液的基本物质。
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| 关 键 词： | 化学镀 活化处理 电镀 发展阶段 胶体钯活化工艺 表面预处理 活化液 |
| 文章编号： | 1009-671X(2002)03-0059-02 |
Advancement of Activation Process on Electroless Plating |
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| GONG Fan ,WANG Bin_sheng.Advancement of Activation Process on Electroless Plating[J].Applied Science and Technology,2002,29(3):59-60,63. |
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| Authors: | GONG Fan WANG Bin_sheng |
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| Institution: | GONG Fan 1,WANG Bin_sheng 2 |
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| Abstract: | Advancement of activation process on electroless plating at home and abroad was reviewed, Improvements on colloidal Pd activation solution were stated, and some basic activation solutions replacing Pt, Rh and Pd were given. |
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| Keywords: | electroless plating activation process colloid |
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