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| 电化学迁移研究进展 | |
| 引用本文： | 易盼,董超芳,肖葵,魏丹. 电化学迁移研究进展[J]. 科技导报(北京), 2018, 36(7): 64-73. DOI: 10.3981/j.issn.1000-7857.2018.07.010 |
| 作者姓名： | 易盼 董超芳 肖葵 魏丹 |
| 作者单位： | 1. 北京科技大学腐蚀与防护中心, 腐蚀与防护教育部重点实验室, 北京 100083; 2. 中国科学技术协会学会服务中心, 北京 100081 |
| 基金项目： | 国家重点研发计划项目（2017YFB0702300）；国家自然科学基金项目（51671027） |
| 摘 要： | 随着电子电路和元器件的集成化、小型化，电子元器件中间距急剧减小，导致其对电化学迁移更加敏感。本文从研究方法、失效机制方面，综述当前电子元器件中电化学迁移行为的研究进展，探讨改善电子元器件电化学迁移敏感性的方法，提出更为行之有效的电化学迁移防护方法。 |
| 关 键 词： | 电子元器件 电化学迁移 电化学迁移防护方法 |
| 收稿时间： | 2017-01-16 |
Current status and prospects of electrochemical migration research |
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| YI Pan,DONG Chaofang,XIAO Kui,WEI Dan. Current status and prospects of electrochemical migration research[J]. Science & Technology Review, 2018, 36(7): 64-73. DOI: 10.3981/j.issn.1000-7857.2018.07.010 | |
| Authors: | YI Pan DONG Chaofang XIAO Kui WEI Dan |
| Affiliation: | 1. Key Laboratory for Corrosion and Protection of the Ministry of Education;Corrosion and Protection Center, University of Science and Technology Beijing, Beijing 100083, China; 2. Service Center for Societies, China Association for Science and Technology, Beijing 100081, China |
| Abstract: | Currently, electronic components are becoming more integrated and more miniaturized, which substantially increases the sensitivity of electrochemical migration (ECM). In this paper, the current status and prospects of electrochemical migration research are reviewed in terms of research methods, failure mechanism and protection methods. In addition, a newly method that improves the sensitivity of ECM is also provided. |
| Keywords: | electronic components electrochemical migration protection method |
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