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基于印制电路板板级的可制造性设计分析
引用本文:黄战武,李志娟,姜建国,叶强,曹玉. 基于印制电路板板级的可制造性设计分析[J]. 上海交通大学学报, 2007, 0(Z2)
作者姓名:黄战武  李志娟  姜建国  叶强  曹玉
作者单位:西安电子科技大学 西安710071
摘    要:从可制造性设计(DFM)的定义和trilogy 5000软件开始,说明了印制电路板(PCB)板级DFM的必要性.简述了PCB板上元器件的选型所遵循的标准和Mark点的设立原则.详细叙述了焊盘的设计尺寸、PCB板层的设计规则、PCB设计的布局规范、PCB布线规范等几个PCB设计所涉及到的方面.另外,介绍了几种常见的SMT物理封装形式和元器件与定位孔的间距以及线与焊盘、线与过孔、过孔与焊盘的最小间距.

关 键 词:印制电路板  可制造性设计  分析

The Design for Manufacture Analysis Based on Printed Circuit Board
HUANG Zhan-wu,LI Zhi-juan,JIANG Jian-guo,YE Qiang,CAO Yu. The Design for Manufacture Analysis Based on Printed Circuit Board[J]. Journal of Shanghai Jiaotong University, 2007, 0(Z2)
Authors:HUANG Zhan-wu  LI Zhi-juan  JIANG Jian-guo  YE Qiang  CAO Yu
Abstract:In view of the definition of design for manufacture(DFM) and the valor software trilogy 5000 this paper explained the necessity of the DFM of printed circuit board(PCB).The standard of choosing components which will be on the PCB and the principle with which Mark following is set up were simply introduced.The size of pad and the principle of setting up PCB layer and the rules of the layout design and the track,as setting up PCB following with,were described.The footprint of familiar SMT,the space between the components and the local hole,and the minimum distance between the track and pad,as well as the track and via,the via and the pad were also introduced.
Keywords:printed circuit board(PCB)  design for manufacture(DFM)  analysis
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