聚晶金刚石研磨机理研究

通过 PCD表面干研磨、湿研磨、钝湿研磨等对比试验 ,观察干研磨、湿研磨表面形貌 ,研究了 PCD材料研磨机理 .试验结果表明 ,干研磨去除率远大于湿研磨去除率 ,并可使 PCD表面达到镜面 ;湿研磨、钝湿研磨不能使其达到镜面 .干研磨时 ,材料的去除机理以热化学去除为主 ,基本不发生疲劳脆性去除 ;湿研磨时 ,材料去除机理以疲劳脆性去除为主 ,同时存在局部的热化学去除

Research on lapping mechanism of polycrystalline diamond

Based on the comparative experiments of dryly and wetly lapping the polycrystalline diamond (PCD) and the morphologies of lapping surfaces examined by SEM, this paper studied the lapping mechanisms of PCD. The experimental results indicate that the material removal rate of dry lapping is much higher than that of wet lapping, and the dry lapping can achieve specular surface, whereas the wet lapping can not. In addition, it is concluded that the thermochemical removal is dominating and the fatigue brittle fracture removal is secondary in dry lapping, but in wet lapping, the fatigue brittle fracture removal is dominating, at the same time the local thermochemical removal occurs.