| 固相扩散Cu/Al界面研究 |
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| 引用本文： | 耿相英,何艳玲,李世春. 固相扩散Cu/Al界面研究[J]. 中国石油大学学报(自然科学版), 2006, 30(2): 78-80,84 |
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| 作者姓名： | 耿相英 何艳玲 李世春 |
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| 作者单位： | 中国石油大学,机电工程学院,山东,东营,257061 |
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| 摘 要： | 利用“铆钉法”制备了界面为曲面的Cu-Al扩散偶。用光学显微镜和彩色金相技术，研究了烧结过程中界面的迁移情况及其影响因素。研究表明，界面迁移过程受原子的扩散控制；温度是影响界面迁移的主要因素，保温时间是次要因素；试样烧结过程中Cu／Al界面双向迁移并且向Al侧迁移的程度较大。
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| 关 键 词： | Cu-Al扩散偶 扩散层 界面迁移 Kirkendall效应 |
| 文章编号： | 1673-5005（2006）02-0078-03 |
| 收稿时间： | 2005-10-21 |
| 修稿时间： | 2005-10-21 |
Study of Cu/Al interface during solid phase diffusion |
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| GENG Xiang-ying,HE Yan-ling,LI Shi-chun. Study of Cu/Al interface during solid phase diffusion[J]. Journal of China University of Petroleum (Edition of Natural Sciences), 2006, 30(2): 78-80,84 |
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| Authors: | GENG Xiang-ying HE Yan-ling LI Shi-chun |
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| Affiliation: | College of Mechanical and Electronic Engineering in China University of Petroleum, Dongying 257061, Shandong Province, China |
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| Abstract: | Cu-Al diffusion couples with curving interfaces were prepared by mechanical method.With the help of optical microscope(OM) and color metallograph,interface migration and its influencing factors were investigated during sintering.The results show that interface migration was controlled by atomic diffusion,temperature was the major influencing factor on the interface migration while holding time was the second one.The original Cu/Al interface migrated towards both Cu and Al,and more towards Al during sintering. |
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| Keywords: | Cu-Al diffusion couples diffusion layer interface migration Kirkendall effect |
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