Effects of normal stress,surface roughness,and initial grain size on the microstructure of copper subjected to platen friction sliding deformation |
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Authors: | Shan-quan Deng Andrew-William Godfrey Wei Liu Cheng-lu Zhang Ben Xu |
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Institution: | Key Laboratory of Advanced Materials M0E, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China |
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Abstract: | The effects of applied normal stress, surface roughness, and initial grain size on the microstructure of pure Cu developed during platen friction sliding deformation (PFSD) processing were investigated. In each case, the deformation microstructure was characterized and the hardness of the treated surface layer was measured to evaluate its strength. The results indicated that the thickness of the deformed layer and the hardness at any depth increased with increasing normal stress. A smaller steel platen surface roughness resulted in less microstruc-tural refinement, whereas the microstructural refinement was enhanced by decreasing the surface roughness of the Cu sample. In the case of a very large initial grain size (d > 10 mm), a sharper transition from fine-grain microstructure to undeformed material was obtained in the treated surface layer after PFSD processing. |
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Keywords: | copper surface treatment processing parameters grain refinement gradient microstructure hardness |
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