基于无损探伤的高精度电路板缺陷检测系统

为了实现电路板焊盘、焊点焊接情况的快速缺陷分析,采用无损探伤技术结合大比例成像结构设计了高精度电路板缺陷检测系统.系统由X射线机、MV-M1000型高分辨率图像采集卡以及MN39750PA型CCD探测器构成,在分析了无损探伤基本原理的基础上,设计了大比例电路板成像结构,并提出了累计采样降噪算法.针对存在焊接问题的电路板进行实验,实验结果显示:通过无损探伤系统可以清楚地观察电路板的焊接情况.经光学系统计算分析可知,对缺陷的检测精度可达30 μm,可以有效地满足工业应用等的设计要求.

The High-Precision Non-Destructive Inspection Detection System for Circuit Board Defect

In order to accurately obtain joints defects information of the circuit board pads,solder in any cases,high-precision nondestructive testing system is designed.The system consists of an X-ray machine,MV-M1000 high-resolution image acquisition card and MN39750PA type CCD detector composition.After analyzing the basic principle of non-destructive testing, a large proportion of the circuit board imaging structure is designed.Cumulative sampling noise reduction algorithm was proposed.Problems for the existing circuit board welding experiment.Experimental results show that,soldering the circuit board can be clearly observed in the case of non-destructive testing system.Calculated by the optical system analysis,the defect detection accuracy 30μm can effectively meet the design requirements of industrial applications.