首页 | 本学科首页   官方微博 | 高级检索  
     

N离子注入非晶碳膜的CN成键研究
引用本文:林景波,李俊杰,李哲奎,顾广瑞,盖同祥,金哲,胡超权,吕宪义,金曾孙. N离子注入非晶碳膜的CN成键研究[J]. 吉林大学学报(理学版), 2005, 43(3): 324-327
作者姓名:林景波  李俊杰  李哲奎  顾广瑞  盖同祥  金哲  胡超权  吕宪义  金曾孙
作者单位:1.延边大学 理学院物理系, 吉林省 延吉 133002 2.吉林大学 超硬材料国家重点实验室, 长春 130012
基金项目:国家 863项目基金(批准号: 50372024)
摘    要:利用Raman和XPS研究N离子注入前后非晶碳膜化学键合的变化及CN成键情况. 结果表明, 被注入到非晶碳膜内的N与C原子结合, 形成sp3C-N, sp2 C-N 和C≡N键. 随着N离子注入剂量的增加, 膜内sp3 C-N键的含量相对增多, 表明N离子注入更有利于sp3 C-N键的形成.

关 键 词:N离子注入  非晶碳膜  磁控溅射  键合结构  
文章编号:1671-5489(2005)03-0324-04
收稿时间:2004-08-27
修稿时间:2004-08-27

Formation of CN Bonds in the Amorphous Carbon Film by N-Implantation
LIN Jing-bo,LI Jun-jie,LI Zhe-kui,GU Guang-rui,GAI Tong-xiang,JIN Zhe,HU Chao-quan,U Xian-yi,JIN Zeng-sun. Formation of CN Bonds in the Amorphous Carbon Film by N-Implantation[J]. Journal of Jilin University: Sci Ed, 2005, 43(3): 324-327
Authors:LIN Jing-bo  LI Jun-jie  LI Zhe-kui  GU Guang-rui  GAI Tong-xiang  JIN Zhe  HU Chao-quan  U Xian-yi  JIN Zeng-sun
Affiliation:Department of Physics, College of Science and Engineering, Yanbian University, Yanji 133002, Jilin Province, China ; National Key Laboratory of Superhard Materials, Jilin University, Changchun 130012, China
Abstract:N-implantation into amorphous carbon films with different doses was carried out to study the formation of CN bonding. Raman and XPS spectra were used to characterize the chemical bonding of CN bonds in amorphous carbon films after N-implantation. The results show that N atoms implanted into amorphous carbon films are bound to C atoms by different bonding types of sp3 C-N, sp2 C-N and C≡N in the films. When N-implantation dose increases, the relative content of sp3 C-N bonds increases, which is more than those of other types of C-N bonds in the films. It indicates that N-implantation is favorable to the formation of sp3 C-N bonds.
Keywords:N-implantation  amorphous carbon film  magnetron sputtering  chemical bonding structure
本文献已被 CNKI 维普 万方数据 等数据库收录!
点击此处可从《吉林大学学报(理学版)》浏览原始摘要信息
点击此处可从《吉林大学学报(理学版)》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号