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磁控溅射与电弧离子镀制备TiN薄膜的比较
引用本文:李鹏,黄美东,佟莉娜,张琳琳,王丽格,李晓娜. 磁控溅射与电弧离子镀制备TiN薄膜的比较[J]. 天津师范大学学报(自然科学版), 2011, 31(2): 32-37
作者姓名:李鹏  黄美东  佟莉娜  张琳琳  王丽格  李晓娜
作者单位:1. 天津师范大学,物理与电子信息学院,天津,300387
2. 大连理工大学,三束重点实验室,辽宁,大连,116024
基金项目:国家自然科学基金资助项目,天津师范大学学术创新推进计划资助项目
摘    要:分别采用磁控溅射和电弧离子镀在抛光后的W18Cr4V高速钢基体表面沉积TiN膜层,利用纳米力学系统、扫描电子显饭镜(SEM)和X射线衍射仪(XRD)对薄膜进行测试,比较了两种方法所制备的薄膜的异同.结果表明:磁控溅射所制备的薄膜表面平整,但沉积速率和硬度均低于电弧离子镀制备的薄膜.

关 键 词:TiN  磁控溅射  电弧离子镀

Comparison of TiN films prepared by magnetron sputtering and arc ion plating
LI Peng,HUANG Meidong,TONG Lina,ZHANG Linlin,WANG Lige,LI Xiaona. Comparison of TiN films prepared by magnetron sputtering and arc ion plating[J]. Journal of Tianjin Normal University(Natural Science Edition), 2011, 31(2): 32-37
Authors:LI Peng  HUANG Meidong  TONG Lina  ZHANG Linlin  WANG Lige  LI Xiaona
Affiliation:LI Peng1,HUANG Meidong1,TONG Lina1,ZHANG Linlin1,WANG Lige1,LI Xiaona2 1.College of Physics and Electronic Information Science,Tianjin Normal University,Tianjin 300387,China,2.Key Laboratory of Materials Modification by Laser,Ion and Electron Beams,Dalian University of Technology,Dalian 116024,Liaoning Province
Abstract:TiN films were deposited onto the well-polished W18Cr4V by DC magnetron sputtering and arc ion plating,respectively.Both advantages and shortcomings of these two methods were discussed according to the microstructure and properties of the films measured by nano-indenter,SEM,as well as XRD.It was concluded that the films prepared by magnetron sputtering had cleaner surfaces but less deposition rate as well as lower hardness,when compared with those deposited by arc ion plating.
Keywords:TiN  magnetron sputtering  arc ion plating  
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