| 芯片高密度封装互连技术 |
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| 引用本文： | 张建华,张金松,华子恺.芯片高密度封装互连技术[J].上海大学学报(自然科学版),2011,17(4):391-400. |
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| 作者姓名： | 张建华 张金松 华子恺 |
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| 作者单位： | 上海大学机电工程与自动化学院,上海200072;上海大学新型显示及应用集成教育部重点实验室,上海200072 |
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| 基金项目： | 国家自然科学基金资助项目(50390064); 教育部新世纪优秀人才支持计划资助项目(NCET070535); 上海市科委国际合作资助项目(045007027); 上海市教委重点资助项目(2006ZZ04); 上海市曙光计划资助项目(05SG42); 上海市启明星计划资助项目(04QMX1442,08QH14007) |
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| 摘 要： | 电子封装正朝着高密度封装的方向发展,以满足市场对高性能、高可靠性、低成本、微型化的电子产品的需求.高密度封装具有多学科交叉的特点.综述课题组多年来在芯片高密度封装互连技术,包括倒装芯片(flip chip,FC)凸点制备／转移技术、导电胶高密度互连技术、叠层芯片封装技术及封装可靠性方面的研究工作,并指出未来高密度封装技...
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| 关 键 词： | 高密度封装 互连技术 倒装芯片 凸点 各向异性导电胶 非导电胶 可靠性 |
Interconnection Technology for High-Density Chip Packaging |
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| ZHANG Jian-hua,ZHANG Jin-song,HUA Zi-kai.Interconnection Technology for High-Density Chip Packaging[J].Journal of Shanghai University(Natural Science),2011,17(4):391-400. |
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| Authors: | ZHANG Jian-hua ZHANG Jin-song HUA Zi-kai |
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| Institution: | ZHANG Jian-hua~(1,2),ZHANG Jin-song~(1,HUA Zi-kai~(1,2) (1.School of Mechatronics Engineering and Automation,Shanghai University,Shanghai 200072,China,2.Key Laboratory of Advanced Display and System Applications of Ministry of Education,China) |
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| Abstract: | The trend of electronic packaging is towards high-density to meet market requirements on electronic products with high performance,high reliability,low cost and miniaturization.Multi-discipline interaction is a notable feature in high-density packaging,which motivates the research in the lab in the past 10 years.The work of the lab is largely related to the interconnection technologies,i.e.,flip chip (FC),bumping,anistropically conductive adhesive film(ACF) and non-conductive adhesive film (NGF),and reliabi... |
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| Keywords: | high-density packaging interconnection technology flip chip(FC) bumping anistropically conductive adhesive film(ACF) non-conductive adhesive film(NCF) reliability |
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