| 磁控溅射工艺对纳米Ti膜形貌的影响 |
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| 引用本文： | 金永中,刘东亮,陈建,吴卫. 磁控溅射工艺对纳米Ti膜形貌的影响[J]. 四川理工学院学报(自然科学版), 2006, 19(4): 49-51 |
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| 作者姓名： | 金永中 刘东亮 陈建 吴卫 |
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| 作者单位： | 四川理工学院材料与化学工程系,四川,自贡,643000;西华大学材料学院,成都,610039 |
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| 摘 要： | 实验研究了磁控溅射工艺的溅射功率及溅射时间对纳米金属Ti膜的厚度影响,并对薄膜形貌作了简单探讨。结果表明,在其它工艺参数恒定时,金属Ti膜厚度与溅射时间呈正比例关系;金属Ti膜厚度随溅射功率的提高而增大;长时间溅射后的纳米金属Ti膜表面平整,主要源于薄膜进入连续生长阶段,出现晶粒合并的现象。
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| 关 键 词： | 磁控溅射 纳米Ti膜 溅射工艺 形貌 |
| 文章编号： | 1673-1549(2006)04-0049-03 |
| 修稿时间： | 2005-12-22 |
Effect of Magnetron Sputtering Process on Forming of Ti Thin Film |
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| JIN Yong-zhong,LIU Dong-liang,CHEN Jian,WU Wei. Effect of Magnetron Sputtering Process on Forming of Ti Thin Film[J]. Journal of Sichuan University of Science & Engineering(Natural Science Editton), 2006, 19(4): 49-51 |
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| Authors: | JIN Yong-zhong LIU Dong-liang CHEN Jian WU Wei |
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| Abstract: | The Effect of magnetron sputtering power and time on the thickness of Ti thin film are studied in the paper.At the same time,the forming of Ti thin film is discusses simply.It is showes that under other constant process parameters,there is direct ratio between the thickness of Ti thin film and sputtering time,and the thickness is increasing as sputtering power enhances.The surface of Ti thin film that has been sputtered for long time is very smooth,because thin film is characteristic of crystal amalgamation in the stage of continuous growth. |
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| Keywords: | magnetron sputtering Ti thin film sputtering process forming |
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