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Silicon nanoporous pillar array and its surface copper deposition
Authors:Xiaonan?Fu,Huadou?Chai,Xinjian?Li  author-information"  >  author-information__contact u-icon-before"  >  mailto:lixj@zzu.edu.cn"   title="  lixj@zzu.edu.cn"   itemprop="  email"   data-track="  click"   data-track-action="  Email author"   data-track-label="  "  >Email author
Affiliation:Zhengzhou University
Abstract:Silicon nanoporous pillar array (Si-NPA) has been prepared by a hydrothermal etching technique. Using Si-NPA as substrate, a Cu/Si-NPA nanocomposite thin film has been obtained with immersion plating method. Morpho- logical and structural analysis indicates that Si-NPA is a typical structural composite system characterized by a triple hierarchical structure, i. e. the array of micron-sized silicon pillars, the nanopores densely distributed on the surface of the pillars, and the silicon nanocrystallites that constitute the pore walls. Cu/Si-NPA inherits the morphological character- istics of Si-NPA. The compactability of the deposited copper nanoparticles varies alternatively with the local geometrical features of Si-NPA and forms a quasi-periodical pattern. Such an experimental phenomenon is attributed to the veloc- ity dependence of the copper deposition upon the local geo- metrical features of Si-NPA. These results indicate that Si-NPA might be used as an ideal template for preparing specially patterned, structured or functionalized metal/ sili- con nanocomposite systems.
Keywords:silicon nanoporous pillar array (Si-NPA)   Cu/Si-NPA   hierarchical structure   immersion plating   hydrothermal etching.
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