| 陶瓷颗粒(纤维)增强聚合物复合电子封装与基板材料 |
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| 引用本文： | 傅仁利.陶瓷颗粒(纤维)增强聚合物复合电子封装与基板材料[J].世界科技研究与发展,2006,28(1):40-47. |
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| 作者姓名： | 傅仁利 |
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| 作者单位： | 南京航空航天大学材料科学与技术学院,南京,210016 |
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| 摘 要： | 本文论述了陶瓷颗粒(纤维)增强聚合物基复合电子封装与基板材料体系和性能特点,介绍了复合基板材料的实验研究和理论研究进展情况,根据实验研究和文献报道并结合目前在微电子封装领域广泛应用的环氧塑封材料,对复合电子封装与基板材料的发展趋势进行了分析和评述。
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| 关 键 词： | 复合材料 聚合物 陶瓷 电子封装 |
Ceramic Particles (Fibers) Filled Polymer Composites Used for Electronic Package and Substrate |
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| FU Renli.Ceramic Particles (Fibers) Filled Polymer Composites Used for Electronic Package and Substrate[J].World Sci-tech R & D,2006,28(1):40-47. |
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| Authors: | FU Renli |
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| Abstract: | This paper discussed the properties and materials system of ceramic particles/fibers filled polymer composites used for electronic packaging and substrate.The development of composite substrate experimental research and theoretic study has been introduced also.Based on ourselves' research activity and literature reports,evaluated and discussed the development trend of composite electronic package and substrate materials. |
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| Keywords: | composite polymer ceramics electronic package |
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