| 硫脲的吸附行为及其对铜电沉积的影响 |
| |
| 引用本文： | 董云会,林建新. 硫脲的吸附行为及其对铜电沉积的影响[J]. 合肥工业大学学报(自然科学版), 1999, 0(1) |
| |
| 作者姓名： | 董云会 林建新 |
| |
| 作者单位： | 山东建材学院分院 |
| |
| 摘 要： | 采用电化学及Ｘ射线衍射法研究了硫脲在铜电极表面的吸附作用及其对铜沉积织构的影响。结果表明：硫脲在铜阴极表面的吸附遵守Ｆｒｕｍｋｉｎ吸附等温式，促进铜电沉积（１１１）晶面的择优取向，而抑制（２２０）晶面的生长。
|
| 关 键 词： | 硫脲；铜电沉积；吸附形式；织构 |
ADSORPTION OF THIOUREA AND ITS EFFECTS ON THE ELECTRODEPOSITION OF COPPER |
| |
| Dong Yunhui Lin Jianxin. ADSORPTION OF THIOUREA AND ITS EFFECTS ON THE ELECTRODEPOSITION OF COPPER[J]. Journal of Hefei University of Technology(Natural Science), 1999, 0(1) |
| |
| Authors: | Dong Yunhui Lin Jianxin |
| |
| Affiliation: | Dong Yunhui * Lin Jianxin |
| |
| Abstract: | Adsorption of thiourea on the copper electrode surface and the effects of thiourea on the cathode electrodeposition were studied by electrochemical method and X ray diffraction.The results show that the adsorption observes Frumkin adsorption isotherm equation;and the texture coefficient of (111) face is obviously increased,whereas that of (220) face is decreased. |
| |
| Keywords: | thiourea copper electrodeposition adsorption type texture |
| 本文献已被 CNKI 等数据库收录！ |
