单侧表面约束圆板的过屈曲分析

利用摄动分析结合打靶法，分析了具有单侧表面约束的圆板，在面内压力与横向力联合作用下发生屈曲和过屈曲问题，得到了在一系列横向力作用下周边固支和简支圆板的过屈曲路径。在微电子元件和微力电系统中大量存在有薄膜－基底结构，此结构中也存在屈曲和过屈曲问题。承受残余压应力作用的薄膜由于屈曲、驱动界面的脱层破坏，同时由于脱层内部处于真空状态，薄膜外的大气压起到了横向力的作用；而基底的刚性则提供了脱层薄膜的横向变形约束。所得结果可用于这类薄膜一基底结构中承压薄膜的屈曲驱动层裂扩展的分析。

Post-buckling analysis of unilateral constrained circular plates

The buckling and post-buckling of a unilateral constrained circular plate subjected to edge thrust and lateral pressure is presented using the perturbation analysis and the shooting method. The post-buckling paths of clamped and simple supported circular plate under a series of lateral pressure are obtained. The similar problems can be found in the thin film/substrate structures which generally exist in the micro-electronic elements and micromechanic-electronic systems. The thin film subjected to residual pressure will be destroyed in the interface because of the buckling of delamination, simultaneously, the outer atmospheric pressure acts as the lateral pressure because of the vacuum state in the blister.And the rigid substrate offers the unilateral constraint when the thin film deforms laterally.The results obtained can be applied to analyse the growth of the buckling driven delamination in the thin-film/substrate systems.