Influence of pH,immersion time,and benzotriazole concentration on copper corrosion in citric acid based slurries |
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| Authors: | XiaoRen Lü XinChun Lu JianBin Luo |
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| Affiliation: | (1) Center of Excellence for Research in Engineering Materials (CEREM), College of Engineering, King Saud University, P. O. Box 800, Riyadh, 11421, Saudi Arabia;(2) Department of Physical Chemistry, Electrochemistry and Corrosion Laboratory, National Research Centre (NRC), Dokki, Cairo, 12622, Egypt;(3) Department of Mechanical Engineering, College of Engineering, King Saud University, P.O. Box 800, Riyadh, 11421, Saudi Arabia |
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| Abstract: | Copper corrosion in citric acid based slurries with or without benzotriazole (BTA) was investigated as a function of the slurry pH, immersion time and BTA concentration by static etching and electrochemical experiments. The chemical composition of the corroded surface was determined using X-ray photoelectron spectroscopy (XPS). The static etching rate of copper in a H2O2+citric acid+BTA slurry was lower than that in a H2O2+citric acid slurry at pH 4.4–8. When the pH of the slurry was >8 or <4.4, the results were reversed and the static etching rate of copper increased when BTA was added to the H2O2+citric acid slurry. The inhibitory effect of BTA in the H2O2+citric acid slurry at pH 6 increased with the increasing immersion time of the copper. The corrosion current density of copper gradually decreased with increasing BTA concentration in slurry. |
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| Keywords: | copper corrosion benzotriazole citric acid slurry |
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