| Multigrid technique incorporated algorithm for CMP lubrication equations |
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| 作者姓名： | ZHANG Chaohui LUO Jianbin WEN Shizhu |
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| 作者单位： | State Key Laboratory of Tribology,Tsinghua University,Beijing 100084,China,State Key Laboratory of Tribology,Tsinghua University,Beijing 100084,China,State Key Laboratory of Tribology,Tsinghua University,Beijing 100084,China |
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| 基金项目： | 国家自然科学基金，国家优秀青年学者奖励计划 |
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| 摘 要： | Chemical mechanical polishing(CMP)is a manufacturing process used to achieve required high levels of global and local planarity,which involves a combination of chemical erosion and mechanical action.The study on mechanical removal action of CMP with hydrodynamic lubrication involved will help us to get some insights into the mechanism of CMP and to solve the lubrication problem of CMP.In this paper,a full approach scheme of multigrid technique incorporated with line relaxation is introduced for accelerating the convergence.The effects of various parameters on load and moments are simulated and the results of computation are reported.
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| 关 键 词： | chemical mechanical polishing multigrid technique line relaxation full approach scheme |
Multigrid technique incorporated algorithm for CMP lubrication equations |
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| ZHANG Chaohui,LUO Jianbin,WEN Shizhu.Multigrid technique incorporated algorithm for CMP lubrication equations[J].Progress in Natural Science,2004,14(4):369-372. |
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| Authors: | Zhang Chaohui LUO Jianbin WEN Shizhu |
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| Institution: | State Key Laboratory of Tribology,Tsinghua University,Beijing 100084,China |
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| Abstract: | Chemical mechanical polishing(CMP)is a manufacturing process used to achieve required high levels of global and local planarity,which involves a combination of chemical erosion and mechanical action.The study on mechanical removal action of CMP with hydrodynamic lubrication involved will help us to get some insights into the mechanism of CMP and to solve the lubrication problem of CMP.In this paper,a full approach scheme of multigrid technique incorporated with line relaxation is introduced for accelerating the convergence.The effects of various parameters on load and moments are simulated and the results of computation are reported. |
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| Keywords: | chemical mechanical polishing multigrid technique line relaxation full approach scheme |
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