| 基于热应力的高温超导薄膜界面热阻模型研究 |
| |
| 引用本文： | 陈进,丁忠军,王惠龄.基于热应力的高温超导薄膜界面热阻模型研究[J].华中科技大学学报(自然科学版),2005,33(9):81-83. |
| |
| 作者姓名： | 陈进 丁忠军 王惠龄 |
| |
| 作者单位： | 1. 华中科技大学,,能源与动力工程学院,湖北,武汉,430074
2. 武汉理工大学,,自动化学院,湖北,武汉,430070 |
| |
| 基金项目： | 教育部博士学科点专项科研基金资助项目(20040487039)，国家高技术研究发展计划资助项目(2002AA306331-4). |
| |
| 摘 要： | 依据基于热应力理论的高温超导薄膜材料界面热阻数学模型,对高温超导薄膜Er-Ba-Cu-O与其基体MgO界面热阻随热应力变化的模型进行参数辨识.应用MATLAB开发工具设计界面热阻仿真软件,对其变化规律进行仿真研究.结果表明:界面热阻实验与仿真温度范围为20~180 K,模型误差小于10%,高温超导薄膜界面热阻随热流增加而减小,仿真结果与实验数据有较好的一致性.
|
| 关 键 词： | 高温超导薄膜 热应力 界面热阻 |
| 文章编号： | 1671-4512（2005）09-0081-03 |
| 收稿时间： | 2005-04-04 |
| 修稿时间： | 2005年4月4日 |
Investigation on the mathematic model of thermal boundary resistance for thin-film high-Tc superconductors based on the peeling stress |
| |
| Chen Jin,Ding Zhongjun,Wang Huiling.Investigation on the mathematic model of thermal boundary resistance for thin-film high-Tc superconductors based on the peeling stress[J].JOURNAL OF HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY.NATURE SCIENCE,2005,33(9):81-83. |
| |
| Authors: | Chen Jin Ding Zhongjun Wang Huiling |
| |
| Abstract: | Based on the peeling stress mathematic model of thermal boundary resistance between Er-Ba-Cu-O film on MgO substrates, the model parameter identifier was described in this paper. The relation of thermal boundary resistance with thermal flux was investigated by use of simulation software of thermal boundary resistance designed with the MATLAB development tool. In this study, the scope of experiment and simulation on thermal boundary resistance is between 20?K and 180?K, the value of thermal boundary resistance was decreased while the thermal flux was increased and the errors between model and experiment data was less than 10?%. It was showed that the simulation results are greatly in accordance with the experiment data. |
| |
| Keywords: | thin-film high-T_c superconductors peeling stress thermal boundary resistance |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
