柔性自动化微装配的自主式显微视觉技术

针对非硅微机电系统自动化、柔性、高精度、高效的装配特点,提出并实现了一种基于金属氧化物半导体(CMOS)、现场可编程门阵列(FPGA)及数字信号处理器(DSP)的显微视觉系统设计方法. 该方法兼顾了模块化、柔性与可重配置、高检测精度及速度等系统主要指标,实现了结构模块化、功能可重配置、具有非常高的检测精度及速度的显微视觉系统. 通过实验分析了系统的物理分辨率以及对测量精度进行了标定,验证了系统的设计技术指标. 结果表明:系统对非硅MEMS器件的最高测量精度可达0.6 μm,检测时间小于0.65 s,不仅满足了现有微小型零件柔性自动化装配的要求,同时也为微小型零件的高精度、高速度检测提供了重要的解决方法. 

Autonomous Micro-Vision Technology of Flexible and Automated Micro-Assembly

For the automation, flexible, high accuracy and speed features of non-silicon MEMS devices micro-assembly, a micro-vision system design method was proposed and implemented based on metal oxide semiconductor chip(CMOS), field programmable gate array(FPGA) and digital signal processor(DSP). Some key system indicators were taken into account, including modular, flexible and reconfigurable, high detection accuracy and speed, made the micro-vision system have modular structure, function reconfigurable, a very high detection accuracy and speed. Through experiment, the physical resolution of the system was analyzed and the measurement accuracy of system was calibrated, the design technical indicators of the system were verified. The results show that the highest accuracy of the system can reach 0.6 μm and detection time is less than 0.65 seconds. The micro-vision system provides important solutions for precision, high speed testing of micro and small parts.