Enhancing thermoelectric performance of Cu-modified Bi0.5Sb1.5Te3 by
electroless plating and annealing |
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Authors: | Zhongyue Huang He Zhang Kun Zheng Xueting Dai Yuan Yu Hefa Cheng Fangqiu Zu and Zhi-Gang Chen |
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Institution: | 1. School of Materials Science & Engineering, Hefei University of Technology, Hefei 230009, China;2. Institute of Microstructure and Properties of Advanced Materials, Beijing University of Technology, Beijing 100124, China;3. Centre for Future Materials, University of Southern Queensland, Springfield, QLD 4300, Australia;4. Materials Engineering, The University of Queensland, Brisbane, QLD 4072, Australia |
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Abstract: | With the capacity of energy conversion from heat to electricity directly, thermoelectric materials have been considered as an alternative solution to global energy crisis. In this work, Cu modified Bi_(0.5)Sb_(1.5)Te_3(BST)composites are prepared by a facile electroless plating Cu method, spark plasma sintering, and annealing. The annealed 0.22 wt.%Cu/BST has an enhanced peak Figure of Merit(z T) of ~ 0.71 at 573 K with high average z T of0.65 in the wide temperature range between 300 and 573 K. Due to the significant increase of electrical conductivity and low lattice thermal conductivity, the annealed 0.22 wt.%Cu/BST shifts peak z T to high temperature, and shows 492% enhancement than that of pristine BST with z T of 0.12 at 573 K. Through detailed structural characterization of the annealed 0.22 wt.%Cu/BST, we found that Cu can dope into BST matrix and further form Cu2 Te nanoprecipitates, dislocations, and massive grain boundaries, leading to a low lattice thermal conductivity of 0.30 Wm-1 K-1 in the annealed 0.22 wt.%Cu/BST. Such enhanced peak z T in high-temperature and high average z T in the wide temperature range shows that the electroless plating Cu method and annealing can improve the thermoelectric performance of commercial BST and expand the applicability of Bi_2Te_3 thermoelectric materials in the power generations. |
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Keywords: | Thermoelectric materials Electroless plating Annealing Corresponding authors |
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