| 化学镀Ni-Cu-P合金的研究 |
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| 引用本文： | 王孝荣,洪祥乐. 化学镀Ni-Cu-P合金的研究[J]. 佛山科学技术学院学报(自然科学版), 1995, 0(4) |
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| 作者姓名： | 王孝荣 洪祥乐 |
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| 作者单位： | 佛山大学化学与化工系，佛山大学化学与化工系 佛山 528000，佛山 528000 |
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| 摘 要： | 研究了化学镀 Ni-Cu-P 合金的工艺,对镀液的稳定性和镀层的性能进行分析研究.获得含 Ni83.31%、Cu4.08%、P8.59%均匀无针孔的镀层;镀层的结合力、耐蚀性良好;经热处理后镀层的硬镀达到993.4HV.
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| 关 键 词： | 化学镀 Ni-Cu-P 合金 稳定性 结合力 耐蚀性 |
A Research on Electroless Plating of Ni-Cu-P Alloy |
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| Wang Xiaorong Hong Xiangle. A Research on Electroless Plating of Ni-Cu-P Alloy[J]. Journal of Foshan University(Natural Science Edition), 1995, 0(4) |
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| Authors: | Wang Xiaorong Hong Xiangle |
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| Affiliation: | Wang Xiaorong~* Hong Xiangle~* * Department of Chemistry and Chemical Engineering,Foshan University,Foshan 528000 |
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| Abstract: | The paper demonstrated the techniques of electroless plating of Ni-Cu-P alloy and analysed the stability of the bath and the capability of the plating layer.A plat- ing layer containing 83.31% Ni,4.08% Cu and 8.59%P was obtained without any tiny holes.The adhesion and anti-corruption of the plating layer can reach 993.4HV after heat processing. |
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| Keywords: | electroless plating Ni-Cu-P alloy plating layer |
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