| Sn-8Zn-3Bi-P无铅钎料微观组织及性能 |
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| 引用本文： | 付小琴,周健,孙扬善,薛烽. Sn-8Zn-3Bi-P无铅钎料微观组织及性能[J]. 东南大学学报(自然科学版), 2006, 36(5): 831-835 |
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| 作者姓名： | 付小琴 周健 孙扬善 薛烽 |
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| 作者单位： | 东南大学材料科学与工程学院,南京,210096;东南大学材料科学与工程学院,南京,210096;东南大学材料科学与工程学院,南京,210096;东南大学材料科学与工程学院,南京,210096 |
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| 摘 要： | 研究了Sn-8Zn-3B i-xP钎料的抗氧化性、熔点、组织及力学性能.热重分析表明:P元素的加入显著降低了钎料熔体表面的氧化量;采用俄歇能谱分析氧化层的成分和厚度,发现含P的钎料表面形成的ZnO层厚度明显降低,约为80 nm;对合金进行差热分析发现少量P的加入并不改变钎料的熔点和熔程;P的加入对钎料合金的强度几乎没有影响,但却降低了合金的塑性,这是因为含P合金中有粗大的富Zn相形成,断口分析显示在Zn相与Sn相晶界上容易出现裂纹,从而导致钎料的塑性下降.
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| 关 键 词： | 无铅钎料 磷 抗氧化性能 力学性能 |
| 文章编号： | 1001-0505（2006）05-0831-05 |
| 收稿时间： | 2006-03-10 |
| 修稿时间： | 2006-03-10 |
Effect of phosphorus on microstructure and properties of Sn-8Zn-3Bi lead-free solder |
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| Fu Xiaoqin,Zhou Jian,Sun Yangshan,Xue Feng. Effect of phosphorus on microstructure and properties of Sn-8Zn-3Bi lead-free solder[J]. Journal of Southeast University(Natural Science Edition), 2006, 36(5): 831-835 |
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| Authors: | Fu Xiaoqin Zhou Jian Sun Yangshan Xue Feng |
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| Affiliation: | College of Materials Science and Engineering, Southeast University, Nanjing 210096, China |
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| Abstract: | The oxidation resistance,melting point,microstructures,and mechanical properties of Sn-8Zn-3Bi-xP solders were investigated.The results show that minute amount of phosphorus can significantly improve the oxidation resistance of Sn-8Zn-3Bi lead-free solders.Auger electron spectrometer(AES) analysis reveals that the depth of oxidation in Sn-8Zn-3Bi alloys can be reduced by adding a little phosphorus.With additional alloy element phosphorus,the depth of oxidation is about 80 nm.Small amount of phosphorus has no obvious influence on the melting point and the pasty range of Sn-8Zn-3Bi solders.The primary Zn phase appears in the matrix of P-contained alloys.Cracks are apt to occur along the interfaces of the primary Zn phase and Sn phase,which causes deterioration of elongation of the alloys. |
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| Keywords: | lead-free solder phosphorus oxidation resistance mechanical property |
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