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A resonant miniature electric field sensor using bulk-micromachining process

作者姓名：	DENG Kai XIA Shanhong GONG Chao PENG Chunrong TAO Hu BAI Qiang CHEN Shaofeng

作者单位：	State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China,State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China,State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China,State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China,State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China,State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China,State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100080, China

摘要：	A novel design of a resonant miniature electric field sensor based on microfabrication technology is proposed. The operating principles and specifications, the design structure, and the silicon-based bulk-micromachining fabrication process are presented. The finite element simulation shows that our design can obtain good results in device parameters setting, and its simplicity and low-cost features make it an attractive product for future applications.
关键词：	micro electro mechanical systems (MEMS) bulk-micromachining anodic bonding deep reactive ion etch

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