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半导体芯片紫外荧光无损检测
引用本文:王水凤,曾宇昕,姜乐.半导体芯片紫外荧光无损检测[J].韶关学院学报,2003,24(9):10-13.
作者姓名:王水凤  曾宇昕  姜乐
作者单位:1. 南昌大学,物理系,江西,南昌,330047
2. 南昌大学,材料科学与工程系,江西,南昌,330047
摘    要:Fe、Na、Ni等金属杂质对半导体器件芯片有严重的负面影响,往往导致器件失效,成品率下降,必须进行有效控制处理.采用紫外荧光(UVF)法可有效检测出硅晶片及半导体器件芯片(如GaP、GaAs等)的金属杂质沾污情况,还能检测金属杂质的相对沾污量,对半导体器件芯片的生产可实现实时非破坏性的检测分析.

关 键 词:半导体芯片  杂质沾污  无损检测  紫外荧光
文章编号:1007-5348(2003)09-0010-04
修稿时间:2002年11月11

Ultra-violet Fluorescence Nondestructive Detective on Semiconductor Chips
WANG Shui-feng,ZENG Yu-xin JIANG Le.Ultra-violet Fluorescence Nondestructive Detective on Semiconductor Chips[J].Journal of Shaoguan University(Social Science Edition),2003,24(9):10-13.
Authors:WANG Shui-feng  ZENG Yu-xin JIANG Le
Abstract:The contamination of metal impurities, such as Fe, Na, Ni, will do grave harm to the fabrication of semiconductor devices. It always result in the failure of the devices and low down the yield, care must be taken to deal with it. In this work, the method of Ultra-violet fluorescence (UVF) was adopted to analyse the impurities contamination on the silicon wafers and semiconductor chips (GaP, GaAs. et al.), and the relative amount of contamination also can be detected by UVF. The method of UVF is a real-time nondestructive analysis method to the manufacture of the semiconductor device.
Keywords:semiconductor chips  impurities contamination  nondestructive analysis  ultra-violet fluorescence
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