| 用俄歇电子谱法研究锡铅焊料的抗氧化机理 |
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| 引用本文： | 吴申庆,邵力为.用俄歇电子谱法研究锡铅焊料的抗氧化机理[J].东南大学学报(自然科学版),1989,19(4):74-79. |
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| 作者姓名： | 吴申庆 邵力为 |
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| 作者单位： | 东南大学材料科学与工程系，东南大学电子研究所，东南大学电子研究所，东南大学材料科学与工程系 |
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| 摘 要： |
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| 关 键 词： | 电子谱法 锡 铅 焊料 抗氧化 |
Mechanism of the Antioxidation of Sn-Pb Solder Analyzed with Auger Electron Spectrometry |
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| Wu Shenqing Shao Liwei Liu Jiemei Jiang Wenbiao.Mechanism of the Antioxidation of Sn-Pb Solder Analyzed with Auger Electron Spectrometry[J].Journal of Southeast University(Natural Science Edition),1989,19(4):74-79. |
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| Authors: | Wu Shenqing Shao Liwei Liu Jiemei Jiang Wenbiao |
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| Institution: | Department of Material Science & Engineering |
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| Abstract: | The free surface of cooled common Sn-Pb solder and antioxidable solder contained with trace Ga element were investigated by AES-350 Auger electron spectroscopy. The results show that on the surface of common solder the oxidized layer is continuously formed and grew as a result of enriching of Sn element, but on the surface of antioxidable solder, the enrichment of Ga is far stronger than that of Sn, and a protective film, which is less than 10 nm, is formed. The authors consider that in the protective film the ion vacancy increases and the specific electric conductivity of film reduces by the exist of Ga ion, which is the reason of yielding oxidation resistance. |
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| Keywords: | tin lead solder antioxidation Auger electron S spectrometers |
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